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Si/W Update

This update from March 1, 2004, outlines the progress of prototype detectors at the University of Oregon (UO). Each detector features 5 mm granularity with 757 pixels per wafer, optimized for bump-bonding to a readout chip. The UO test stand is fully operational for testing older detectors, utilizing electronics that mirror the SLAC design. SLAC expects to finalize the complete design for the readout chip prototype within a month, which is crucial for advancing the total energy capabilities in silicon detectors.

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Si/W Update

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  1. Si/W Update Mar 1, 2004 Oregon & SLAC • We have some (10) prototype detectors at UO • 5 mm granularity; 757 pixels per wafer • Designed for bump-bonding to a complete readout chip • UO test stand is working for old detectors • Test stand electronics is functionally same as SLAC design • Readout chip: SLAC expects a complete design for prototyping in about 1 month

  2. Total Energy in Si

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