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RoHS Compliant & Green Components. Content. Environmentally Friendly Materials Drivers Legislation AMIS RoHS & Green Component Definition Hazardous Substances in Current Components Re-Flow Profile for Moisture Sensitivity Assessment Impact Pb-Free Solder on Package Construction

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content
Content
  • Environmentally Friendly Materials Drivers
  • Legislation
  • AMIS RoHS & Green Component Definition
  • Hazardous Substances in Current Components
  • Re-Flow Profile for Moisture Sensitivity Assessment
  • Impact Pb-Free Solder on Package Construction
  • AMIS Changes in Bill of Assembly Materials
  • Qualification Stress Test Conditions
  • Product Marking and Labeling
  • AMIS RoHS-Green Qualification Status
environmentally friendly materials drivers
Environmentally Friendly Materials Drivers
  • RoHS Directive 2002/95/EC Effective July, 2006
    • Lead Pb < 1000 ppm
    • Mercury Hg < 1000 ppm
    • Cadmium Cd < 100 ppm
    • Hexavalent Chromium Cr+6 < 1000 ppm
    • Polybrominated Biphenyl PBB < 1000 ppm
    • Polybrominated Diphenyl Ether PBDE < 1000 ppm
  • Market Pressure
    • Japanese Consumers Demand Green Components
    • New Designs for Consumer Products are all Green
  • High Temperature Applications
    • Solders Required for Harsh Environments
      • Automotive
      • Avionics
    • High Ambient Temperature Applications for well Defined Duration
worldwide legislation
Worldwide Legislation

RoHS(Restriction of Hazardous Substances)

Pb, Hg, Cd, Cr+6

PBB & PBDE

JGPSSI (Japan Green Procurement Survey Standard Initiative)

Pb, Hg, Cd, Cr+6

PBB, PBDE, TBBP-A-bis

Chlorinated Organic Compound PCB, PCN, CP, Mirex

Organic Sn Compound

Asbestos

Azo

Formaldehyde

PVC & PVC Blends

Situation of Banned Substances in the World

  • Different Definitions & Thresholds arebeing Debated in EU, Japan & US
  • Whether all Worldwide Brominated Substances or only Specified Types will be Banned is still Unclear
japanese legislation
Japanese Legislation
  • Japanese
    • The Japanese Ministry of Trade (MITI) Passed a Recycling Law for Electrical Appliances with Effect from April 2001
    • This Suggests but does not Include Lead Phase-out Timetable
    • OEM\'s are Removing Lead from Electronics Mainly due to Market Pressures
    • The JGPSSI (Japan Green Procurement Survey Standard Initiative) is Followed by many OEM’s
eu legislation
EU Legislation

Applicable for:

Large Household Appliances

Small Household Appliances

IT & Telecom Equipment

Consumer Equipment

Lighting Equipment

Electrical & Electronic Tools

Toys, Leisure & Sports Equipment

Medical Equipment Systems

Monitoring & Control Instruments

Automatic Dispensers

Who is Exempt:

Medical Implanted &Injected Products

Pb in Servers, Storage & Storage Systems until 2010

Large Stationary Industrial Tools

Pb in High-End Manufacturing & Telecommunications Products

Automotive, Aerospace, Military

  • Directive 2002/95/EC (RoHS)
  • Proposal for an Directive on Eco-Design of End-Use Equipment (EUP) that will havesome Regard to Hazardous Materials in Equipment
united states legislation
United States Legislation
  • United States
    • Although a Number of States are Heading Towards Lead-Free and/or Recycling Regulation There is not yet a Published Federal Position
    • In September 2003 California Enacted an E-Waste Recycling Bill
    • The EPA (Environmental Protection Administration) has Proposed a Crack-down on Lead Emissions from Plants that may Impact the Soldering Industry
amis rohs green definition
AMIS RoHS & Green Definition
  • RoHS Compliant = AMIS Pb-Free
    • Pb < 1000 ppm
    • Hg < 1000 ppm
    • Cd < 100 ppm
    • Cr+6 < 1000 ppm
    • Polybrominated Biphenyl < 1000 ppm
    • Polybrominated Diphenyl Ether < 1000 ppm
  • Full Green = AMIS Green
    • All of the Above Requirements Plus
      • Bromine < 900 ppm
      • Chlorine < 900 ppm
      • Antimony < 900 ppm
      • Tributyltin Oxide Not Used
      • Phosphorus Not Used
hazardous substances in current compounds
Hazardous Substances inCurrent Compounds

DIE

DIE

DIE

Laminated Package

Leaded Package

  • Pb as Solder Plated Leads or Balls of Packages
    • Pb Content Solder Plated Leads: 0.1 – 0.3% by Weight
    • Pb Content Solder Balls of BGA Packages: 4.9% by Weight
  • Bromide &/or Antimonated Flame Retardant of Epoxy Molding Compound
    • Bromide Content: 0.2 – 1.8% by Weight
    • Antimony Content: 0.3 – 0.7% by Weight

Solder Balls

Solder Lead Finish

re flow profile for moisture sensitivity assessment
Re-Flow Profile for Moisture Sensitivity Assessment

IPC/JEDEC J-STD-020B

AMIS

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Profile Feature

Large Body

Small Body

Large Body

Small Body

Large Body

Small Body

Large Body

Small Body

Average ramp-up rate(TL to Tp)

3ºC/second Max.

3ºC/second Max.

3ºC/second Max.

3ºC/second Max.

