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An Update on Material Declaration Standards. Kevin Brady Electronic Information Group Semiconductor Electronics Division Legislation Across the Globe. WEEE. RoHS. EuP (Energy-Using Products). Canada. Japan. California SB20/50 ( California version of RoHS).

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an update on material declaration standards

An Update on Material Declaration Standards

Kevin Brady

Electronic Information Group

Semiconductor Electronics Division

legislation across the globe
Legislation Across the Globe




(Energy-Using Products)



California SB20/50

(California version of RoHS)

China RoHS

(Chinese version of RoHS)


need for product material information
Need for Product Material Information

Acquisition and management of product material information is critical business requirement for multiple reasons:

Required to Prove Compliance with Environmental Regulations:

New laws and regulations designed to protect human health and the environment are being established all over the world.

Non-compliance can result in fines and being banned from markets

To Promote Social and Environmental Responsibility

Consumers now consider environmental aspects when buying products

Companies seeking a competitive advantage are now developing and advertising eco-friendly products

Management of Material Resources

Increasing world wide demand is limiting availability for key resources

Detailed material information will enable companies to manage their costs and find suitable alternatives

current directives
Current Directives

RoHS - Restriction of the Use of Certain Hazardous Substances

bans the placing on the EU market of new electrical and electronic equipment containing more than agreed levels of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants.

WEEE - Waste Electrical and Electronic Equipment

Sets collection, recycling and recovery targets for all types of electrical goods

Imposes the responsibility for the disposal of waste electrical and electronic equipment on the manufacturers of such equipment

what is covered presently
What is covered presently?

Included categories

Large household appliances

Small household appliances

IT, telecom equipment

consumer equipment

lighting equipment


toys and sport equipment

Automatic dispensing machines

what is not covered presently
What is not covered presently

Exempt categories

Military specific equipment

Products where electricity is not required to fulfill main functionality

A product that is part of another type of equipment

WEEE-RoHS differences

Medical devices

Monitoring and control equipment

rohs exemptions
RoHS exemptions

32 exemptions presently

Item based

Mercury in certain lamps

Lead in glass of cathode ray tubes, electronic components and fluorescent tubes

Application based

Lead in solders for servers, storage and storage array systems, network infrastructure equipment

List is changing

Exemptions are reviewed periodically

The International Electronics Manufacturing Initiative (iNEMI) identified material declaration as a major issue in their roadmap

IPC, an industry association for printed circuit board and electronics manufacturing service companies, worked with iNEMI, created IPC 2-18 Supplier Declaration Subcommittee

The resulting standard, IPC 1752, was published in 2006 prior to EU RoHS going into effect and provided the ability to provide multiple levels of declarations including yes/no, Summary (JIG), and full.

IPC 1752 was created to assist the electronics industry in complying with the European Union RoHS directive

Created using the alternative standards development process built around UML

The core of the standard is built around a data model that captures the needs of exchanging product material composition information

NIST developed a PDF based tool to populate the XML structure of IPC 1752, using on Adobe Acrobat Reader

Applying the Approach to an Industry Standard: IPC 1752 Materials Declaration

ipc 1752 background
IPC 1752 Background
  • Designed to help industry comply with new material regulations effecting the electronics industry Part of 1750 series Supplier Declaration Version 1.0 included simple tools to support material data management
  • Supports
    • RoHS yes/no
    • JIG A and B lists (From JIG-101)
    • Full substance declaration
  • Provides
    • An electronic data format for material declaration
    • Standard PDF forms Data entry tools and container for data
  • Created using software design approach
    • Scope/requirements
    • Business/use cases
    • Modeled using UML
    • Uses XML Schema to define data structure
  • Releases
    • v1.0 Spring 2006
    • v1.1 Spring 2007
    • v2.0 Summer 2009
benefits of modeling
Benefits of Modeling

Helps team envision final result

Ensures designer’s intent is communicated to the development team

Less expensive to improve the model than to improve the thing being modeled, which means more design iterations/money

These ultimately lead to:

Better coverage of the domain space

Deeper understanding of the product

Fewer design gaps during implementation

More maintainable product

A higher quality product overall

175x uml modeling to development overview
175x UML Modeling to Development Overview

