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H Diffusion in Cu: Bonding

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H Diffusion in Cu: Bonding. H Diffusion in Cu: Bonding. Second Fick’s law. Diffusion in a plane sheet. H 2. H2. H2. H Diffusion in Cu: Second Fick’s law. semi-infinite material 1-D concentration profile. H 2. x. H Diffusion in Cu: Second Fick’s law. Solubility :

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h diffusion in cu bonding1
H Diffusion in Cu: Bonding
  • Second Fick’s law
  • Diffusion in a plane sheet

H2

H2

H2

h diffusion in cu second fick s law
H Diffusion in Cu: Second Fick’s law
  • semi-infinite material
  • 1-D concentration profile

H2

x

h diffusion in cu second fick s law1
H Diffusion in Cu: Second Fick’s law
  • Solubility :
  • Diffusion :
h diffusion in cu bonding plateau
H Diffusion in Cu: Bonding plateau

0.000119 wt%

1.2 ppm

C0 =0

h diffusion in cu diffusion in a plane sheet
H Diffusion in Cu: Diffusion in a plane sheet
  • n = 1,2,3,4
  • Cs equal and constant at the surfaces

H2

H2

h diffusion in cu bonding ramp down
H Diffusion in Cu: Bonding ramp down
  • 1040 – 800 °C
  • 4 °C/min
  • C0(T) = C(T - 4°C)

4°C

60 s

h diffusion in cu bonding ramp down1
H Diffusion in Cu: Bonding ramp down
  • C(800 °C) = 4.63234E-05 % wt (0.46 ppm)
h diffusion in cu thermal treatment after bonding
H Diffusion in Cu: thermal treatment after bonding
  • 10 d, @ 650 °C
  • C0=C(x) @ 800 °C
  • Cs= CH2 in the oven (10^-8 mBar)
next steps
Next steps
  • search for thermodynamics data @ room temperature
  • check the ramp down to 20°C
  • calculate the effective content of H in Cu
solubility of h in cu
Solubility of H in Cu

Sieverts`s Law

H2

Hp Ideal Gas

solubility of h in cu1
Solubility of H in Cu
  • Cu is an endothermic material
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