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CMS Pre-Shower Status at NCU. A.C. Chen, Y.H. Chang, Apollo Go, W.T. Lin + 3 full time R.A.s + 5 engineers from ERSO and Miracle Tech. Co. Status of Silicon Production Bonding Stage Plans. Summary of IV/CV tests. Date batch# depth of n+ majority I@V>V fd
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CMS Pre-Shower Statusat NCU A.C. Chen, Y.H. Chang, Apollo Go, W.T. Lin + 3 full time R.A.s + 5 engineers from ERSO and Miracle Tech. Co. Status of Silicon Production Bonding Stage Plans
Summary of IV/CV tests Date batch# depth of n+ majority I@V>Vfd 6/5 cms01 14 mm 50-150 nA/strip 6/5 cms02 50-150 nA/strip 6/15 cms03 5 mm 100-150 nA/strip 6/18 cms04 50-100 nA/strip 6/18 cms053 mm 250-350 nA/strip 6/15 cms06 300-400 nA/strip • More than one strip have high leakage current that sensor • can not be accepted. • 20 accepted sensors : 17 from 03 and 04, 3 from 01 and 02 • 23oC, Cstrip=38 - 42 pF, Vfd= 80 - 120 V
Measurement of Wafers aluminum 10x10 mm2 window passivation • Thickness of wafer 325 mm • Al : 2 mm, oxide 1.5 mm • p+ 4.7 mm, n+ 5 mm Oxide p+ n+
Depth (mm) 4.7
2nd layer Thermal oxide 1 mm + PECVD field oxide 0.5 mm 3rd layer Aluminum 2 mm 4th and 5th PECVD Oxide and Nitride 0.5 and 0.7 mm
Status of Silicon Production • 4 batches of silicon wafers were delivered. • Starting from batch 51, size of window was changed to 10x10mm2 instead of 300x400mm2
Bonding Stage • New micro-stage has been installed and tested.
Plans • ERSO and Miracle engineers are trying to improve the yield. If the yield is higher then 30%, then ERSO will start mass production. • Plan to deliver all the 1,200 wafers in 6 months. We expect to start in early 2003. • Keep the bonding stage alive.