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Contents. Capability-PCB Capability-FPC and RFPC Capability-Aluminum PCB Capability-PCBA. Number of Layer: 2-28 Layer Maximum processing area: 680 x 1000 mm Min board Thickness: 2 Layer 0.3mm(12mil) ; 4 Layer 0.4mm(16mil) ;

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  • Capability-PCB
  • Capability-FPC and RFPC
  • Capability-Aluminum PCB
  • Capability-PCBA

Wonderful PCB

capability pcb general capability
Number of Layer: 2-28Layer

Maximum processing area: 680 x 1000 mm

Min board Thickness:

2 Layer 0.3mm(12mil); 4 Layer 0.4mm(16mil);

6 Layer 0.8mm(32mil); 8 Layer 1.0mm(40mil);

10 Layer 1.1mm(44mil); 12 Layer 1.3mm(52mil);

14 Layer 1.5mm(59mil); 16 Layer 1.6mm(63mil);

18 Layer 1.8mm(71mil);

Finished board thickness tolerance:



Capability –PCB General Capability

Wonderful PCB

capability pcb general capability1
Capability -- PCB General Capability
  • Twisting and bending :≤0.75%,Min0.5%。
  • Range of TG:130-215℃
  • Impedance tolerance+/-10%,Min+/-5%。
  • Hi-Pot Test: Max4000V/10MA/60S
  • Surface treatment:

HASL With Lead HASL Free Lead

Flash Gold Immersion Gold

Immersion Silver Immersion Tin

Gold Finger Osp

Wonderful PCB

capability pcb cu thickness plating 1
Capability -- PCB Cu thickness +plating (1)
  • Cu thickness

Out layer Cu thickness:1-6OZ

Inner layer Cu thickness:0.5-4OZ

Cu thickness of PTH: average>=20um,Min.>=18um

  • HASL with lead: Tin 63% Lead37%
  • HASL free lead:

surface thickness>=0075um

Thickness in the hole>=5um

  • Flash Gold

Ni thickness:3-5um (120u"-160u")

Gold thickness:0.025-0.075um (1u"-3u")

Wonderful PCB

capability pcb cu thickness plating 2
Capability -- PCB Cu thickness +plating (2)
  • Immersion Gold

Ni thickness:3-5um (120u"-160u")

Gold thickness:0.025-0.15um (1u"-6u")

  • Immersion Tin

Tin thickness:0.8-1.2um (32u"-48u")

  • Immersion silver

Ag thickness:0.15um-0.75um (6u"-30u")

  • Gold Finger

Ni thickness:3-5um (120u"-160u")

Gold thickness:0.025-1.51um (1u"-60u")

Wonderful PCB

capability pcb cover thickness 1
Capability -- PCB Cover thickness (1)
  • Solder mask

Color: green, matte green,yellow,blue,red,black,matte black

Solder mask thickness:

Surface line≥10um,

surface line corner≥6um

surface board 10-25um

Solder mask bridge width: HOZ≥0.1mm IOZ≥0.12mm

  • Legend

Color: White, yellow, black

Min height of legend 0.70mm (28mil);

Min width of legend 0.15mm (6 mil)

Wonderful PCB

capability pcb cover thickness 2
Capability -- PCB Cover thickness (2)
  • Blue Gel



  • Carbon print:


Min space:0.25mm


Wonderful PCB

capability fpc
Capability -FPC
  • FPCLayers 1-8 layers
  • Board Thickness 0.05-0.5mm
  • Min.line width/space 0.04/0.04mm
  • in.Through Hole Size 0.2mm
  • PTH Hole Dia.Tolerance ∮≤0.1mm 0.05mm ∮≥0.1mm ±0.075mm
  • Solder Mask Registration Tolerance ±0.05mmMin.Routing Dimension Tolerance ±0.05mm
  • Hole to edge(Hard tool/Die Cut) ±0.1/±0.2mm
  • Eege to Edge(Hard tool/Die Cut) ±0.05/±0.2mm
  • Circuit to edge(Hard tool/Die Cut) ±0.07/±0.2mm

