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IC Fabrication Overview Procedure of Silicon Wafer Production

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IC Fabrication Overview Procedure of Silicon Wafer Production. Raw material ― Polysilicon nuggets purified from sand. Si crystal ingot. Crystal pulling. Slicing into Si wafers using a diamond saw. A silicon wafer fabricated with microelectronic circuits.

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slide1
IC Fabrication Overview

Procedure of Silicon Wafer Production

Raw material ― Polysilicon nuggets purified from sand

Si crystal ingot

Crystal pulling

Slicing into Si wafers using a diamond saw

A silicon wafer fabricated with microelectronic circuits

Final wafer product after polishing, cleaning and inspection

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outline
OUTLINE
  • What is a Monolithic Integrated Circuit (IC)?
  • Dimensions
  • State-of-the-art in size and density
  • Materials
  • Basic process sequence
  • Photolithography
  • Define some key terms
  • Typical Device Cross-Sections
  • Packaging
  • Challenges and Opportunities in the Semiconductor Industry For EE Graduates
basic processing steps design then repeated application of

BASIC PROCESSING STEPSDesign ThenRepeated Application Of:

Oxidation and/orNitridation

Photolithography

Wet Etching (Chemical)

Dry Etching (Plasma)

Ion Implantation and/or Diffusion

Evaporation

Sputtering

Plasma Assisted Deposition

Epitaxy

Many Processing Steps are at temperatures to 1200°C

other devices and technologies
OTHER DEVICES AND TECHNOLOGIES

Thin-Film Transistors (TFT)

Displays-Liquid Crystal Displays (LCD), Plasma, LED Backlit, etc.

Photonic-Light Emitting Diodes (LED), Organic Light Emitting Diodes (OLED), LASERS, Optical Chips, etc.)

Photovoltaics-Conventional Crystalline and Flexible Thin-Film

Devices and Systems on Flexible Substrates

Micro-Electro-Mechanical Systems (MEMS) integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. Electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes)

Micromechanical components are fabricated using compatible "micromachining" processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices.

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