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Thermal Analysis of PWB Using SINDA/3D: Model and Results Overview

This document presents a detailed thermal analysis of Printed Wiring Boards (PWBs) using the SINDA/3D software. It explores the model simulations and results, focusing on temperature variations measured in degrees Celsius at different locations, with an emphasis on the back of the PWB. The findings provide valuable insights into thermal performance, aiding in the optimization of designs for efficient heat management and reliability in electronic applications.

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Thermal Analysis of PWB Using SINDA/3D: Model and Results Overview

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  1. PWB Thermal Analysis

  2. SINDA3D Thermal Model

  3. SINDA3D Thermal Model Results, Deg. C

  4. SINDA3D Thermal Model Results Back of PWB, Deg. C

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