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H Diffusion in Cu: Bonding. H Diffusion in Cu: Bonding. Second Fick’s law. Diffusion in a plane sheet. H 2. H2. H2. H Diffusion in Cu: Second Fick’s law. semi-infinite material 1-D concentration profile. H 2. x. H Diffusion in Cu: Second Fick’s law. Solubility :

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H diffusion in cu bonding1
H Diffusion in Cu: Bonding

  • Second Fick’s law

  • Diffusion in a plane sheet

H2

H2

H2


H diffusion in cu second fick s law
H Diffusion in Cu: Second Fick’s law

  • semi-infinite material

  • 1-D concentration profile

H2

x


H diffusion in cu second fick s law1
H Diffusion in Cu: Second Fick’s law

  • Solubility :

  • Diffusion :


H diffusion in cu bonding plateau
H Diffusion in Cu: Bonding plateau

0.000119 wt%

1.2 ppm

C0 =0



H diffusion in cu diffusion in a plane sheet
H Diffusion in Cu: Diffusion in a plane sheet

  • n = 1,2,3,4

  • Cs equal and constant at the surfaces

H2

H2



H diffusion in cu bonding ramp down
H Diffusion in Cu: Bonding ramp down

  • 1040 – 800 °C

  • 4 °C/min

  • C0(T) = C(T - 4°C)

4°C

60 s


H diffusion in cu bonding ramp down1
H Diffusion in Cu: Bonding ramp down

  • C(800 °C) = 4.63234E-05 % wt (0.46 ppm)


H diffusion in cu thermal treatment after bonding
H Diffusion in Cu: thermal treatment after bonding

  • 10 d, @ 650 °C

  • C0=C(x) @ 800 °C

  • Cs= CH2 in the oven (10^-8 mBar)



Next steps
Next steps

  • search for thermodynamics data @ room temperature

  • check the ramp down to 20°C

  • calculate the effective content of H in Cu


Solubility of h in cu
Solubility of H in Cu

Sieverts`s Law

H2

Hp Ideal Gas


Solubility of h in cu1
Solubility of H in Cu

  • Cu is an endothermic material



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