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Explore the impact of Moore’s Law on modern instrumentation technology in this insightful presentation by Paul Packebush, Senior Group Manager of Corporate Metrology at National Instruments. Discover how the doubling of transistors on a chip every two years has led to advancements in memory affordability, processing speed, and programming languages. Dive into the evolution of modular instruments from 1980 to today, examining platforms like PXI, PXIe, and cRIO. Learn about the calibration, connectivity, and software development necessary for modern instrumentation systems.
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Moore’s Law and Modular Instrument Technology Speaker/Author:Paul Packebush Senior Group Manager Corporate Metrology, R&D National Instruments 11500 N MopacExpwy Austin, TX 78759
Moore’s Law: Alive and Well at Intel • Moore’s Law: the number of transistors on a chip roughly doubles every two years
Impact of Moore’s Law • Inexpensive memory • Higher speed processing • Rise of programming languages
Moore’s Law for Instrumentation 1980 1990 2000 2010 cRIO PXIe VXI
PXI Measurement CapabilityMore than 1,500 Instruments from 60+ Vendors NI PXI-4071 7½-digit FlexDMM NI PXI-5922, 24-bit, 15 MS/s 28 • Agilent 6030A, 15-bit, 500MHz 26 24 22 20 Resolution (Bits) 18 16 14 • Phase Matrix 26.5 GHz Signal Analyzer 12 10 8 6 10 1K 10K 100K 1 100 1M 10M 100M 1G 10G 100G Frequency (Hz)
Instrumentation Platform Operating System (OS) Instrument Module and I/O Instrument Driver Software Application Software Communication Bus Processing and Memory LabVIEW, C#, VB, etc. DLL, .NET, etc. PXIe, PCI, USB, Ethernet, etc. CPU, FPGA, etc. Modular Instrument Architecture
Instrument Modules • Modular Instruments are available in an array of form factors: • PXI/PXIe, Ethernet, PCI, USB, cPCI, AXIe,...
Instrument Platforms • Platforms required to calibrate modules are typically made up of a module specific chassis and controller • Costs of chassis and controllers can range from $1k to $20k
Connectivity • Small form factors require high density connectors • Semi-ridged and custom Module to Module connectivity
Example Calibration Station PCI, PCIe, PC Card Ethernet USB, Firewire, etc. Hybrid PXI/PXIe Chassis connected via MXI Other Instruments and Platforms USB GPIB Calibration standards or other DUTs
Instrument Driver – Traditional Mfg A Instrument 1 Calibration Software GPIB Driver Mfg A Instrument 2 Mfg B Instrument 1 Mfg B Instrument 2
Instrument Driver – Modular Instruments MFG A PXI Driver 1 Mfg A Instrument 1 Calibration Software MFG A PXI Driver 2 Mfg A Instrument 2 Mfg B Instrument 1 MFG B PXI Driver Mfg B Instrument 2
Vendor Supplied Application Software Soft Front Panel Off-the-Shelf Application Software
Custom Calibration Software • Instrument supplier must provide: • Clearly written calibration procedure • Required platforms and connectivity • Required calibration standards • Supported software development ADEs • Driver and configuration software • Driver capable of measurement adjustment • Software development support • Laboratory must have: • Software development skills • Development and verification process • Time
Modular Instrument Repair • Typical repair is only at the module level • Identify and replace damaged instrument module e.g. entire PXIe module • Circuit repair is often reserved for manufacturer • Requires custom test fixtures, software and stations • Minor maintenance is sometimes possible • Replace fuses • Cleaning fans
Instrumentation Platform Operating System (OS) Instrument Module and I/O Instrument Driver Software Application Software Communication Bus Processing and Memory LabVIEW, C#, VB, etc. DLL, .NET, etc. PXIe, PCI, USB, Ethernet, etc. CPU, FPGA, etc. Modular Instrument Architecture