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RoHS Compliant & Green Components. Content. Environmentally Friendly Materials Drivers Legislation AMIS RoHS & Green Component Definition Hazardous Substances in Current Components Re-Flow Profile for Moisture Sensitivity Assessment Impact Pb-Free Solder on Package Construction

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Rohs compliant green components

RoHS Compliant &Green Components


Content
Content

  • Environmentally Friendly Materials Drivers

  • Legislation

  • AMIS RoHS & Green Component Definition

  • Hazardous Substances in Current Components

  • Re-Flow Profile for Moisture Sensitivity Assessment

  • Impact Pb-Free Solder on Package Construction

  • AMIS Changes in Bill of Assembly Materials

  • Qualification Stress Test Conditions

  • Product Marking and Labeling

  • AMIS RoHS-Green Qualification Status


Environmentally friendly materials drivers
Environmentally Friendly Materials Drivers

  • RoHS Directive 2002/95/EC Effective July, 2006

    • Lead Pb < 1000 ppm

    • Mercury Hg < 1000 ppm

    • Cadmium Cd < 100 ppm

    • Hexavalent Chromium Cr+6 < 1000 ppm

    • Polybrominated Biphenyl PBB < 1000 ppm

    • Polybrominated Diphenyl Ether PBDE < 1000 ppm

  • Market Pressure

    • Japanese Consumers Demand Green Components

    • New Designs for Consumer Products are all Green

  • High Temperature Applications

    • Solders Required for Harsh Environments

      • Automotive

      • Avionics

    • High Ambient Temperature Applications for well Defined Duration


Worldwide legislation
Worldwide Legislation

RoHS(Restriction of Hazardous Substances)

Pb, Hg, Cd, Cr+6

PBB & PBDE

JGPSSI (Japan Green Procurement Survey Standard Initiative)

Pb, Hg, Cd, Cr+6

PBB, PBDE, TBBP-A-bis

Chlorinated Organic Compound PCB, PCN, CP, Mirex

Organic Sn Compound

Asbestos

Azo

Formaldehyde

PVC & PVC Blends

Situation of Banned Substances in the World

  • Different Definitions & Thresholds arebeing Debated in EU, Japan & US

  • Whether all Worldwide Brominated Substances or only Specified Types will be Banned is still Unclear


Japanese legislation
Japanese Legislation

  • Japanese

    • The Japanese Ministry of Trade (MITI) Passed a Recycling Law for Electrical Appliances with Effect from April 2001

    • This Suggests but does not Include Lead Phase-out Timetable

    • OEM's are Removing Lead from Electronics Mainly due to Market Pressures

    • The JGPSSI (Japan Green Procurement Survey Standard Initiative) is Followed by many OEM’s


Eu legislation
EU Legislation

Applicable for:

Large Household Appliances

Small Household Appliances

IT & Telecom Equipment

Consumer Equipment

Lighting Equipment

Electrical & Electronic Tools

Toys, Leisure & Sports Equipment

Medical Equipment Systems

Monitoring & Control Instruments

Automatic Dispensers

Who is Exempt:

Medical Implanted &Injected Products

Pb in Servers, Storage & Storage Systems until 2010

Large Stationary Industrial Tools

Pb in High-End Manufacturing & Telecommunications Products

Automotive, Aerospace, Military

  • Directive 2002/95/EC (RoHS)

  • Proposal for an Directive on Eco-Design of End-Use Equipment (EUP) that will havesome Regard to Hazardous Materials in Equipment


United states legislation
United States Legislation

  • United States

    • Although a Number of States are Heading Towards Lead-Free and/or Recycling Regulation There is not yet a Published Federal Position

    • In September 2003 California Enacted an E-Waste Recycling Bill

    • The EPA (Environmental Protection Administration) has Proposed a Crack-down on Lead Emissions from Plants that may Impact the Soldering Industry


Amis rohs green definition
AMIS RoHS & Green Definition

  • RoHS Compliant = AMIS Pb-Free

    • Pb < 1000 ppm

    • Hg < 1000 ppm

    • Cd < 100 ppm

    • Cr+6 < 1000 ppm

    • Polybrominated Biphenyl < 1000 ppm

    • Polybrominated Diphenyl Ether < 1000 ppm

  • Full Green = AMIS Green

    • All of the Above Requirements Plus

      • Bromine < 900 ppm

      • Chlorine < 900 ppm

      • Antimony < 900 ppm

      • Tributyltin Oxide Not Used

      • Phosphorus Not Used


Hazardous substances in current compounds
Hazardous Substances inCurrent Compounds

DIE

DIE

DIE

Laminated Package

Leaded Package

  • Pb as Solder Plated Leads or Balls of Packages

    • Pb Content Solder Plated Leads: 0.1 – 0.3% by Weight

    • Pb Content Solder Balls of BGA Packages: 4.9% by Weight

  • Bromide &/or Antimonated Flame Retardant of Epoxy Molding Compound

    • Bromide Content: 0.2 – 1.8% by Weight

    • Antimony Content: 0.3 – 0.7% by Weight

Solder Balls

Solder Lead Finish


Re flow profile for moisture sensitivity assessment
Re-Flow Profile for Moisture Sensitivity Assessment

IPC/JEDEC J-STD-020B

AMIS

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Profile Feature

Large Body

Small Body

Large Body

Small Body

Large Body

Small Body

Large Body

Small Body

Average ramp-up rate(TL to Tp)

3ºC/second Max.

3ºC/second Max.

3ºC/second Max.

3ºC/second Max.

