ipc jedec industry mapping n.
Skip this Video
Loading SlideShow in 5 Seconds..
Download Presentation


508 Views Download Presentation
Download Presentation


- - - - - - - - - - - - - - - - - - - - - - - - - - - E N D - - - - - - - - - - - - - - - - - - - - - - - - - - -
Presentation Transcript

  1. IPC/JEDEC INDUSTRY MAPPING Agenda Item 6.2 4th JIC meeting Regensburg, Germany June 17, 2003

  2. Minimum IPC Standards Tool Kit


  4. IPC STANDARDS MAP (cont.)

  5. ASSEMBLY • J-STD-001 Soldering Electrical and Electronic Assemblies • IPC-HDBK-001 Handbook & Guide to Supplement J-STD-001 • IPC-9261 In-Process DPMO and Estimated Yield for PWAs • IPC-7912 Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies

  6. IPC-DRM-40 Through-Hole Solder Joint Evaluation Desk Reference Manual IPC-A-610 Acceptability of Electronic Assemblies IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) IPC-DRM-SMT Surface Mount Solder Joint Evaluation Desk Reference Manual ACCEPTANCE

  7. IPC-WP-001 Soldering Capability White Paper Report J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires J-STD-003 Solderability Tests for Printed Boards IPC-WP-005 PWB Surface Finishes IPC-TR-461 Solderability Evaluation of Thick & Thin Fused Coatings IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-Term Storage SOLDERABILITY

  8. IPC-TR-464 Accelerated Aging for Solderability Evaluations IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase 11A IPC-TR-466 Wetting Balance Standard Weight Comparison Test SOLDERABILITY (cont.)

  9. IPC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology IPC-WP-003 Chip Mounting Technology J-STD-012 Implementation of Flip Chip and Chip Scale Technology J-STD-013 Implementation of Ball Grid Array & Other High Density Technology J-STD-026 Semiconductor Design Standard for Flip Chip Applications J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation IPC-MC-790 Guidelines for Multichip Module Technology Utilization ADVANCED

  10. IPC-WHMA-A-620 Requirements & Acceptance for Cable & Wire Harness Assemblies WIRE HARNESS

  11. IPC-0040 Optoelectronic Assembly and Packaging Technology OPTOELECTRONICS

  12. SMC-WP-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires IPC-DRM-18 Component Identification Desk Reference Manual IPC-DW-426 Specification for Assembly of Discrete Wiring IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC-TA-722 Technology Assessment Handbook on Soldering IPC-TA-723 Technology Assessment Handbook on Surface Mounting IPC-CM-770 Component Mounting Guidelines for Printed Boards ASSEMBLY SUPPORT

  13. IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments IPC-S-816 SMT Process Guideline & Checklist IPC-AJ-820 Assembly & Joining Handbook IPC-TP-1115 Selection and Implementation Strategy for A Low-Residue No-Clean Process IPC-1720 Assembly Qualification Profile ASSEMBLY SUPPORT(cont.)

  14. IPC-7095 Design and Assembly Process Implementation for BGA's IPC-7525 Stencil Design Guidelines IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes IPC-7711 Rework of Electronic Assemblies IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments IPC-9851 Equipment Interface Specification ASSEMBLY SUPPORT(cont.)

  15. J-STD-004 Requirements for Soldering Fluxes J-STD-005 Requirements for Soldering Pastes J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders IPC-TP-1043 IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1 IPC-TP-1044 IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2 ASSEMBLY MATERIALS FLUX/SOLDER

  16. IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives IPC-CA-821 General Requirements for Thermally Conductive Adhesives IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films ASSEMBLY MATERIALS (cont.) ADHESIVES

  17. IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies IPC-HDBK-830 Guidelines for Design, Selection and Application of Conformal Coatings IPC-SM-840 Qualification and Performance of Permanent Solder Mask ASSEMBLY MATERIALS (cont.) COAT/MASK

  18. PCB / ACCEPTANCE • IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards • IPC-QE-605 Printed Board Quality Evaluation Handbook • IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards • IPC-MC-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards • IPC-1710 OEM Standard for Printed Board Manufacturers'Qualification Profile (MQP)

  19. IPC-6011 Generic Performance Specification for Printed Boards IPC-6012 Qualification and Performance Specification for Rigid Printed Boards IPC-6013 Qualification & Performance Specification for Flexible Printed Boards IPC-6015 Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards IPC-6018 Microwave End Product Board Inspection and Test PCB / ACCEPTANCE (cont.)

