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Thermal Analysis of Chip Design for Heat Dissipation Optimization

Conduct a comprehensive study on heat conduction in a chip design utilizing hand calculations, experimental data, and analytical analysis to ensure efficient cooling. Evaluate the thermal performance using temperature averages, confidence levels, and thermal conductivity for optimal heat dissipation. Explore the schematic components in the build for a detailed material breakdown.

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Thermal Analysis of Chip Design for Heat Dissipation Optimization

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  1. Outer Dimensions

  2. Weight of Components

  3. Heat Analysis – Hand Calculations • Conduction caused by air: • Section of chip 0.1” x 0.1” • A=6.45*10-6 m2 • Q= -KA (dT/dx) • QTotal=1.6W • QPart =1.6W/210 = 0.00762W • K= (about) 0.0257 Wm-1K-1 • dT/dx = Q/(-KA) • dT/dx = 0.00762/(0.0257*6.45*10-6) = 45969 degC/m =649 degF/in =64.9 degF/0.1in Air Chip

  4. Heat – Experimental Results Null hypothesis: Average temperature < 120 deg F 95% Confidence Alpha = 0.05 Mean=113.9 P-Value=1.00 Fail to reject null hypothesis

  5. Heat – Analytical Analysis Case thermal conductivity = 0.2 Wm-1K-1 Outside case temp set to 20 deg F Top of chip set to 130 deg F Bottom of chip insulated

  6. Schematic of Build (outer case)

  7. Schematic of Build (Battery)

  8. Schematic of Build (RFID)

  9. Schematic of Build (PCB)

  10. Schematic of Build (Keypad)

  11. Schematic of Build (Cover)

  12. Schematic of Build (Motor Case)

  13. P12015: Bill of Materials

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