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Manufacturing of Semiconductor Equipment

Manufacturing of semiconductor equipment involves a complex process to make a perfect end-product.<br>

VLSI
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Manufacturing of Semiconductor Equipment

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  1. Manufacturing of Semiconductor Equipment

  2. The Process of Semiconductor Manufacturing • Semiconductors are materials which can be made to act as insulator or conductor. • Semiconductor equipment plays an important role in manufacturing Integrated Circuits (I.Cs). • The process of manufacturing I.Cs is so complex that it involves more than 50 different pieces of semiconductor equipment. • The Semiconductor manufacturing process involves design, wafer preparation, front-end process, photolithography, etch, cleaning, thin-films, ion implantation, planarization, test & assembly.

  3. Type of Semiconductor Equipment: • Wafer Manufacturing/Wafer Processing • Fab Facilities Equipment • Mask/Reticle Equipment • Surface Conditioning/Clean and Dry • Resist processing Equipment • Expose and Write • Etch Equipment • Ion Implant Equipment • Sputter Equipment

  4. Thermal Processing Equipment • Chemical Mechanical Planarization (CMP) • Chemical Vapor Deposition (CVD) • Inspection Measurement • Assembly and Packaging Equipment • SOC & Logic Test Equipment • Memory Test Equipment • Handlers • Probe Equipment

  5. Wafer Processing Equipment • Wafer processing equipment comes in various forms, most of which are specialized in growing, depositing or removing materials from a wafer. • Some examples of wafer fabrication equipment are oxidation systems, diffusion systems, ion implantation equipment, epitaxial reactors, photolithography and etching equipment. • These equipment take turns in depositing and removing the materials from the wafer in patterns until a circuit is fully built on the wafer.

  6. Assembly Equipment • Once the wafers are manufactured, assembly equipment is used to package them into finished integrated circuits that are physically ready for use in customer applications. • Assembly equipment includes wafer back-grind systems, wafer saw equipment, die-attach machines, wire bonders, moulding equipment, DTFS machines, branding and sealing equipment, and lead finish equipment.

  7. Test Equipment • Assembled devices need to undergo testing. By testing, only good devices will be shipped to customers. Test Equipment is used for this purpose. • Test equipment include Automatic Test Equipment (ATE) or electrical testers, test handlers, tape and reel equipment, marking equipment, burn-in sockets, UV erase equipment and vacuum sealers.

  8. Summary • Other Semiconductor equipments include dicing machines, probing machines, polish grinders, CMP and high rigid grinder. • A finished semiconductor product can be used in a variety of products such as PCs, smartphones, radios, cars and all the other electronic devices used in everyday lives. • Thus, manufacturing of semiconductor equipment involves a complex process to make a perfect end-product.

  9. Thank You!!! By: https://www.vlsiresearch.com/

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