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WSO/UV-LSS Detector with large dimension MCP Baosheng Zhao* National Astronomical Observatories of CAS * E-mail :open@opt.ac.cn. Contents. Research Bases 2. Project Demonstration & Design 3. Key Technologies and Research Contents. 1. Bases. EUV (30.4 nm) Imager Based on WSA Detector

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Contents

WSO/UV-LSSDetector with large dimension MCPBaosheng Zhao*National Astronomical Observatories of CAS* E-mail :open@opt.ac.cn


Contents

Contents

  • Research Bases

  • 2. Project Demonstration & Design

  • 3. Key Technologies and Research Contents


Contents

1. Bases

EUV (30.4 nm) Imager Based on WSA Detector

- Supported by the Directional Project of Knowledge Innovation Project of Chinese Academy of Sciences


Contents

1. Bases

Schematic Diagram of the System


Contents

1. Bases

  • Curved MCP

Photo of the Curved MCP

Curvature Radius: 70mm

Effective Area: φ50mm

Thickness: 0.8~1mm;

Gain: 104

Patent Certificate


Contents

1. Bases

The planar structure sketch, entire and local magnified photos of WSA collector (from left to right)


Contents

1. Bases

Schematic of WSA Collector


Contents

1. Bases

Gain Distribution


Contents

1. Bases

Image of Dark-count

Gain Distribution of Dark-count


Contents

1. Bases

Imaging Result in our lab


Contents

1. Bases

1024×1024,spatial resolution superior to 150μm

(a)Used WSA;(b)used CCD Camera


Contents

1. Bases

UV Image Intensifier(110~200nm)

Photocathode: CsI


Contents

2. Project Demonstration & Design

Requirements of the spacial weak UV detecting:

1) Solar Blind;

2) Photon Counting Mode;

3) High Detecting Quantum Efficiency;

4) High Local Dynamic Range.


Contents

2. Project Demonstration & Design

Detecting Wavelength Range: 110nm-320nm

Photocathode: 110nm-175nm, CsI

170nm-320nm, CsnTe

Schematic of the Detector


Contents

dimension :

150X50X40(mm3)

Input dimension:

106X6(mm2)

Spatial resolution:

40μm

2. Project Demonstration & Design

Rectangle Profile of Detector



Contents

Ceramic parts custom-making

Heat treatment

Ceramic metallization

Final assembly

Design

Metal parts custom-making

Heat treatment

Nickel deposition

Leak detection

Inspection /storage

Laser soldering

2. Project Demonstration & Design

Technics of Vacuum Shell


Contents

Optical manufacture

Nickel deposition

Design

Photolithography

Inspection

Indium sealed edge metallization(NiCr+Au)

2. Project Demonstration & Design

Technics of Mg2F Window


Contents

2. Project Demonstration & Design

WSA Collector Design

1) MCP – Ge Layer – WSA Collector

2) MCP – WSA Collector

Design Draft of the WSA Collector


Contents

Key Technological Indexes

2. Project Demonstration & Design

Curved MCP

Effective Area: 106×6 mm2

Size: 112×12 mm2

Gain: 104

Pore Diameter: 12.5 micron

Ratio of Length to Diameter : 40:1

Thickness: 0.5 mm

Resistance: 40~80MΩ

Curvature Radius: 1000mm


Contents

2. Project Demonstration & Design

Photocathode

CsI

a) 100-175nm photocathode

b) 170-320nm photocathode

Cs2Te


Contents

2. Project Demonstration & Design

Electronic Readout Subsytem


Contents

3. Key technologies and research contents

Key technologies:

  • High quantum efficiency and large format

    photocathode preparation technology;

  • Cylinder MCP preparation technology;

  • High resolution WSA electron collector

    preparation technology;

  • High voltage power supply with low ripple and

    high stability and control circuit technology;

  • Low noise charge sensitive preamplifier, pulse

    shaping circuit, sample and hold circuit, AD

    convertor, DSP and FPGA digital technologies;

  • Detector calibration technology.


Contents

3. Key technologies and research contents

Research contents:

  • LSS detector scheme;

  • Detector structure design;

  • Detector electro-optical system design;

  • Spherical (curved) surface MCP manufacture;

  • WSA structure design;

  • Detector electron read-out system design;

  • High voltage power supply design with high

    stability and low ripple;

  • Auto gain control circuit system design for

    high voltage power supply;

  • Detector system calibration.