  20. IPC/JPCA-6202 Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA-6801 Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards IPC-A-600 Acceptability of Printed Boards PCB / ACCEPTANCE (cont.)

  21. COMPONENTS • J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices • J-STD-032 Performance Standard for Ball Grid Array Balls • J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices • J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

  22. COMPONENTS (cont.) • IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components • IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components • IPC-9503 Moisture Sensitivity Classification for Non-IC Components • IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

  23. CLEANING/ CLEANLINESS • IPC-SC-60 Post Solder Solvent Cleaning Handbook • IPC-SA-61 Post Solder Semi-Aqueous Cleaning Handbook • IPC-AC-62 Aqueous Post Solder Cleaning Handbook • IPC-CH-65 Guidelines for Cleaning of Printed Boards & Assemblies • IPC-TR-468 Factors Affecting Insulation Resistance Performance of Printed Boards • IPC-TR-476 Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

  24. CLEANING/ CLEANLINESS (cont.) • IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results • IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study • IPC-TR-582 Cleaning & Cleanliness Test Program for: Phase 3-Low Solids Fluxes & Pastes Processed in Ambient Air • IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing • IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines • IPC-9201 Surface Insulation Resistance Handbook

  25. LAMINATE FLEX • IPC-FC-234 PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits • IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry • IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films • IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry • IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

  26. RIGID IPC-4101 Specifications for Base Materials for Rigid and Multilayer Printed Boards IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications IPC-1730 Laminator Qualification Profile HDI IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials IPC-SM-840 Qualification and Performance of Permanent Solder Mask LAMINATE (cont.)

  27. LAMINATE (cont.) FOIL • IPC-CF-148 Resin Coated Metal for Printed Boards • IPC-CF-152 Composite Metallic Materials Specification for Printed Wiring Boards • IPC-1731 Strategic Raw Materials Supplier Qualification Profile • IPC-4562 Metal Foil for Printed Wiring Applications

  28. FABRICATION • IPC-DR-570 General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards • IPC-DR-572 Drilling Guidelines for Printed Boards • IPC-OI-645 Standard for Visual Optical Inspection Aids • IPC-TA-724 Technology Assessment Series on Clean Rooms • IPC-PE-740 Troubleshooting for Printed Board Manufacture and Assembly

  29. REINFORCEMENT • IPC-4412 Specification for Finished Fabric Woven from "E" Glass for Printed Boards • IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards • IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards • IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards • IPC-1731 Strategic Raw Materials Supplier Qualification Profile

  30. REINFORCEMENT (cont.) • IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards • IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications • IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass Mat • IPC-4411 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement

  31. ASSEMBLY • IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies • IPC-D-326 Information Requirements for Manufacturing Electronic Assemblies • IPC-C-406 Design & Application Guidelines for Surface Mount Applications Connectors • IPC-C-408 Design & Application Guidelines for the Use of Solderless Surface Mount Connectors • IPC-SM-782 Surface Mount Design & Land Pattern Standard

  32. INTERFACES • IPC-D-310 Guidelines for Phototool Generation and Measurement Techniques • IPC-A-311 Process Controls for Phototool Generation and Use • IPC-D-350 Printed Board Description in Digital Form • IPC-D-351 Printed Board Drawings in Digital Form • IPC-D-356 Bare Substrate Electrical Test Data Format • IPC-D-390 Automated Design Guidelines

  33. INTERFACES • IPC-2511 Generic Requirements for Implementation of Product Mfg. Description Data & Transfer Methodology • IPC-2531 Standard Recipe File Format Specification • IPC-2541 Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX) • IPC-2571 Generic Requirements for Electronics Mfg. Supply Chain Communication - Product Data eXchange (PDX)

  34. PCB • SMC-WP-004 Design for Success • IPC-2252 Design Guide for RF/Microwave Circuit Boards • IPC-D-317 Design Guidelines for Electronic Packaging Utilizing High Speed Techniques • IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits • IPC-1902 Grid Systems for Printed Circuits • IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design

  35. IPC-2221 Generic Standard on Printed Board Design IPC-2222 Sectional Standard on Rigid Organic Printed Boards IPC-2223 Sectional Design Standard for Flexible Printed Boards IPC-2224 Sectional Standard of Design of PWB for PC Cards IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies IPC-2315 Design Guide for High Density Interconnects & Microvias IPC-2615 Printed Board Dimensions and Tolerances PCB (cont.)

