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3D PLUS technology Electrical and mechanical design 3D PLUS quality system

Preamplifier Integration in 3D PLUS Technology. 3D PLUS technology Electrical and mechanical design 3D PLUS quality system EM and FM manufacturing flow Schedule. 3D Manufacturing F lowchart. 4 ) – Flex stacking. 5 ) – Module Mo u lding. 7 ) – Module Plating (Ni+ Au).

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3D PLUS technology Electrical and mechanical design 3D PLUS quality system

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  1. Preamplifier Integration in 3D PLUS Technology • 3D PLUS technology • Electrical and mechanical design • 3D PLUS quality system • EM and FM manufacturing flow • Schedule

  2. 3D Manufacturing Flowchart 4 ) – Flex stacking 5 ) – Module Moulding 7 ) – Module Plating (Ni+ Au) 1 ) – Flex design 2 ) – Components attachement 8 ) – Cube interconnection by laser 3 ) –Flex Electrical Test 9 ) – Module Test & screening 6 ) – Module Sawing

  3. Input Signal Amplified Signal antenna Vin Feedback Mechanical & Electrical Design Amplifier Principle : Vout Input from calibration network Calibration Signal 1 layer in the Regulator module • 1st level of amplification • 46 dB Gain • few noise • Feedback • 2nd level of amplification • 31 dB Gain • Bandwidth 0.25mHz to 4 KHz 1 layer in the Amplifier module 1 layer in the Amplifier module

  4. Mechanical & Electrical Design The Amplifier module : • 2 amplification levels • 3 radiation shielding levels • PGA Heating network * 1st amplification level Radiation Shielding 2nd amplification level * Circuit no included for the THEMIS mission

  5. Amplifier Mechanical design

  6. Mechanical and electrical The Regulator module : • 1 power Supply regulator layer • 1 Calibration layer • PGA Heating network * Temperature regulation* Input from cal. network Ground Plan Radiation Shielding* Power Supply * Circuit no included for the THEMIS mission

  7. Regulator Mechanical design

  8. Materials Main materials which make up these 3D Modules are :

  9. 3D PLUS technology Qualification • Several Project/Product Qualification successfully passed since the beginning of 3D PLUS for COROT, CLUSTER II, PROBA, SMART 1, ROSETTA, MARS EXPRESS, ENVISAT… • Successful Generic Evaluation by CNES/ESA/NASA on December 2001 • See CNES/ESA Evaluation report (ESCCON 2002 – France) • See NASA Evaluation report (ESCCON 2002 – France) • Generic Qualification by CNES/ESA on 3Q2003 • Final Review of the 3D qualification (Document ref. 3300-0563-3) took place on September 24th. • Several Customer’s Internal Agreements in the Space Industry • Successful ISO 9001-2000 Certification on April 2003 3D PLUS Technology, Processes and Products benefit from a largeexperience and a high quality referential

  10. Quality Assurance Documents • 3D PLUS Quality Manual • Generic quality process at 3D PLUS. • Process Identification Document (ref.3300-0546-3) • Freeze the qualified technological capability domain of 3D PLUS (i.e Process list, inspection criteria, material list, parts procurement rules, screening test, …) • The PID is compliant to ESA quality standard for Space applications. • Product Configuration Management : CADM • Module procurement specification • Product definition • Manufacturing flow • Test specification • Product Assurance Plan • End Item Data Package : • Include all the traceability information (material, parts, operations, LAT,…) of the manufactured lot • As built/As design configuration list for the manufactured modules

  11. Quality levels for Space applications • 3 quality levels are defined in 3D PLUS PID and described in the document ref. 3DPA0850 : • Commercial • Industrial => Engineering Models for Space applications • Space=> Flight Models for Space applications • For the THEMIS mission, 3D PLUS has to manufacture : • 1 Regulator Engineering Model • 3 Amplifier Engineering Models • 7 Regulator Flight Models • 19 Amplifier Flight Models

  12. EM and FM manufacturing flow • For the PreAmplifier manufacturing, there are 2 types of components : • Components procured by CETP • Components procured by 3D PLUS according to 3D procedure ref: 3DPA0350: • Documentary review • Visual Inspection • Solderability test, Lead Integrity and Lead Finish Adhesion • Lot Acceptance Test

  13. EM and FM manufacturing flow Electrical tests and Burn-in will be done according to CETP specifications and requirements

  14. EM and FM manufacturing flow CoC : Certificate of Compliance EIDP : End Item Data Package Module Lot Acceptance Test will be done on 1 Amplifier module and 1 regulator module

  15. Schedule

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