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Stanford. HP. MIT. Startup X. UCB. users. Information. vendors. Chips. Mask maker. Dicing and packaging. Orbit 2um. HP 0.5um. Foundry Services: MOSIS as a model. MOSIS: MOS implementation service, ISI, 1980. MOSIS. $$$$$. Foundry Services and Standard Processes.

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Foundry services mosis as a model

Stanford

HP

MIT

Startup X

UCB

users

Information

vendors

Chips

Mask

maker

Dicing and

packaging

Orbit

2um

HP

0.5um

Foundry Services: MOSIS as a model

  • MOSIS: MOS implementation service, ISI, 1980.

MOSIS

$$$$$


Foundry services and standard processes
Foundry Services and Standard Processes

  • MCNC/MUMPS (now by Cronos)

    • 3 level poly, no electronics

    • started in 1992, now 6 runs per year

  • LIGAMUMPS

    • single level metal, no electronics

  • Sandia

    • 5 level poly, no electronics

    • 1 level poly w/ quality CMOS

  • CMOS + post-processing

    • EDP, TMAH, XeF2 (Parameswaran)

    • Plasma (Fedder)









Design rules
Design “Rules”

  • Guidelines for communication between fab people and design people

  • Generally not enforced

    • MUMPS, 2um CMOS: no

    • HP sub-micron CMOS: yes

  • Often desireable to violate

    • MUMPS: process exploration, new devices, some previous design rule violations are now encouraged

    • CMOS: Parameswaran, Fedder style MEMS depends on design rule violations


Design rules1

Line width

... and spacing

Design Rules

  • Typically due to

    • lithographic resolution limits

    • lithographic alignment repeatability

    • etching capabilities

  • Most important: Line/space

    • due to lithography or etching

    • varies from layer to layer

    • varies near topography

    • no guarantee of dimensions: the lines will exist and be distinct.



Mcnc mumps design rules
MCNC/MUMPS Design Rules

Rules for line/space on all mask layers.



Mcnc mumps design rules2
MCNC/MUMPS Design Rules

Examples for POLY2 from

mems.mcnc.org/smumps/mrules


Breaking the rules
Breaking the Rules

  • Sub-minimum lithography

    • risky, but often successful, especially in planar areas

  • Breaching nitride (substrate contacts and opens)

    • Stack anchor1 and poly1-poly2-via

    • don’t include poly1

    • include poly2 for electrical contact to substrate, or remove to expose bare substrate

  • Double-thick poly

    • continuous sheet of poly1 enclosed in poly1-poly2-via

    • poly2 structures on top


Mcnc mumps access
MCNC/MUMPS access

  • Cost is $3,500 per submission

    • 1cm2 die area per submission

    • 15 identical dice returned (~$2/mm2)

  • Files are submitted by anonymous ftp

  • Dicing, bonding, HF release are all available for additional cost

  • Parameterized and static design cells are free online (CaMEL)

  • Design services are available for additional cost


Mcnc mumps process specs
MCNC/MUMPS process specs

Polys are compressive, nitride

and metal (Cr/Au) are tensile.


Mcnc ligamumps
MCNC/LIGAMUMPS


Mcnc ligamumps design rules
MCNC/LIGAMUMPS Design Rules

A, W, L must be greater than or equal to 20.0 microns.

Photoresist aspect ratio, L/W, must be less than or equal to 10.


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