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Forward Inner Module

Forward Inner Module. Bonding. Bonding errors on both sides - swapped bonds Corrected for on link 1 by swapping bonds at chip to fan-in and swapping them back at fan-in to detector

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Forward Inner Module

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  1. Forward Inner Module

  2. Bonding • Bonding errors on both sides - swapped bonds • Corrected for on link 1 by swapping bonds at chip to fan-in and swapping them back at fan-in to detector • Noticed too late for link 0 and every other channel swapped. Also both unbonded detector strips at one end on link 0 • HV bonded via fan-in to front side. Bond wire from fan-in glued to detector back side

  3. Current characteristics • IV characteristic measured 20C • Consistent with data in database at 150V • High current above 150V, reason not know • Note: Module now slightly dirty due to treatment (e.g. opto tests at liverpool/oxford)

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