1 / 4

Module Decision To-Do List for Enhancing Electrical Performance

This comprehensive to-do list outlines tasks related to analyzing and improving electrical performance in chip modules. It covers comparison of efficiency, noise, and decoupling requirements, among other aspects. Key tasks include layout, irradiation testing, mechanics, and cost estimation.

brett-rojas
Download Presentation

Module Decision To-Do List for Enhancing Electrical Performance

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Module Decision - To Do List • By pixel meetings associated with February 22-26, 1999 ATLAS week • Beyond making and testing flex and MCM-D modules…. assume this will address electrical performance issues including comparison of • efficiency • threshold uniformity • noise • decoupling requirements • etc • Comparison of performance in the gap region between chips with flex and MCM-D options

  2. Module Decision - To Do List • Layout • Compatibility of MCM-D with disk support ring(longer module is problem - how bad) -> David B. • Sensitivity of disk layout taking into account changes in width of MCM-D module -> David B, Karl-Heinz • Monolithic shingled stave layout update since TDR -> Leo • Sensitivity of barrel layout to changes in width of MCM-D module -> Leo • Material • Update TDR needed? Gil, Karl-Heinz and Leo to check • Irradiation • Irradiate flex with components(but not MCC) to 25 Mrad with Cobalt - Gil • What else is realistic for MCM-D? Single chip????

  3. Module Decision - To Do List • Mechanics • Bias connection to MCM-D. Is “from backside” feasible particularly for disks? -> David B., Marco • Implications of backside chip ground connection for both flex and MCM-D? -> David and Marco and Karl-Heinz • Sensors • Any quantitative comparison possible regarding sensitivity to being near edge of wafer? -> sensor group discussion • Assessment of schedule impact on 2nd prototype fabrication of decision by February - sensor group • Wafer warpage measurements for MCM-D, implications for thinner wafers - Peter • Module connections • Worst case comparison of single cable power connections and optical connections to each module with strain relief - at least concept drawings for both flex and MCM-D. Karl-Heinz, Leo, Gil • Is MCM-D compatible with indium bumps(pressure during flip chip). Is there any way to tell? -> Karl-Heinz and Leo • Measure MCC temperature - Genoa • Evaluate temperature cycling effects for both flex and MCM-D. Includes measurements and estimates. Rusty and Karl-Heinz

  4. Module Decision - To Do List • Cost estimate • Do better job on flex cost estimates -> Rusty and Leo • Yield modeling • Propose to develop framework(spreadsheet) of yield model for module construction including all steps(as best we know them) to assess sensitivity to yield assumptions(including wire bonding) - Gil, Jean-Claude, + anyone else that is interested. • 1999 schedule • If chosen in February, what is the realistic prototype plan for • flex - Rusty, Giovanni, ….. • MCM-D - Karl-Heinz • with emphasis on meeting constraints from electronics, detectors…

More Related