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Magnetic RAM: The Universal Memory

Magnetic RAM: The Universal Memory. Introduction Historical perspective Technical Description Challenges Principals Market impacts Summary. Overview. Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary. Non-volatile

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Magnetic RAM: The Universal Memory

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  1. Magnetic RAM: The Universal Memory

  2. Introduction Historical perspective Technical Description Challenges Principals Market impacts Summary Overview Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary

  3. Non-volatile Information is saved even when there is no power Immediate boot up No need to wait for your computer to boot up MRAM, SRAM and DRAM MRAM is potentially capable of replacing both DRAM, SRAM and many advantages over technology currently used in electronic devices Introduction Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary

  4. DRAM Advantages: cheap Disadvantages: Comparatively slow and loses data when power is off SRAM Advantages: fast Disadvantages: cost up to 4 times as much as DRAM loses data when power is off Flash memory Advantages: save data when power is off Disadvantages: saving data is slow and use lot of power Introduction Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary

  5. Historical Overview Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • Why MRAM Became an Important Research Topic • Universal Memory (Computing & Electronics) • “Instant-On” Computing • Read & Write to Memory Faster • Reduced Power Consumption • Save Data in Case of a Power Failure • Modern MRAM Technology Emerged from Several Technologies : • Magnetic Core Memory • Magnetoresistive RAM • Giant Magnetoresistance

  6. Magnetic Core Memory Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • In 1953 a team at MIT called Whirlwind introduced the magnetic core memory • Magnetic core memory utilized arrays of thousands of small ring magnets threaded with wires • Data bits were stored and manipulated by sending electric current pulses through the magnets • Magnetic cores were the most reliable and inexpensive memories for almost twenty years Photo Courtesy: Magnetism Group, Trinity College, Dublin

  7. Giant Magnetoresistance Materials Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • Giant Magnetoresistance Materials (GMR) were discovered in 1989 • By 1991 GMR technology provided a magnetoresistance ratio of 6% (3 times that provided by previous technologies) • Read access time of 50 ns (9 times improvement) • Still not as fast as semiconductor memory • Large size because lines of 1micron were required

  8. Technical Overview Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • 3 MRAM Technologies are Currently Being Developed • Hybrid Ferromagnet Semiconductor Structures • Magnetic Tunnel Junctions • All-Metal Spin Transistors & Spin Valves • Writing Data to a Cell is Similar for all 3 Technologies • Reading a Cell’s Data Reads the Direction of Magnetization of a Ferromagnetic Element, but the Method Varies for Each Technology

  9. Basic Principles Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • The 2 Possible Magnetization States of a Ferromagnetic Element can be Described by a Hysteresis Loop • Magnetization of Film vs. Magnetic Field Diagram Courtesy: IEEE Spectrum • A magnetic field, with magnitude greater than the switching field, sets magnetization in direction of applied field

  10. Writing a Bit Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • MRAM Utilizes a Wire Directly Over & Magnetically Coupled to the Magnetic Element • A Current Pulse Traveling Down the Wire Creates a Magnetic Field Parallel to the Wire • Each Cell is Inductively Coupled with a Write Wire From a Row & a Column Diagram Courtesy: IBM

  11. Hybrid Ferromagnet Semiconductor Structures Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • A Ferromagnetic Element is Placed Directly Over a Semiconducting Channel • The Fringe Field has a Large Component Perpendicular to the Plane of the Channel Diagram Courtesy: IEEE Spectrum

  12. Magnetic Tunnel Junctions Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • 2 Ferromagnetic Films Separated by a Dielectric Tunnel Barrier • Resistance Between Films Depends on their Magnetic States • Parallel Fields: Low Resistance • Antiparallel Fields: High Resistance Diagram Courtesy: IEEE Spectrum

  13. Comparison Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • Hybrid Ferromagnet Semiconductor: • Problems with Cross-Talk Between Cells • Compatable with Standard CMOS Processing • Magnetic Tunnel Junction • Fabrication Requirements Cause Problems with Operating Margins and Yields • Not Compatable with Standard CMOS Processing • All-Metal Spin Valve • Low Impedance, Low Readout Voltage • Not Compatable with Standard CMOS Processing

