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RoHS Compliance

RoHS Compliance. Add Corporate Logo Here. Updated: Jul. 25, 2011. Definition. R estriction o f certain H azardous S ubstances. POLICY. Retention of Current Models Creation of New Models for RoHS Compliance Drop-in replacement. WHY ??.

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RoHS Compliance

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  1. RoHS Compliance Add CorporateLogoHere Updated: Jul. 25, 2011

  2. Definition • R estriction • o f certain • H azardous • S ubstances

  3. POLICY • Retention of Current Models • Creation of New Models for RoHS Compliance • Drop-in replacement

  4. WHY ?? • Mini-Circuits is ISO-14001 Certified and is committed to a Greener environment • Restricted Substances are potential hazards to health and the environment • INCREASING CUSTOMER DEMAND

  5. Standard • Mini-Circuits will meet the requirements as stated in the European Union Directive (2002/95/EC) • Mini-Circuits will provide compliant parts prior to the July 2006 deadline • Policy includes ‘total’ compliance, not just Lead-free

  6. Restricted Substances • Lead (Pb) - platings, surface finishes • Mercury (Hg) - not applicable • Cadmium (Cd) - capacitors, ceramics • Hexavalent Chromium (CrVI) - chromate conversion finish of aluminum • PBB - flame retardant • PBDE - flame retardant

  7. Customer Inquiries • Web Page devoted to RoHS/Pb-free • Includes Letter of Introduction • Policy • FAQ Sheet • List of RoHS Compliant Model Families • ROHS@MINICIRCUITS.COM • Material Declarations, in Excel format (see sample at end of slide)

  8. Product Identification • All RoHS Compliant models will have part numbers ending in “ + “ suffix. • “+” suffix to appear on models where marking is done. • “ + “ Part numbers and symbol will appear on all labels and packaging. • Implementation of JESD97 2nd level interconnect (e) labeling. Pb

  9. Alternatives • Getting the ‘Lead Out’ • SAC solders • Matte Tin over Nickel on Leadframes and Chip Components • ENIG (electroless nickel immersion gold) on ‘soft’ PCBs • Tin/Silver/Nickel on MMIC leadframes • Tin/Silver on pin headers

  10. Alternatives(cont’d) • Cadmium • Cadmium-free capacitors • Cadmium-free ceramics • Hexavalent Chromium • Trivalent “Alodyne” • Phosphating • Gold Plating

  11. Process/Reliability Issues • Pb-free solders require higher Peak Reflow Temperatures. • RoHS Compliant parts will meet J-Std-020C Reflow profile requirement. • No change in MSL is anticipated • Testing for Joint Reliability and Tin Whiskers

  12. Example of Material Declaration • ADE-1+

  13. Sample of Material Declaration

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