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W ork P ackage S tructure

Implementing Manufacturing science solutions to increase equiPment pROductiVity and fab pErformance. (contact: francois.finck@st.com). B ackground. For European SC manufacturers, competitiveness means : to be able to product high quality nanoscale devices at a reasonable cost.

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W ork P ackage S tructure

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  1. Implementing Manufacturing science solutions to increase equiPment pROductiVity and fab pErformance (contact: francois.finck@st.com) Background For European SC manufacturers, competitiveness means : to be able to product high quality nanoscale devices at a reasonable cost. The concept of the project is to work on these two aspects by developing manufacturing solutions to improve the quality of the process while improving the production equipment effectiveness, taking into account that the Cost of Ownership of the equipment is the major contributor to the overall SC manufacturing cost. Main Objectives • To improve processes reproducibility • To improve the effectiveness of production equipment • To shorter cycles time • Solutions to Process Control Issues • Virtual metrology, dynamic control plan, data mining, data reduction, data / time synchronization • Solutions to improve Equipment Effectiveness • Predictive Maintenance, remote diagnostics, lots scheduling and resources planning Thanks to the development of Manufacturing Science solutions Leading to IMPROVE European fabs competiveness Partners A wide and strong consortium has been built to gather the necessary competencies and to represent different business and fab operation models. Consequently, the project will develop solutions that can easily be used in every manufacturing environment. 6 major European SC manufacturers: ATMEL (France), INTEL (Ireland), INFINEON (Germany, Austria), Austriamicrosystems (Austria), Numonyx (Italy), ST (France, Italy) 2 Institutes: FraunhoferG (Germany). LETI (France) 10 Solutions Providers: PDF Solutions , Probayes (France), Camline, ISYST , InReCon (Germany), Straatum , Lexas Research (Ireland), Techno Fittings, AP-Technologies, LAM (Italy), Critical SoftWare (Portugal) 12 Academic Labs: EMSE-CMPGC, GSCOP, LTM CNRS (France), LMU (München), FAPS-Erlangen (Germany), DCU-Dublin (Ireland), UNIPV, UNIMI, UNIPD, CNR E, CNR IMM (Italy), FH-WN-Wiener Neustadt (Austria) Work Package Structure • 3 R&D themes in 3 main Work Packages: • Virtual Metrology (Leader INTEL) • Predictive Equipment Behaviour / Predictive Maintenance (Leader INFINEON) • Dynamic Risk Assessment & Control Plan(Leader STMicroelctronics) • 3 "ancillary" Work Packages • Survey & Specification (Leader Fraunhofer) • Integration in Manufacturing Decision Systems (leader Numonyx) • Equipment Forum (Leader Fraunhofer) European Nanoelectronics Forum, November 17, 18 2009 Noordwijk, The Nederlands

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