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Packaging and MEMS for RF/ microwave

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  1. Packaging and MEMS for RF/ microwave

  2. Packaging and MEMS for RF/ microwave Program:09:00 Registration, coffee 09:30 Opening/Introduction 09:45   Wolfgang Heinrich: “Flip-chip for Millimeter-Wave and Broadband Packaging” 11:00 W. Heinrich: “Modeling the package of a GaN power transistor” 11:45   Lunch 12:45    Kari Kautio, “LTCC – packaging & smart system integration” 14:00   Coffee break 14:30   Héctor J. De Los Santos, “Applications and Trends in RF - MEMS” 15:45 General discussion / Concluding remarks 16:00 – 16:30   Seminar closing

  3. Vestfold University College Health and Nursing Electronics Teaching Education Electro automation Maritime Education Data VUC Administration Science and Engineering Social Sciences Product design

  4. 44 34 23 19 9 5 Micro- and nanotechnology at VUC • Close to 20 Ph.D. students • International master study (taught in English) • Up to 20 students admitted per year • Bachelor study (in Norwegian) • Research • Building methods for MNT • Interconnection • Packaging • 3D integration • Micro- and nano-systems for: • Energy harvesting • Biomedical applications • RF applications • Optical applications • Maritime applications • ...

  5. Vestfold UC / IMST and the local industry cluster has national status as Norwegian Center of Expertise - in micro- and nanotechnology Norwegian Center of Expertise – Micro- and Nanotechnology

  6. Organisation for ICT and Electronics companies in Vestfold 34 member companies/ institutions Team packaging: Individual members from the companies/ institutions Meetings for open-minded discussions on challenges in packaging Network of colleagues Seminars Electronic Coast

  7. http://imst.hive.no/ Research Summary Select ”Research” and ”Research Summary 2008” More information – VUC/ IMST