System-in-Package Technology Market Opportunities and Forecasts, 2014- 2022 Pages: 226 Published: 2016
SYSTEM IN PACKAGE TECHNOLOGY MARKET “System in packaging (SiP) technology is a mixture of various integrated circuits in a compact size to enable reduction of power consumption. Moreover, they offer numerous benefits, such as high efficiency, low system complexity, and reduced system maintenance. 2.5-D IC Packaging represents almost 40% of the total SiP market, owing to its resilience and high efficiency. In addition, substantial demand for electronics applications and trend of customer shift towards advanced IC packaging to achieve better efficiency are expected to fuel its adoption in the consumer electronics, telecommunication, and other industry sectors. JeshinJayamon
SYSTEM IN PACKAGE TECHNOLOGY MARKETOVERVIEW • System in Package (SiP) Technology Market report, published by Allied Market Research, forecasts that the global market is expected to garner $30 billion by 2022, registering a CAGR of 9% during the period 2016 - 2022. • Asia-Pacific dominates the global market in terms of revenue, accounting for more than 50% share of the global market, followed by North America. • SiP Technology is widely used across the applications such as consumer electronics, telecommunication, and automotive. • Presently, rise in demand for portable electronic devices and adoption of SiP in graphic cards and processors are some factors that majorly drive the market. • Read more at : https://www.alliedmarketresearch.com/system-in-package-technology-market
SYSTEM IN PACKAGE TECHNOLOGY MARKET KEY BENEFITS • The study provides an in-depth analysis of the global SiP technology market to elucidate the prominent investment pockets. • Current trends and future estimations are outlined to determine the overall attractiveness, and single out profitable trends to gain a stronger foothold in the market. • The report provides information regarding key drivers, restraints, and opportunities along with their impact analyses. • The market is analyzed based on various regions, namely, North America, Europe, Asia-Pacific, and LAMEA. • Value chain analysis of the market enables better understanding of the roles of intermediaries in the production processes.
SYSTEM IN PACKAGE TECHNOLOGY MARKET KEY FINDINGS • In 2014, 2.5-D IC Packaging segment dominated the global SiP market in terms of revenue, and is projected to grow at a CAGR of 9.3% during the forecast period. • Flat Packages segment dominates the global SiP market, accounting for about 32% share in 2014. • Flip Chip segment is expected to exhibit the fastest growth during the forecast period, owing to increase in applications such as computers and smart phones. • China is the major shareholder in the Asia-Pacific SiP market, accounting for about 42% share.
KEY PLAYERS IN INDUSTRY • Amkor Technology Inc. • Fujitsu Ltd. • Toshiba Corporation • Qualcomm Incorporated • RenesasElectronics Corporation • Samsung Electronics Co Ltd • Jiangsu Changjiang Electronics Technology Co., Ltd. • ChipMOSTechnologies Inc. • PowertechTechnologies Inc. • ASE Group • Download Sample Report : • https://www.alliedmarketresearch.com/request-free-sample/1827
SYSTEM IN PACKAGE TECHNOLOGY MARKET BY GEOGRAPHY • North America, Europe, Asia-Pacific, LAMEA
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