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RoHS Compliance. Add Corporate Logo Here. Update: Jul. 1, 2005. Definition. R estriction o f certain H azardous S ubstances. POLICY. Retention of Current Models Creation of New Models for RoHS Compliance Drop-in replacement. WHY ??.

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rohs compliance

RoHS Compliance

Add CorporateLogoHere

Update: Jul. 1, 2005

definition
Definition
  • R estriction
  • o f certain
  • H azardous
  • S ubstances
policy
POLICY
  • Retention of Current Models
  • Creation of New Models for RoHS Compliance
  • Drop-in replacement
slide4
WHY ??
  • Mini-Circuits is ISO-14001 Certified and is committed to a Greener environment
  • Restricted Substances are potential hazards to health and the environment
  • INCREASING CUSTOMER DEMAND
standard
Standard
  • Mini-Circuits will meet the requirements as stated in the European Union Directive (2002/95/EC)
  • Mini-Circuits will provide compliant parts prior to the July 2006 deadline
  • Policy includes ‘total’ compliance, not just Lead-free
restricted substances
Restricted Substances
  • Lead (Pb) - platings, surface finishes
  • Mercury (Hg) - not applicable
  • Cadmium (Cd) - capacitors, ceramics
  • Hexavalent Chromium (CrVI) - chromate conversion finish of aluminum
  • PBB - flame retardant
  • PBDE - flame retardant
customer inquiries
Customer Inquiries
  • Web Page devoted to RoHS/Pb-free
    • Includes Letter of Introduction
    • Policy
    • FAQ Sheet
    • List of RoHS Compliant Model Families
  • ROHS@MINICIRCUITS.COM
  • Material Declarations, on request, in Excel format (see samples at end)
product identification
Product Identification
  • All RoHS Compliant models will have part numbers ending in “ + “ suffix.
  • “+” suffix to appear on models where marking is done.
  • “ + “ Part numbers and symbol will appear on all labels and packaging.
  • Implementation of JESD97 2nd level interconnect (e) labeling.

Pb

alternatives
Alternatives
  • Getting the ‘Lead Out’
    • SAC solders
    • Matte Tin over Nickel on Leadframes and Chip Components
    • ENIG (electroless nickel immersion gold) on ‘soft’ PCBs
    • Tin/Silver/Nickel on MMIC leadframes
    • Tin/Silver on pin headers
alternatives cont d
Alternatives(cont’d)
  • Cadmium
    • Cadmium-free capacitors
    • Cadmium-free ceramics
  • Hexavalent Chromium
    • Trivalent “Alodyne”
    • Phosphating
    • Gold Plating
process reliability issues
Process/Reliability Issues
  • Pb-free solders require higher Peak Reflow Temperatures.
  • RoHS Compliant parts will meet J-Std-020C Reflow profile requirement.
  • No change in MSL is anticipated
  • Testing for Joint Reliability and Tin Whiskers