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Stave 2009 General Mtg 15 Jan 2010

Stave 2009 General Mtg 15 Jan 2010. Carl Haber. General. Minutes sent out for Dec 11 and 21 meetings – comments? Dec HSIO working meeting completed and notes sent out with Dec 21 minutes, work continues on ABCn firmware etc Stavelet assembly and gluing tests complete or underway

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Stave 2009 General Mtg 15 Jan 2010

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  1. Stave 2009General Mtg15 Jan 2010 Carl Haber

  2. General • Minutes sent out for Dec 11 and 21 meetings – comments? • Dec HSIO working meeting completed and notes sent out with Dec 21 minutes, work continues on ABCn firmware etc • Stavelet assembly and gluing tests complete or underway • (All?) Replies received on HSIO systems requested, funding mechanism under consideration

  3. Questions from Martin G Will the US be supplying a ‘kit’ of bits to fit onto the basic carbon plank with kapton. Namely the BCC or equivalent) boards and Power Protection Boards along with the modules and End Of Stave card? YES Will the US be supplying a ‘special’ wire bonding diagram? YES Is there a drawing (with micron type numbers) that defines just where the modules should be on a stave with respect to the stave and module datums? THIS SHOULD COME FROM BNL/YALE and/or LIVERPOOL

  4. BCC-EOS docs for Didier • Documents include • BCC board layout and schematic • BCC test board and schematic, this board interfaces to a Xilinx Spartan FPGA evaluation board • BCC documents • EIF thesis which documents BCC test system • EOS schematic and layout (in fnal layout) • EOS to HSIO interface card (in final layout) • Hardware • BCC board and test boards can be ordered • EOS and interface • Spartan board is about $300 • Software • BCC test system VHDL and LabView control framework

  5. BCC Status • In December we reported inconsistency in BCC test results • Since then we have built a dozen more revised test boards and now see much more consistent positive performance from the BCC – mostly passing all tests • A new BCC design(s) meant to address the AC coupled clock initialization is ready and will be submitted on Monday 18 Jan, 120 parts • Additional (old) BCC can be ordered from the on-the-shelf inventory

  6. Metrology • This is an open question left from the discussions of December • What metrology capabilities could we get for stave-09 at CERN? • Status of any possibilities from the UK?

  7. EOS • Layout nearly complete • Interface card in similar state

  8. SOIC 16 package Samtec FTSH-125-01-L-DV 5.56 mm height With cable on top will be 7.58 mm 7343 SMD package 8.23 mm height

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