Analysis Class Diagram


Design Class Diagram


RDB Schema


XML Schema

Table Rows


XML Instances



(PDF, spreadsheet, web page)


ipc 1752 analysis model
IPC 1752 Analysis model
  • Analysis Model
  • Shows:
  • Stakeholders
  • Information
  • relationships
going from data exchange standard to a data management system
Going from Data Exchange Standard to A Data Management System
  • The next step was to show that a data exchange standard built with this method would facilitate the development of a data management system.
  • The Test system was comprised of two components: a database and a software tool to handle data entry and manipulation.
  • A test database management system was successfully created from the IPC 1752 standard
    • Database schema generated from design model
    • Implemented using MySQL
    • Developed software to import and export XML files
  • While limited it can easily be extended to provide full DMS capabilities
limitations of ipc 1752 v1
Limitations of IPC 1752 V1

Limited multiple part reporting

Only one sub-level within the product

Data authenticity - no XML signature

No language for new legislation

Implementation limitations

ipc 1752 version 2 0
IPC-1752 Version 2.0

Modular - allows for easy modification to support other types of declarations and new regulations

Support for new legislation - general declaration, no longer focused on RoHS

Multiple parts - more robust support for reporting multiple parts in a single declaration

No forms - work with solution providers to create supporting tools

Improve support for multiple product IDs

Part families - similar

Shopping cart - different

Support for multi-level sub-components

A part is a part is a part

Better BOM integration

nist data entry tool scriba
NIST Data Entry Tool - Scriba

Version 1.0 of the 1752 standard included a PDF document designed to provide users with a basic software tool to implement the standard

This tool was removed for version 2.0.

To address this need and to prove the validity of the proposed method a software tool called “Scriba” was developed

Basic details of NIST reference tool – Scriba

Written in Java

Public domain

Simple tool: Create-Update-Delete

Multiple parts - multiple levels

Data Validation

Electronic Signature

Merge Ability

Generate presentation format

Reference Implementation for 1752

improved implementation scriba
Improved Implementation Scriba

Dissociate tool from data

Need tool for XML files

Additional functionality using full programming environment

Improve performance with large data files

Not limited by page based format

xml signature
XML Signature

Allows supplier to digitally sign XML file using w3c XML Signature recommendation

The XML Signature is embedded in the document that is signed

Easily implemented

Java XML Digital Signature API


Product ID Link

Material and Process



System Build



Trusted Supplier


Data Sheets

ipc plans 175x to cover
IPC plans 175X to cover:

EuP – Energy Using Products

energy used to produce, transport, sell, use, and dispose of almost every one of its products

Eventually will even include energy to extract raw materials

eco-design requirements for energy using products that must be meet in order to be placed on the market or into service

REACH - Registration, Evaluation, Authorization and Restriction of Chemical substances

progressive substitution of the most dangerous chemicals when suitable alternatives have been identified

RoHS – Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment

Version 1 – 2006

Version 2 – Announced December 2008, release some time in 2009

WEEE – Waste from Electrical and Electronic Equipment

mandates the treatment, recovery and recycling of electric and electronic equipment


Prevent counterfeiting by unique Product ID

why do we care
Why do we care?

IEC TC111 - Environmental standardization for electrical and electronic products and systems

WG1 - Material declaration for electrical and electronic equipment

Describes the procedure, content, and form relating to material declarations for electrical and electronic products

Covers materials and substances that are present in a supplied product

Product view, not chemical view

Does not cover production chemicals and emissions during manufacturing or use

Will be compatible with IPC 1752

How can STEP take advantage of the IPC Environmental work?

Can we pool efforts with iNEMI/IPC to accomplish work?

RosettaNet already has

3M Technologies S Pte Ltd

5-Trees LLC

ADC Telecommunications, Inc.

ASE Group


Actio Corporation

Adiva Technology Inc.

Agere Systems

Ageus Solutions

Agile Software

Altera Corporation

Array Solutions

Austin Insulators Inc.

Avocent Corporation

Balda Solutions Malaysia

Beckman Coulter

BeRex Corporation


C&D Technologies

Carestream Health Inc.

Celestica, Inc.

Ciena Corporation

Circuit Connect, Inc.



Cope Plastics

Crescend Technologies

DALSA Corporation


Dalicap Ltd.

Datakey Electronics, Inc.

Delta Electronics Thailand

Design Chain Associates LLC

DiSS Technology (HK) Co., Ltd.

Distron Corporation

Dynalink Corporation

EPM Global Service Ltd.



Eastman Kodak Company

Electronic Hardware Corp.