  36. JEDEC: IEC PAS ACTIVITY • EIA/JESD22-B102C • 47/1446/PAS IEC 62173 Ed. 1: • Solderability test method • JESD22-B106-B • 47/1447/PAS: IEC 60749-15, Ed. 1: • Resistance to soldering temperature for through-hole mounted devices • EIA/JESD-22-B107-A • 47/1448/PAS: IEC 62175, Ed. 1: • Marking Permanency • 47/1629/MCR: Published as part of IEC 60749-9, Ed. 1 • EIA/JESD22-B116 • 47/1449/PAS: IEC 62176, Ed. 1: • Wire bond shear test method • 47/1482A/RVD Withdrawal of 47/1449/PAS

  37. JEDEC: IEC PAS ACTIVITY • JESD22-A110B-B • 47/1450/PAS: IEC 62177, Ed. 1: • Highly-accelerated temperature and humidity stress test (HAST) • 47/1627/MCR Published as part of IEC 60749-4, Ed. 1 • JESD22-A104-A • 47/1451/PAS: IEC 62178, Ed. 1: • Temperature cycling • EIA/JESD22-A114-A • 47/1452/PAS: IEC 62179, Ed. 1: • Electrostatic discharge (ESD) sensitivity testing human body model (HBM) • EIA/JESD22-A115-A • 47/1453/PAS: IEC 62180, Ed. 1: • Electrostatic discharge (ESD) sensitivity testing machine model (MM)

  38. JEDEC: IEC PAS ACTIVITY • JESD78 • 47/1454/PAS: IEC 62181, Ed. 1: • IC latch-up test • JESD22-A113-B • 47/1455/PAS: IEC 62182, Ed. 1: • Preconditioning of nonhermetic surface mount devices prior to reliability testing • JESD22-A107-A • 47/1456/PAS: IEC 62183, Ed. 1: • Salt atmosphere • 47/1633/MCR: Published as part of IEC 60749-13, Ed. 1 • JESD22-B105-B • 47/1457/PAS: IEC 62184, Ed. 1: • Lead integrity

  39. JEDEC: IEC PAS ACTIVITY • JESD22-A106-A • 47/1458/PAS: IEC 62185, Ed. 1: • Thermal shock • 47/1631/MCR: Published as part of IEC 60749-11, Ed. 1 • JESD22-B104-A • 47/1459/PAS: IEC 62186, Ed. 1: • Mechanical shock • 47/1630/MCR: Published as part of IEC 60749-10. Ed. 1 • JESD22-B103-A • 47/1460/PAS: IEC 62187, Ed. 1: • A vibration, variable frequency • 47/1632/MCR: Published as part of IEC 60749-12, Ed. 1 • JESD22-A101-B • 47/1461/PAS: IEC 62161, Ed.1: • Test method A101-B – Steady state temperature humidity bias life test • 47/1680/MCR: Published as IEC 60749-5, Ed. 1

  40. JEDEC: IEC PAS ACTIVITY • JESD22-C101 • 47/1462/PAS: IEC 60749-28, Ed. 1: • Test method C101 – Electrostatic Discharge (ESD) Sensitivity Testing – Charged device model (CDM) • JESD22-B101 • 47/1463/PAS: IEC 62163, Ed. 1: • Test method B101 – External Visual • 47/1626/MCR: Published as part of IEC 60749-3, Ed. 1 • JEP118 • 47/1464/PAS: IEC 62164, Ed. 1: • Guidelines for GaAs MMIC and FET life testing • JEP110 • 47/1465/PAS: IEC 62165, Ed. 1: • Guidelines for the measurement of thermal resistance of GaAs FETs • EIA/JESD46-A • 47/1466/PAS: IEC 62166, Ed. 1: • Guidelines for user notification of product/process changes by semiconductor suppliers

