Next Generation Laminator Sponsors: David Timpe, Geno Amalfatino Advisor: Dr. James Glancey. Team 13: Doug Brunner Adam Fauer Claire Jones Michael Klein. Problem
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Sponsors:David Timpe, Geno Amalfatino
Advisor:Dr. James Glancey
Current laminating processes encounter high amounts of voids between a silicone adhesive and a circuit board. Voids will not allow for proper heat transfer and could cause the circuit board to overheat.
Arlon is the manufacturer of Thermabond®, a silicone adhesive used to laminate circuit boards to heat sinks. Arlon wishes to expand sales of this product by introducing an improved method of applying Thermabond®.
Our goal is to design an automated process that will create a void-free bond between a silicone adhesive, a circuit board and an aluminum plate.
Laminator: Open View
Laminator with Vacuum/Pressure Operation
Vacuum Bagging System
Key Customer Wants and Metrics
Void Reduction 5% or less
Alignment Accuracy ±0.005 inches
Ease of Use Laminate boards up to 24 inches square
Speed (temperature ramp rates) 12ºF/min heating
Temperature and Pressure Controls 400ºF max.
50 psia max.
Prototyped workholding fixed clamp frame proves to hold a circuit board by the edges.
We sincerely appreciate everyone who has given us the opportunity to have a successful senior design. Special thanks to our sponsors at Arlon for their support in this project. Also, thank you Ann Connor, Mr. Beard, and Dr. Glancey for your guidance and instruction.
New design for workholding mechanism will retract clamps.