  14. Interference Manufacturing Uniformity Power efficiency Size Current Challenges Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary

  15. Interference Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • Interference between adjacent cells • Disturbance by digit line current to adjacent line current • The effect of heat cause bit flip

  16. Manufacturing Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • As chips get smaller the individual circuits hold less of the charge • Risks of leaking current and other problems • Hard to integrate with other silicon-based chips • The resistance of the magnet device varies exponentially with it thickness

  17. Uniformity Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • Distribution of the electromagnetic field

  18. Power efficiency Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • High Current consumption • MRAM designs required a relatively high current to write each single bit • Power consumption is significantly greater than DRAM, only 99% of the total power is used in delivering electric current for writing data • One transistor is required for each memory bit

  19. The Players Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • Principal Players: • Additional Players: • Bosch - Hewlett-Packard • Intel - NVE Corporation • Siemens - Sony • Toshiba

  20. Impacts on Broader Society Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • Engineers / Scientists • Designing MRAM • Designing Hardware/Software that Interacts with MRAM • New Memory Standards • Society • Added Convenience • Longer Battery Life on Portable Electronics • “Instant-On” Computing • Higher Productivity • Data not Lost in Power Failure • Faster Read & Write

  21. Market impacts Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • Huge demand of memory • MRAM is expected to be the standard memory • The market size was $21 billion in 1999 when DRAM came out • $48 billion in 2001 • $72 billion within 2007 with MRAM

  22. Market analysis Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • IBM being the leader in the development of MRAM is chase by: • Motorola • Intel • Siemens • Toshiba

  23. Next 5 years Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • IBM and Infineon are planning the mass production for 2004 • MRAM will become the standard memory for the next couple of year • MRAM will be use in other devices

  24. I&O long term Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • Digital camera • Cellular phones • PDA • Palm pilot • MP3 • HDTV

  25. Quality of life impacts Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • MRAM will eliminate the boot up time • Electronic devices will be more power efficient • It could enable wireless video in cell phones • More accurate speech recognition • MP3, instead of hundred on songs, MRAM will enable thousand of songs and movies

  26. Summary Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • Importance • Potentially Substantial Impact on Society • Potentially Central to Computers and Electronics that Engineers are Designing • The Future of MRAM • Expected to Replace SRAM, DRAM, & FLASH • Predicted to be the Memory Standard in both Computers & Consumer Electronics • Indicators of a Breakthrough • Price of MRAM is Equivalent to or Only Slightly More than DRAM & FLASH • MRAM is More Common in New PCs than DRAM & More Common in New Electronics than FLASH

  27. References Overview Introduction Historical Perspective Technical Description Challenges / Constraints Principals Market Summary • Bonsor, Kevin. How Magnetic RAM Will Work. 9 Feb 2003. <http://computer.howstuffworks.com/mram.htm>. • Daughton, James. Magnetoresistive Random Access Memory (MRAM). 4 Feb 2000. 1-13. 13 Feb 2003. <http://www.math.uwaterloo.ca/~m2wang/cs690b/mram.pdf>. • Goodwins, Rupert. Magnetic Memory Set to Charge the Market. ZDNet UK. 12 Feb 2003. 16 Feb 2003. <http://techupdate.zdnet.co.uk/story/0,,t481-s2130312,00.html>. • Guth, M., Schmerber, G., Dinia, A. “Magnetic Tunnel Junctions for Magnetic Random Access Memory Applications.” Materials Science and Engineering.Online 2 Jan 2002: 19. Science Direct. 16 Feb 2003. <http://www.sciencedirect.com>. • IBM Magnetic RAM Images. 16 Feb 2003. <http://www.research.ibm.com/resources/news/20001207_mramimages.shtml>. • Johnson, Mark. “Magnetoelectronic memories last and last.” IEEE Spectrum 37 (2000 Feb): 33-40.

  28. THANK YOU VERY MUCH 4 BEING PRESENT

  29. SAWAL JAWAAB...

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