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TRT Barrel Cooling: Electronics. Motivation: Overheating of electronics causes premature failure Requirements: 100 mW per channel Total for type 1(inner) module ~ 30 W Want operating T < 50 ºC Old Cooling Plan (works @ 60 mW): Heat generated by IC through stamp board through legs/sockets
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TRT Barrel Cooling: Electronics • Motivation: • Overheating of electronics causes premature failure • Requirements: • 100 mW per channel • Total for type 1(inner) module ~ 30 W • Want operating T < 50 ºC • Old Cooling Plan (works @ 60 mW): • Heat generated by IC • through stamp board • through legs/sockets • into cooling plate • to mounting channel/tubing • to cooling fluid
From Lund: • ASDBLR & DTMROC dummy boards (pictured here) • Roof boards • Readout and display software
1 mm PG cooling plate on type 1 tension plate with Lund mockup electronics (one roof board and two stamp board sets removed)
Results: (60 mW / coolant at 14 ºC) • 1.3 mm Aluminum cooling plate: • ASDBLR: 46.5 ºC • DTMROC: 48.8 ºC • roof boards: 38.8 ºC • cooling, tension plates: ~ 27 ºC • 1.0 mm Aluminum cooling plate: • estimate 4 º higher than above • 1.0 mm PG cooling plate: • ASDBLR: 49.3 ºC • DTMROC: 51.1 ºC • roof boards: 39.5 ºC • cooling, tension plates: ~ 27 ºC • (Typical range: ± 2 ºC) • For 75 mW, add ~9 ºC
New Cooling Plan for 100 mW: • Keep old scheme, and: • Make lower cooling plate thinner • Add upper cooling plate • Plates share cooling tubing • Reasons: • Increase in power expected to come mostly from upper chip (DTMROC) • Too late to make major changes to lower plate design • As always, must minimize material to reduce radiation length
New mockup, showing PG vertical rail connecting cooling plates
New mockup with one roof board removed, showing upper cooling plate
Results: (100 mW - 40/60) • “0.6 mm” Aluminum cooling plates: • ASDBLR: 49 ºC • DTMROC: 50 ºC • roof boards: 28 ºC • cooling, tension plates: ºC
Present Activities: • Proceeding with two-plate prototype: • 0.6 mm thick lower plate • 0.6 mm (at min) upper plate • 3.3 mm wide PG connection from cooling tubing to upper plate, attached with metal-filled epoxy • Proceeding with FEA calculation: • Will model one (or a few) electronics stacks with all cooling parts • Steady state - simplifies problem • Will be able to parameterize plate thickness and material properties to validate and optimize design
Summary: • Two plate design works at 100 mW • Will fine tune dimensions, material choices from: • results of FEA calculations • mockup results with various configurations • measured power consumption of real electronics • changes due to redesign of board-to-board connection (Lund flex design) • changes due to placement of electronics on stamp boards