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康展 201 3 年 Pilot-Run 問題點結案率

康展 201 3 年 Pilot-Run 問題點結案率. 一. 2013年7月P/R Issue共8件:(截止8/5) 1.已修改待追蹤0件 2.目前OPEN無對策2件. 3.已結案51件. 二. 主要OPEN問題點描述: HBD002-ZA1GT: 問題點:銅厚1OZ太薄,插件后銅箔翹起,造成空焊(主要位置:AI/RI件及線材) 改善對策:目前與RD討論修改銅厚為2OZ. GPD002-000GT: 問題點:INI測試2PCS不開机,M2不良料號是R90281-8679I-FC,廠商:ON. 改善對策:已送廠商分析中.

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康展 201 3 年 Pilot-Run 問題點結案率

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  1. 康展 2013年 Pilot-Run問題點結案率 一. 2013年7月P/R Issue共8件:(截止8/5) 1.已修改待追蹤0件 2.目前OPEN無對策2件. 3.已結案51件 二. 主要OPEN問題點描述: HBD002-ZA1GT: 問題點:銅厚1OZ太薄,插件后銅箔翹起,造成空焊(主要位置:AI/RI件及線材) 改善對策:目前與RD討論修改銅厚為2OZ. GPD002-000GT: 問題點:INI測試2PCS不開机,M2不良料號是R90281-8679I-FC,廠商:ON. 改善對策:已送廠商分析中.

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