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ECE 477 Final Presentation Team 6  Spring 2010

ECE 477 Final Presentation Team 6  Spring 2010. Digital Sound Projection. Outline. Project overview DSP Algorithm overview Block diagram Design challenges Individual contributions Project demonstration Questions / discussion. Project Overview.

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ECE 477 Final Presentation Team 6  Spring 2010

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  1. ECE 477 Final Presentation Team 6  Spring 2010 Digital Sound Projection

  2. Outline • Project overview • DSP Algorithm overview • Block diagram • Design challenges • Individual contributions • Project demonstration • Questions / discussion

  3. Project Overview • A high quality wireless audio transceiver system • Battery powered transmitter • Receiver base to process and output audio • Digital signal processing (DSP) • Digital EQ • Digital Mute (Voice enhancement)

  4. DSP Algorithm Overview • Digital Mute • Enhance the contrast of human voice • Selectively adjust the amplitude of human voice harmonics • Equalization Effects • Adjust the amplitudes of 11 different frequency bands

  5. System Level Block Diagram

  6. Transmitter Block Diagram

  7. Receiver Block Diagram

  8. Design Challenges Faced • Analog Circuitry for High Fidelity Audio • Differential (balanced) signaling • Eliminating power supply noise • Signal Processing • Real-time constraints • Memory size constraints and organization • Mixed signal environment

  9. Design Challenges Faced • Heat Dissipation From Power Circuitry • High voltage drop with large current (1.5A+) • ADSP-21262 core consumes around 800mA. • Linear regulators generate too much heat.

  10. Design Challenges Faced • PCB Design • Large number of integrated circuits • Area constraints • Power and ground trace routing • Receiver required 4 layer design

  11. Individual Contributions • Team Leader – Mike Goldfarb • Team Member 2 – Steve Anderson • Team Member 3 – Shao-Fu Shih • Team Member 4 – Josh Smith

  12. Team Leader – Mike Goldfarb • Component Selection • Provided guidance to team on interfacing requirements • Microcontroller and DSP selection • Software / Hardware Interfacing • DSP implementation • Device drivers • Digital hardware prototyping and debugging

  13. Member 2 – Steve Anderson • Receiver Schematics • PCB decals • Receiver PCB layout • 2 layer board  4 layer board • Receiver Boards verification • Continuity test • Component soldering • Packaging Design

  14. Member 3 – Shao-Fu Shih • DSP Algorithm development and simulation • Overlap-save method • Frequency analysis • Analog circuitry design • Power circuitry design and filtering • Differential audio circuitry design • Analog hardware prototyping and debugging • IC soldering • Packaging design

  15. Member 4 – Josh Smith • Transmitter PCB • Custom component footprints • PCB Schematic • PCB Layout/Routing • Verification and continuity testing • Component soldering • Packaging design

  16. Project Demonstration • An ability to display information to the user on an LCD about the status of the device. • An ability to wirelessly transmit and receive a digital audio signal. • An ability to control output volume wirelessly from the transmitter. • An ability to allow the user to adjust EQ effects applied to audio signals. • An ability to apply digital mute to the audio signals based on a threshold.

  17. Project Demonstration

  18. Questions / Discussion

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