Wonderful PCB

capability flex rigid pcb
Capability-Flex Rigid PCB
  • 4L1R+2F+1R
  • 6L2R+2F+2R
  • 1+HDI 6L1+1R+2F+1R+1
  • 2+HDI 6L1+1F+2F+1F+1
  • 2+HDI 8L
  • Thin 4L R-F(1+HDI )

Wonderful PCB

capability fpc and rfpc material 1
Capability—FPC and RFPC Material-1

1. Base Material

1.1 FCCL ( Flexible Copper Clad laminate)

Polyimide: Kapton (12.5 m/20 m/25 m/50 m/75 m

High flex life, good thermal management, high moisture absorption and good tear resistant

Polyester (25 m/50 m/75 m)

Most cost effective, good flex life, low thermal resistivity, low moisture absorption and tear resistant

1.2 Dielectric Substrates:PI, PET.

Wonderful PCB

capability fpc and rfpc material
Capability—FPC and RFPC Material

2. Coverlay

2.1 Cover Layer from ½ mil to 5 mils (12.7 to 127µm)

Polyimide: (12.5 m/15 m/25m/50m/75m/125m)

High flex life, high thermal resistivity.

2.2 Flexible Solder Mask

Most cost effective, lower flex life, better for registration


2.3 PIC—photo imaging covercoat

Lower flex life, better for registration

Wonderful PCB

capability fpc and rfpc material1
Capability—FPC and RFPC Material
  • 3. Adhesive Sheet
  • 4. Conductive Layer
  • 4.1 Rolled Annealed Copper (9 m/12 m/17.5 m/35 m/70 m)
  • High flex life, good forming characteristics.
  • 4.2 Electrodeposited Copper (17.5 m/35 m/70 m)
  • More cost effective
  • 4.3 Silver Ink
  • Most cost effective, poor electrical characteristics. Most often used as shielding or to make connections between copper layers
  • SF-PC5000 and SF-PC1000protection film

Wonderful PCB

capability fpc and rfpc material2
Capability—FPC and RFPC Material

6.Additional Material & Stiffeners


Pressure Sensitive Adhesive (PSA)

Steel, Aluminum stiffeners

7. No / Low Flow PP

Applied in Lamination


1080(3.0mil / 3.5mil)

2116(5.6mil) w/o micro-via

Brand: TUC, Panasonic, Arlon, Hitachi, Doosan

Wonderful PCB

capability pcb assembly
Capability- PCB Assembly

1.  PCBA, PCB assembly: SMT & PTH & BGA

1.1.SMD :160K points/hour. operation rate :70%( 8 working hours per day, 20 set equipments)

1.2.DIP: 75K points/hour. operation rate :80% ( 8 working hours per day, 250persons for DIP)

2.  PCBA and enclosure design

3.  Components sourcing and purchasing

4.  Quick prototyping

5.  Final assembly

6.  Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)

7.  Custom clearance for material importing and product exporting

Wonderful PCB

capability profiling for all
Capability –Profiling for all
  • cnc : tolerance+/-0.1mm

line to cnc ≥0.20mm

hole to cnc ≥0.30mm

gold finger to cnc ≥0.20mm

  • Punching: Hole size diameter +/-0.10mm

Punching diameter +/-0.15mm

  • v-cut: corner:30℃、45℃、60℃

corner tolerance:+/-5°

v-cut deepness:0.6-1.6mm

deepness tolerance:+/-0.10mm

Wonderful PCB

capability test for all
Capability –Test for all
  • Equipment:

Universal Tester

Flying Probe Open/Short Tester

High power Microscope

Solderability Testing Kit

Peel Strength tester

High Volt Open & Short tester

Cross Section Molding Kit With Polisher

Wonderful PCB