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Accelerator Prototyping Through Multi-physics Analysis

Accelerator Prototyping Through Multi-physics Analysis. Volkan Akcelik, Lie-Quan Lee , Ernesto Prudencio, Cho Ng, Zenghai Li, Kwok Ko Advanced Computations Department Stanford Linear Accelerator Center. Work supported by DOE ASCR, BES & HEP Divisions under contract DE-AC02-76SF00515.

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Accelerator Prototyping Through Multi-physics Analysis

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  1. Accelerator Prototyping Through Multi-physics Analysis Volkan Akcelik, Lie-Quan Lee, Ernesto Prudencio, Cho Ng, Zenghai Li, Kwok Ko Advanced Computations Department Stanford Linear Accelerator Center Work supported by DOE ASCR, BES & HEP Divisions under contract DE-AC02-76SF00515 COMPASS All-Hands Meeting, FNAL, Sept. 17-18, 2007

  2. Multi-physics Analysis for Accelerator Components • Virtual prototyping through computing • Thermal and mechanical analysis as important as EM analysis • EM heating, Thermal radiation, Lorentz force detuning, Mechanical stress • Augmented by additional physics • particle effects including emittance and multipacting • Nonlinear and transit effects in superconducting cavity design • Accurate and reliable multi-physics simulation requires large-scale parallel computing: TEM3P 2

  3. TEM3P: Multi-Physics Analysis • Finite element based with higher-order basis functions • Natural choice: FEM originated from structural analysis! • Use the same software infrastructure as Omega3P • Reuse solvers framework • Mesh data structures and format • Parallel CAD Model EM Analysis Thermal Analysis Mechanical Analysis 3

  4. TEM3P for LCLS RF Gun CAD Model (courtesy of Eric Jongewaard) Benchmark TEM3P against ANSYS Thermal/Mechanical Domain EM Domain 4

  5. RF Gun EM analysis 1st mode 2.8411 GHz • The second mode is operating mode • Its magnetic field on the cavity inner surface generates heating! 2nd mode 2.8561 GHz 5

  6. Mesh for Thermal/Mechanical analysis Mesh: 0.6 million nodes. Materials: Copper + Stainless steel Thermal analysis: 7 cooling channels EM Heating 6

  7. Parameters for Thermal Analysis • TEM3P: cooling channels modelled as Robin BC • 7 cooling channels • specific temperatures and film coefficients • Thermal load from EM power loss (4000 Watt) • EM Heating BC • Thermal conductivity for copper 391 • Thermal conductivity for stainless steel 16.2 • Other surfaces modelled as homogeneous Neumann BC 7

  8. Thermal Analysis loaded with EM Heating Temperature Distribution TEM3P ANSYS Maximal Temperature 49.82 C Maximal Temperature 49.96 C 8

  9. Mechanical Analysis with Thermal Load ANSYS TEM3P Maximal displacement: 37.10 m Maximal displacement: 36.99 m • Future work: compute stress and shifted frequency due to geometry change 9

  10. Multi-physics Analysis for SRF Cavities and Cryomodules • Thermal behaviors near superconducting region are highly nonlinear • SRF Cavity wall is very thin • Anisotropic high-order mesh will reduce significant amount of computing • Working with RPI/ITAPS 10

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