100ºC150ºC60-120 Seconds

150ºC200ºC60-180 Seconds

100ºC150ºC60-120 Seconds

150ºC200ºC60-120 Seconds

Preheat

  • Temperature Min. (Tsmin)
  • Temperature Max. (Tsmax)
  • Time (Min. to Max.)(ts)

Tsmax to TL

3ºC/second Max.

1-2ºC/second Max.

1.5-2.5ºC/second Max.

  • Ramp-up Rate
  • Time Maintained Above:
  • Temperature (TL)
  • Time (tL)

183ºC60-150 Seconds

217ºC60-150 Seconds

183ºC60-150 Seconds

217ºC60-150 Seconds

225 +0/-5ºC

240 +0/-5ºC

245 +0/-5ºC

250 +0/-5ºC

225 +0/-5ºC

240 +0/-5ºC

260 +0/-5ºC

260 +0/-5ºC

Peak Temperature (Tp)

Time Within 5ºC of Actual Peak Temp. (tp)

10-30 seconds

10-30 seconds

10-30 seconds

20-40 seconds

10-30 seconds

10-30 seconds

10-30 seconds

20-40 seconds

Ramp-down Rate

6ºC/second Max.

6ºC/second Max.

6ºC/second Max.

6ºC/second Max.

Time 25ºC to Peak Temp.

6 Minutes Max.

8 Minutes Max.

6 Minutes Max.

8 Minutes Max.

AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5°C

re flow profile for moisture sensitivity assessment1
Re-Flow Profile for Moisture Sensitivity Assessment

AMIS Solder Peak Temperature for Pb-Free is 260 +0/-5°C

impact pb free solder on package construction
Impact Pb-Free Solder onPackage Construction

Laminated Package

Leaded Package

DIE

DIE

DIE

Solder Lead Finish

Solder Balls

  • Exposure to Higher Solder Temperatures
    • The Impact from 220 to 240 or260°C Solder Temperatures
  • Solderability
    • The Interaction Between the Pb-free Component Finish & Solder Paste
  • Interface Adhesion Between Materials
    • The Higher Probability that Interfaces will Separate as they are Exposed to the High Solder Temperature
  • Thermal Stability in Compound/Die Attach/Substrate
  • Electrical Contact Resistance
changes in bill of assembly materials
Changes in Bill of Assembly Materials
  • Lead Frame Packages = AMIS goes Green
    • New Materials for Die Attach & Mold
      • Materials that Withstand 260°C
      • Halogen Free Materials
    • Lead Finish
      • Pure Sn Plating is Selected as Solution
      • Pure Sn is the most Mainstream Solution
      • Post plate bake is part of the AMIS process flow and demonstrated good results as whisker mitigation process
      • NiPdAu is available as an alterative finish option
changes in bill of assembly materials1
Changes in Bill of Assembly Materials
  • Laminate Packages = AMIS goes RoHS Compliant
    • Existing Substrates are RoHS Compliant & Qualified
    • Green Substrates are Available but more Expensive & not yet Qualified
    • New Materials for Die Attach & Mold
      • Materials that Withstand 260°C
      • Halogen Free Materials
    • Lead Finish
      • Sn- 4.0Ag- 0.5Cu has been Selected (most std at Subs)
qualified stress test conditions
Qualified Stress Test Conditions

AEC – Q100 REV-F

AMIS

Part OperatingTemperature Grades

Grade 0

(- 40 / 150°C)

Grade 1

(- 40 / 125°C)

Grade 2

(- 40 / 105°C)

Grade 0

(- 40 / 150°C)

Grade 1

(- 40 / 125°C)

Per J-STD-020 Minimum Level 2260ºC max. Re-Flow Temperature

Preconditioning

Per J-STD-020 for SMD components

HAST 130°C / 85% / Bias – 96 hrsFor Product Qualifications

THB or HAST

85°C / 85% / Bias – 1000 hrs

Autoclave or unbiased HAST

121°C / 100% – 96 hrsFor Package Qualifications

121°C / 100% – 96 hrs

HAST 130°C / 85% – 96 hrs

- 65/175°C, 500x

- 65/175°C, 1000x

- 65/150°C, 500x

- 65/150°C, 1000x

Temp Cycle

- 65/175°C, 500x

- 50/175°C, 1000x

- 50/150°C, 2000x

- 65/150°C, 500x

- 50/150°C, 1000x

- 50/150°C, 500x

- 50/125°C, 1000x

- 40/150°C, 1000x

- 40/125°C, 1000x

- 40/105°C, 1000x

- 40/150°C, 1000x

- 40/125°C, 1000x

Power Temp Cycle

175°C, 1000 hrs

175°C, 2000 hrs

150°C, 1000 hrs

150°C, 2000 hrs

High Temp Storage Life (plastic pkg)

175°C, 1000 hrs

150°C, 2000 hrs

150°C, 1000 hrs

175°C, 500 hrs

125°C, 1000 hrs

150°C, 500 hrs

product marking labeling
Product Marking & Labeling
  • In Alignment with JESD97
    • Components Contain Pb-Free Category Code
    • Labels Contain
      • Pb Free Category Code
      • Safe Maximum Temperature
      • Moisture Sensitivity Level
amis rohs green project status
AMIS RoHS-Green Project Status
  • The Majority of the Packages Offered by AMIS are Green or RoHS Qualified
  • AMIS will Continue to Provide Non-RoHS & Non-Green Products unless Requested Differently
  • Green & RoHS Compliant Product is Available Upon Request
    • Contact AMIS Sales for more Information
  • AMIS Operational Systems have been Adjusted to Recognize & Distinguish Green & RoHS Compliant Product from the Existing Production
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