Ellington Electronics Technology

Emulex Corporation

Energy Transformation Systems

ENOVIA MatrixOne

Enventure Technologies

  • ExcelStor Technology
  • FCI Technology Services Ltd.
  • FiberElectronics, LLC
  • Foamtec International Co., Ltd.
  • Foresite Systems
  • Foxconn Electronics Inc.
  • Freescale Semiconductor
  • Funai Corporation
  • Future Electronics
  • GE Healthcare - Surgery
  • GE Industrial Sensing
  • GE Security
  • GMNameplate Printing (DongGuan) Co., Ltd.
  • GPS Networking Inc.
  • The GoodBye Chain Group
  • H & H Technologies Inc.
  • Harris Corporation
  • Harvard Custom Manufacturing
  • Indian Springs Mfg. Co., Inc.
  • Information Handling Services
  • Intelligent Motion Systems, Inc.
  • Interphase Corporation
  • J.C. Metal Industries (S) Pte Ltd
  • JDSU
  • JST Corporation
  • J-Tech Technology Co., Ltd.
  • Jabil Circuit
  • Jinfeng Metal & Plastic Products
  • Kemet Electronics Corporation
  • Kuo Leng Electronic Co., LTD.
  • LG Chemical
  • Lelon Electronics Corp.
  • Logic
  • Lucent Technologies
  • MHTB
  • Maxtor Corporation
  • Micro Commercial Components Corp.
  • Micron Instruments Pvt. Ltd.
  • MicroRam Elecronics, Inc
  • Microsoft
  • Molex Corporation
  • Mouser Electronics
  • NIC Components Corp.
  • NXP Semiconductors
  • National Semiconductor
  • Neophotonics (China) Corp
  • Nexgen Mediatech Inc
  • Nippon
  • NuSil Technology LLC
  • Omnitrix, Inc.
  • Optichron Inc.
  • P3 America, Inc.
  • PCNalert
  • PTC
  • Pacific Oaks Technology
  • Panasonic Electronic Devices Co.
  • Pantronix Corporation
  • Pantronix Corporation
  • Papros, Inc.
  • Paxar Americas, Inc.
  • Pony Testing International Group
  • Precience, Inc.
  • Q Point Technology
  • Qualcomm, Inc.
  • Quanta Computer Inc.
  • RCM Industries, Inc.
  • Radio Frequency Systems - Conditioning
  • Ramtron International Corp.
  • Royal Electronic Factory (Thailand) Co., Ltd.
  • SGS
  • Sagem Tunis
  • Sanmina-SCI
  • Schaffner
  • Senju Metal Industry
  • Shenzhen Newstar Microelectronics Co., Ltd.
  • Shin Chin Industrial Co., Ltd
  • SIMCOM International
  • Smith Induspac-Toronto
  • Solectron Corporation
  • Span International
  • Specialized Technology Resources
  • Speedline Technologies
  • Sun Microsystems
  • Sunpower Technology Co.
  • SupplierSoft
  • Suzhou Broadway
  • Symbol Technologies, Inc.
  • Synapsis Technology
  • tec4U
  • Techwise Circuits Co., Ltd.
  • TechniData AG
  • Temex
  • Teradyne
  • Tetra Tech
  • Texas Instruments
  • Tong Jiang Electronics CO., LTD.
  • Total Parts Plus, Inc.
  • Tri-State Fabricators Inc.
  • Trompeter Semflex, Inc.
  • Tyan Computer Corp.
  • Tyco Electronics
  • UPE Electronics
  • Uawithya
  • ViaSat, Inc.
  • Viconics Inc.
  • Vitesse
  • Volex
  • Well Shin Technology
  • WorkflowOne
  • Yangzhong Jia Hui Electron Co., Ltd
  • ZESTRON America
  • Zicon LLC

These companies (160) indicated that they will support/use the IPC-1752 standard for materials declaration.

rosettanet pips
RosettaNet PiPs

Material declaration support for companies using RosettaNet PiP (Partner Interface Process) gateways

Provides necessary information for business transactions between trading partners

2a10 - Design Engineering Information

2a13/15 - Material Composition Information

Designed to integrate with IPC 1752 data (XML or PDF)

Mapping between RosettaNet 2a13/15 and IPC 1752 to improve connection between large OEMs and small & medium businesses


UML Domain Models



175X UML Models

Develop a translation tool to go from UML to EXPRESS


AP 210


IPC 258X






IPC 175X