100ºC150ºC60-120 Seconds

150ºC200ºC60-180 Seconds

100ºC150ºC60-120 Seconds

150ºC200ºC60-120 Seconds

Preheat

  • Temperature Min. (Tsmin)

  • Temperature Max. (Tsmax)

  • Time (Min. to Max.)(ts)

Tsmax to TL

3ºC/second Max.

1-2ºC/second Max.

1.5-2.5ºC/second Max.

  • Ramp-up Rate

  • Time Maintained Above:

  • Temperature (TL)

  • Time (tL)

183ºC60-150 Seconds

217ºC60-150 Seconds

183ºC60-150 Seconds

217ºC60-150 Seconds

225 +0/-5ºC

240 +0/-5ºC

245 +0/-5ºC

250 +0/-5ºC

225 +0/-5ºC

240 +0/-5ºC

260 +0/-5ºC

260 +0/-5ºC

Peak Temperature (Tp)

Time Within 5ºC of Actual Peak Temp. (tp)

10-30 seconds

10-30 seconds

10-30 seconds

20-40 seconds

10-30 seconds

10-30 seconds

10-30 seconds

20-40 seconds

Ramp-down Rate

6ºC/second Max.

6ºC/second Max.

6ºC/second Max.

6ºC/second Max.

Time 25ºC to Peak Temp.

6 Minutes Max.

8 Minutes Max.

6 Minutes Max.

8 Minutes Max.

AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5°C


Re flow profile for moisture sensitivity assessment1
Re-Flow Profile for Moisture Sensitivity Assessment

AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5°C


Impact pb free solder on package construction
Impact Pb-Free Solder onPackage Construction

Laminated Package

Leaded Package

DIE

DIE

DIE

Solder Lead Finish

Solder Balls

  • Exposure to Higher Solder Temperatures

    • The Impact from 220 to 240 or260°C Solder Temperatures

  • Solderability

    • The Interaction Between the Pb-free Component Finish & Solder Paste

  • Interface Adhesion Between Materials

    • The Higher Probability that Interfaces will Separate as they are Exposed to the High Solder Temperature

  • Thermal Stability in Compound/Die Attach/Substrate

  • Electrical Contact Resistance


Changes in bill of assembly materials
Changes in Bill of Assembly Materials

  • Lead Frame Packages = AMIS goes Green

    • New Materials for Die Attach & Mold

      • Materials that Withstand 260°C

      • Halogen Free Materials

    • Lead Finish

      • Pure Sn Plating is Selected as Solution

      • Pure Sn is the most Mainstream Solution

      • Post plate bake is part of the AMIS process flow and demonstrated good results as whisker mitigation process

      • NiPdAu is available as an alterative finish option


Changes in bill of assembly materials1
Changes in Bill of Assembly Materials

  • Laminate Packages = AMIS goes RoHS Compliant

    • Existing Substrates are RoHS Compliant & Qualified

    • Green Substrates are Available but more Expensive & not yet Qualified

    • New Materials for Die Attach & Mold

      • Materials that Withstand 260°C

      • Halogen Free Materials

    • Lead Finish

      • Sn- 4.0Ag- 0.5Cu has been Selected (most std at Subs)


Qualified stress test conditions
Qualified Stress Test Conditions

AEC – Q100 REV-F

AMIS

Part OperatingTemperature Grades

Grade 0

(- 40 / 150°C)

Grade 1

(- 40 / 125°C)

Grade 2

(- 40 / 105°C)

Grade 0

(- 40 / 150°C)

Grade 1

(- 40 / 125°C)

Per J-STD-020 Minimum Level 2260ºC max. Re-Flow Temperature

Preconditioning

Per J-STD-020 for SMD components

HAST 130°C / 85% / Bias – 96 hrsFor Product Qualifications

THB or HAST

85°C / 85% / Bias – 1000 hrs

Autoclave or unbiased HAST

121°C / 100% – 96 hrsFor Package Qualifications

121°C / 100% – 96 hrs

HAST 130°C / 85% – 96 hrs

- 65/175°C, 500x

- 65/175°C, 1000x

- 65/150°C, 500x

- 65/150°C, 1000x

Temp Cycle

- 65/175°C, 500x

- 50/175°C, 1000x

- 50/150°C, 2000x

- 65/150°C, 500x

- 50/150°C, 1000x

- 50/150°C, 500x

- 50/125°C, 1000x

- 40/150°C, 1000x

- 40/125°C, 1000x

- 40/105°C, 1000x

- 40/150°C, 1000x

- 40/125°C, 1000x

Power Temp Cycle

175°C, 1000 hrs

175°C, 2000 hrs

150°C, 1000 hrs

150°C, 2000 hrs

High Temp Storage Life (plastic pkg)

175°C, 1000 hrs

150°C, 2000 hrs

150°C, 1000 hrs

175°C, 500 hrs

125°C, 1000 hrs

150°C, 500 hrs


Amis rohs green qualification status
AMIS RoHS-GreenQualification Status


Product marking labeling
Product Marking & Labeling

  • In Alignment with JESD97

    • Components Contain Pb-Free Category Code

    • Labels Contain

      • Pb Free Category Code

      • Safe Maximum Temperature

      • Moisture Sensitivity Level


Amis rohs green project status
AMIS RoHS-Green Project Status

  • The Majority of the Packages Offered by AMIS are Green or RoHS Qualified

  • AMIS will Continue to Provide Non-RoHS & Non-Green Products unless Requested Differently

  • Green & RoHS Compliant Product is Available Upon Request

    • Contact AMIS Sales for more Information

  • AMIS Operational Systems have been Adjusted to Recognize & Distinguish Green & RoHS Compliant Product from the Existing Production


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