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Stud Pull Adhesion. Jeff Fournier Ovonyx Technologies Inc. RH Process Team June 2008. Stud Pull. Stud Pull with Quad Group Romulus Mechanical Tester Studs attached to film stack with epoxy Film stacks generally not patterned Quantitative adhesion numbers

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stud pull adhesion

Stud Pull Adhesion

Jeff Fournier

Ovonyx Technologies Inc.

RH Process Team

June 2008

stud pull
Stud Pull
  • Stud Pull with Quad Group Romulus Mechanical Tester
    • Studs attached to film stack with epoxy
    • Film stacks generally not patterned
    • Quantitative adhesion numbers
    • As deposited stacks and post anneal
stud pull4
Stud Pull
  • Wafers are diced into approximately 20

1 cm2 pieces

  • Manufacturer supplied epoxy coated studs are applied to pieces and cured at 150C for ~1hour
  • Samples then mounted in tool and pulled until failure  oxide epoxy fails at pressures ~11K psi
  • Oxide calibration taken before and after stack test
  • Some failure analysis can be done with optical microscope, profilometer, x-section SEM
stud baking fixture
Stud Baking Fixture
  • 1 cm2 piece is mounted on baking fixture with epoxy stud
  • Epoxy is cured in oven at 150C for 60 min.