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Swiss Consortium

Swiss Consortium. June 2012. Divertor Cassette for ITER. Swiss Consortium. RUAG Aerospace – Defence – Technology. HBB Biegetechnik Core: Piping. Lehner AG Core: Welding. RUAG Mechanical AG Core: Machining. Bending & Welding Tube diameter 2 mm – 115 mm

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Swiss Consortium

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  1. Swiss Consortium June 2012 Divertor Cassette for ITER

  2. Swiss Consortium RUAG Aerospace – Defence – Technology HBB Biegetechnik Core: Piping Lehner AG Core: Welding RUAG Mechanical AG Core: Machining

  3. Bending & Welding Tube diameter 2 mm – 115 mm Stainless steel, steel, aluminium, copper, brass Cross-section max. B 100 mm x H 150 mm x 3,5 mm Aluminium cross-section max. B 100 mm x H 150 mm x 5 mm HBB Biegetechnik Agenda

  4. HBB Biegetechnik Branch of industries •Railway •Automotive •Transport systems •Aircraft •Industry •Metal construction Agenda May 2012 3

  5. EngineeringExpertise Locksmith‘s, Assembly and Welding shop Machining Service Lehner AG • 3 CAD Stationen, Inventor /Catia • Project leader, Ing ETH/HTL, Physiker, Chemiker • Cran up to 50 To • C-Steel / CrNi-Steel welding area • Door b x h 448 x 475 cm • 15 000 m/2 Production place • Machines up to bis 10‘000 mm lane • See maschine liste (www.lehnerag.ch) • Deliveries in 24 hours • Own truck • Flexibel in changes • Integrated ERP System “pro alpha”

  6. Lehner AG

  7. Lehner AG

  8. RUAG Mechanical AG Market segment Semiconductor Energy Machinery & Equipment Manufacturers • Frames • Carrier structures • Inner & outer rings • Flanges • Torque Arms • Tool machine elementshousings, carriers, frames • Space components Main Products • ASML • Esec • Siemens • ZF Windpower (Hansen) • Krauss Maffei Technologies (Netstal); Mikron, Schuler, Reishauer • Voith, Caterpillar • RUAG Space Key Clients • Focus on niche products with a leading position in machining of high-precision large parts

  9. Market Segment Semiconductor Key Client Example: ASML • ASML is largest customer of Mechanical Engineering • Collaboration exists for more than 10 years • Both companies work very close together and ASML appreciates support provided by Mechanical Engineering in the development of new products, for example its process engineering input • Main products: • Carrier frame: for lithography system TwinScan NXT (steel welded, machined and assembled) • Wafer stage, metro frame: for lithography system TwinScan NXT (aluminium machined and pre-assembled) • Wafer stage, metro frame (WSMF) & main body, bottom frame (MBBF): for new Extreme Ultraviolet (EUV) technology (WSMF machined in aluminium, MBBF welded in aluminium and machined) – sole development partner for EUV parts • Titan carrier structure: upgrade module for high performance (in titanium, machined) • Main activity is production of highly precise main frame carriers for ASML • Close and long-term partnership with ASML, incl. development support during R&D / prototype phase

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