  41. JEDEC: IEC PAS ACTIVITY • EIA/JESD48 • 47/1467/PAS: IEC 62167, Ed. 1: • Product discontinuance • JEP 113-B • 47/1468/PAS: IEC 62168, Ed. 1: • Symbols and labels for moisture-sensitive devices • IPC/JEDEC J-STD-033 • 47/1469/PAS: IEC 62169, Ed. 1: • Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices • EIA/JESD59 • 47/1470/PAS: IEC 62170, Ed. 1: • Bond wire modeling standard • JEP114 • 47/1471/PAS: IEC 62171, Ed. 1: • Guidelines for particle impact noise detection (PIND) testing, operator training and certification • 47/1681/MCR: Published as 60749-16, Ed. 1

  42. JEDEC: IEC PAS ACTIVITY • JESD22-A102-B • 47/1472/PAS: IEC 62172, Ed. 1: • Accelerated moisture resistance – Unbiased autoclave • JESD22-A108-A • 47/1474/PAS: IEC 62189, Ed. 1: • Bias Life • J-STD-020A (IPC/JEDEC) • 47/1475/PAS: IEC 62190, Ed. 1: • Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices • 47/1592/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 (2001-10) and IEC 60749, Ed. 2.2 (2001-12). • J-STD-035 • 47/1476/PAS: IEC 62191, Ed. 1: • Acoustic microscopy for nonhermetic encapsulated electronic components • 47/1593/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 (2001-10) and by IEC 60749, Ed. 2.2 (2001-12)

  43. JEDEC: IEC PAS ACTIVITY • JEP119 • 47/1506/PAS: IEC 62201, Ed. 1: • A procedure for executing sweat • EIA/JEP122 • 47/1507/PAS: IEC 62202, Ed. 1: • Failure mechanisms and models for silicon semiconductor devices • EIA/JEP128 • 47/1508/PAS: IEC 62203, Ed. 1: • Guide for standard probe pad sizes and layouts for wafer-level electrical testing • EIA/JESD33-A • 47/1509/PAS: IEC 62204, Ed. 1: • Measuring and using the temperature coefficient of resistance to determine the temperature of a metallization line • JESD-A103-A • 47/1513/PAS: IEC 60749-6 Ed. 1: • High temperature storage life • 47/1628/MCR: Published as part of IEC 60749-6, Ed. 1

  44. JEDEC: IEC PAS ACTIVITY • EIA/JESD22-A105-B • 47/1514/PAS: IEC 62206, Ed. 1: • Test Method A105-B – Power and temperature cycling • JESD22-A109 • 47/1515/PAS: IEC 62207, Ed. 1: • Test Method A109 – Hermeticity • 47/1594/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 (2001-10) and by IEC 60749, Ed. 2.2 (2001-12) • JESD22-A120 • 47/1595/PAS: IEC 62307 • Test Method for the Measurement of Moisture Diffusivity and Water Solubility in organic Materials Used in Integrated Circuits • JESD22-A118 • 47/1635/PAS: IEC PAS 62336: • Accelerated Moisture Resistance – Unbiased HAST

  45. IPC: IEC PAS ACTIVITY • IPC-EIA/J-STD-012 • IEC/PAS 62084 • Flip chip and chip scale technology implementation • IPC-EIA/J-STD-013 • IEC/PAS 62085 • Implementation of ball grid array and other high density technology • IPC-2511 • IEC/PAS 62119 • Generic requirements for implementation of product manufacturing description data and transfer methodology • IPC-6202 • IEC/PAS 62123 Ed. 1.0 • Performance guide Manual for single- and double-sided flexible printed wiring boards • IPC-4130 • IEC/PAS 62212 • Specification and characterization methods for nonwoven "E" glass mat

  46. IPC: IEC PAS ACTIVITY • IPC-4411 • IEC/PAS 62213 • Specification and characterization methods for nonwoven para-aramid reinforcement • IPC-6011 • IEC/PAS 62214 • Generic performance specification for printed boards • IPC-1710 • IEC/PAS 62158 Ed. 1.0 • Manufacturers qualification profile (MQP) • IPC-1720 • IEC/PAS 62159 Ed. 1.0 • Assembly qualification profile (AQP)

  47. IPC: IEC PAS ACTIVITY • IPC-1730 • IEC/PAS 62160 Ed. 1.0 • Laminator qualification profile • IPC-6013 (with amendment) • IEC/PAS 62249 /ED, 1,9 • Qualification and performance specification for flexible printed boards • IPC-6012 (with amendment) • IEC/PAS 62250 • Qualification and performance specification for rigid printed boards