Wafer Bonding. By:- Nishant Malik. Contents. Introduction to wafer bonding Classification Fusion Bonding Anodic Bonding Thermocompression Bonding Eutectic Bonding Glass Frit Bonding Adhesive Bonding Comparison. Introduction.
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By:- Nishant Malik
Used in IC packaging and printed circuit board assembly. Will not be covered in this lecture.
(b) Hydrophobic bonding
The physics of glass frit bonding is related to the glass chemistry .
When the glass wets the surface to be bonded at high temperature, thin layers of the material to be bonded are fused into the glass, so that finally after cooling, a continuous material interaction occurs which forms a strong bond.
Optimal process temperature & pressure(insufficient spreading/overflow).