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Progress of the Forward Calorimeter R&D

Progress of the Forward Calorimeter R&D. Presented by: Igor Emeliantchik. Progress of the Forward Calorimeter R&D. LCAL Status D iamond- T ungsten Version Results of Zeuthen Group First Results of Minsk Group Heavy Crystal Version LAT Status Silicon Sensors Results of Prague Group

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Progress of the Forward Calorimeter R&D

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  1. Progress of the Forward Calorimeter R&D Presented by: Igor Emeliantchik

  2. Progress of the Forward Calorimeter R&D • LCAL Status • Diamond-Tungsten Version • Results of Zeuthen Group • First Results of Minsk Group • Heavy Crystal Version • LAT Status • Silicon Sensors • Results of Prague Group • Zeuthen Silicon Facilities • Laser measurement of the LATdetector displacement

  3. Diamond Measurements by Minsk Group

  4. Test Setup Heavy Crystal Version of LCAL Cosmic Telescope Alternative: Ru-Source

  5. Lightyield fiber readout direct readout ~ 25 %

  6. Cross Talk fiber painted with black paint How much light do fibers see from other crystals

  7. Cross Talk cosmics ? but ….

  8. Preprototype Silicon Sensors (Prague) Sensor Structure Cross section Bottom view Active area cca 0.25 cm2

  9. I-V curves: Vbreak-down  Vop Ileak @ Vop < cca 30 nA/cm2 nornalized for temperature 20 C

  10. used frequency 10 kHz Vfull-depletion: substrate resistivity calculation

  11. Zeuthen Silicon Facilities • At DESYZeuthen we are able to perform (class 10k clean room): • Ultrasonic wire bonding (Au, Al, down to 17.5 µm wires) • Glueing with high mechanical precision and/or special hardening procedures (silver epoxies) • Measurements of single and double sided sensors on different probe stations • long term measurements (darkness, special atmosphere: N2 or similar) • chip testing (delivered probe cards can be adapted) • additional: electronics workshop with automatic SMD placement and soldering tools • mechanical workshop with NC machining/milling • at DESY Hamburg a ‘state of the art’ programmable wire bonder • Companies / Institutions we are used to work with: • - Sensors: CiS Erfurt (D), Micron Ltd. (UK), SINTEF Oslo (N), Hamamatsu (J) • chip design: IDE AS, Oslo (N) and ASIC Laboratory of University of Heidelberg (D) • probe cards: Wentworth Deutschland GmbH, München (D) • high precision printed circuit boards: Würth GmbH, Roth am See (D), Optiprint (CH) • thick film hybrids: Elbau GmbH, Berlin (D) Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003

  12. Position Measurement with Laser and CCD Camera (Cracow)

  13. Position measurement

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