Next Generation Laminator Sponsors:David Timpe, Geno Amalfatino Advisor:Dr. James Glancey Team 13: Doug Brunner Adam Fauer Claire Jones Michael Klein Problem Current laminating processes encounter high amounts of voids between a silicone adhesive and a circuit board. Voids will not allow for proper heat transfer and could cause the circuit board to overheat. Test Plan Arlon Arlon is the manufacturer of Thermabond®, a silicone adhesive used to laminate circuit boards to heat sinks. Arlon wishes to expand sales of this product by introducing an improved method of applying Thermabond®. 70% Voids! Our Solution • A double chamber vacuum box in a clamshell design • Heaters and coolers in the bottom half • Pressure applied from the top half Project Goal Our goal is to design an automated process that will create a void-free bond between a silicone adhesive, a circuit board and an aluminum plate. Laminator: Open View Workholding Frame Current Technology • Frame will hold circuit board above heat sink for first step of vacuum • Springs will compress and lower the frame holding the circuit board onto the heat sink when pressure from top half is applied Expected Performance Circuit Board Laminator with Vacuum/Pressure Operation http://www.meiki-ss.co.jp/e_lineup/e_mvlp.htm Vacuum Bagging System http://torrtech.com Initial Validation Key Customer Wants and Metrics Void Reduction 5% or less Alignment Accuracy ±0.005 inches Ease of Use Laminate boards up to 24 inches square Speed (temperature ramp rates) 12ºF/min heating 40ºF/min cooling Temperature and Pressure Controls 400ºF max. 50 psia max. Prototyped workholding fixed clamp frame proves to hold a circuit board by the edges. Acknowledgements We sincerely appreciate everyone who has given us the opportunity to have a successful senior design. Special thanks to our sponsors at Arlon for their support in this project. Also, thank you Ann Connor, Mr. Beard, and Dr. Glancey for your guidance and instruction. New design for workholding mechanism will retract clamps.