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Efficient Cooling System Using Peltier Devices for Heat Transfer

Learn about the setup involving Bismuth Telluride cubes and stainless steel plates for effective heat dissipation. Explore the use of thermal grease and coolant circulation for optimal cooling performance and heat management. Analysis on time constants and transient conduction.

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Efficient Cooling System Using Peltier Devices for Heat Transfer

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  1. David Jones and Michael Wilcox Peltier Devices http://www.penguinslab.com/peltier.htm

  2. Basic Function • Bismuth Telluride cubes carry heat from one direction to the other • Charge comes from DC Voltage Hot Side Cool Side

  3. ΔT is the most important • Increase in Voltage => Increase in ΔT • At 12 V => ΔT = 51˚C • Current heat load = 0W • Thot,spec chart = 35˚C, Tcool,spec chart = -16˚C

  4. Current Setup Coolant runs between radiator and peltier devices. Two Peltier Devices connected to stainless steel plates

  5. Current Setup • Coolant is used to keep the Thot down (Troom) • Pumped through a fan-cooled radiator • Coolant used for anti-rust, anti-mold, increased heat dissipation • Stainless Steel used • Easily cleaned • Resistant to Rusting • Holds Heat Well • Stainless Steel: k=14.9 W/m*K

  6. Current Setup • Thermal grease used to bridge the gap • Stainless Steel • @10,000 kN/m2, R=.7-4.0 x10-4 m2*K/W • Thermal grease (@ 3500kN/m2), R=.04 x10-4 m2*K/W Stainless Copper

  7. Purpose • Measure time constant (τ) to reach steady state • Cooling • τ = 86s • Return to Troom • τ = 98.8s

  8. Analysis (Cooling only) Basic Assumption: 1-D Transient Conduction Governing Equation: Temperature Distribution: Additional Assumptions: • h = 300 W/(m^2*K) • Peltier device neglected, except • Device modeled by using T∞= Ti - ΔT = -27˚C

  9. Analysis (Cooling only) • Time constant: τ = 89.9s

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