CMS Pixel Upgrade Status and Outlook

1. CMS Pixel Upgrade status and outlook G.M. Bilei Sep. 6th 2011

2. Pixel Upgrade motivations and requirements • The present Pixel detector is working very well and was designed 10 years ago and • built to operate up to a maximum luminosity of ~ 1x1034 cm-2 s-1 • Some limitations (4-5% data losses in inner region) in the Readout Chip will start becoming • evident already at ~ 1x1034 cm-2 s-1 • LHC is planning to increase luminosity in the years 2018-2020 up to 2 - 2.5 x1034 cm-2 s-1 • after 1 year shutdown in 2017. • After 1x1034 cm-2 s-1data losses of the present ROC would deteriorate to un unacceptable level • (~ 15%) at 2x1034cm-2 s-1 (or 50% !! if the machine will run with 50 ns bunch spacing and higher current /bunch) leading to a major degradation of Tracking performance. • Under these conditions, the ability of CMS to continue to deliver Physics and benefiting of • higher luminosity will be seriously compromised. • The main goal of upgrading the pixel detector in 2017 is thus to maintain high level of • Tracking performances until the end of Phase I e.g. up to 2 – 2.5 x1034 cm-2 s-1 • The necessity of replacing the Pixel detector will allow us to design and built a new system • fully benefiting of the technological advances that took place in the past 10 years enabling • the construction of an overall more performing system. G.M. Bilei

3. INFN Contribution : Half Layer 3 Interest to contribute to a part of BPixlayer 3. Final sharing among countries in discussion and will be available at the time of TDR Half Layer 22 faces 8 modules/faces =176 modules Needs  250 modules allowing for 80% yield and 15% spares G.M. Bilei 3

4. INFN Contribution: Pixel Chip developments • The new Pixel detector will need to replace the inner layer once during its period • of operation. • Plan to develop components for the inner layer (ROC and sensors) looking at • requirement for high luminosity. • Design of new readout chip (in 130 nm or lower CMOS technology) with objectives: • able to sustain up Phase II high luminosity with reduced data losses, • with smaller pitch and lower thresholds. • Participate to the development of diamond sensors. • Good kickoff meeting in Torino end of May. Work ongoing. • Discussion last July Pixel meeting: the need to start this activity emerged clearly within the collaboration. • Establishing a working team of Physicist and Engineers (INFN/US+others) • Open discussion will be held during the next Pixel Meeting on Oct. 10-14 G.M. Bilei 4

5. Some news since April • ROC PSI46dig on track - Engineering run will be submitted in Nov. 2011. • Test beam with single chips to verify functionality and rate sustainability under discussion • (likely late spring 2012) • Control chip Token Bit Manager (TBM) good progress - will be submitted in • July 2012. • Plan to build some new real Pixel modules toward the end of 2012. • Plan to setup and qualify production sites over the next 12-16 months. • Beam pipe – decision on beam pipe radius taken (45mm from present 58mm) • Pixel TDR – write up has just started. • Simulations – Work continues on performance studies with more realist geometry and to assess the impact of the new detector on some Physics channels. G.M. Bilei

6. New beam pipe radius and plan Good progress on beam pipe studies New beam pipe diameter reduced to 45 mm from 58 Beam Pipe installation during LS1 end of 2013. Detailed plan available for tendering, construction, checks and installation 1st layer mean Si- radius ~ 29 mm from the actual 44 mm. In the Technical Proposal we had a conservative 39 mm beam pipe due to some uncertainties that have now been addressed. G.M. Bilei

7. INFN Pixel upgrade current activities INFN Gruppo I provided provisional green light to CMS Pixel upgrade activities in April 2011 and allocated 50 k€ to start setting up the activities. About 30 k€ distributed among Perugia, Pisa, Bari and Catania to get the most urgent material/equipment to start the setting up of the various centers (electronic readout cards, probe cards for sensors and readout chips, to develop programmable cooling box, etc see next slide) About 20 k€ allocated to purchase non available material (sensors, HDI etc) to produce some old Pixel modules. Preparatory activities started and are ongoing in the various labs (mechanical designs of various toolings and jigs ongoing). We have now some readout test cards and start learning the software, DAQsystem and operating the ROC. G.M. Bilei

8. INFN objectives for the next 16 months • Fully setup, and test the INFN production chain by ~ mid of next year. • Each site already started working setting up the activities • Plan to start working with old parts to build some old Pixel modules by • ~ mid 2012 • Aim to qualify each step of constructionincluding the Bump Bonding • vendor Selex. • Two initial meetings held with Selex to address some technical points. • Verify now availability of old parts (ROC OK, some sensors to be ordered) • Participate to the Test Beam and its preparation with new ROC. • TB planned in ~ summer 2012 (exact period to be defined in Oct 2011.) • Participate tendering/production/testing of Pixel sensors (will start late next • year ~ fall 2012). • Participate to the write up of TDR and continue working on simulations • Continue working on the Fall Forward new Readout Chip. G.M. Bilei

9. Draft timeline of Pixel construction & of INFN activities Develop and produce assembly tools start 2011 Develop assembly and testing procedures start 2011-12 Participate to qualification of ROC chip and TBM 2012 Bump bonding tests and qualification of Selex 2012 Assembly and test procedures established 2012 Full qualification of pre-production modules 2012-13 Module assembly and calibration (~ 12 months construction) 2013-14 Participate to integration at CERN 2015 Participate to commissioning, full system test at CERN 2016 Ready for installation in CMS end of 2016 Detailed plan in preparation

10. Some news related to TDR and Finances • Discussion about TDR started at Phase I Management Board • - Draft layout of chapters available and editors identified • - Timeline: by end of the 2011 a draft should be available • with agreed sharing of responsibilities and cost sharing. • Final TDR ~ spring 2012. • Draft contribution from agencies revised • - Cost estimated ~ 17.3 MCHF. Possible coverage for ~ 17.1 MCHF • - Likely this figure will be presented at Oct. RRB • Start discussing now the sharing responsibilities and associated financial resources G.M. Bilei

11. Draft Cost Sharing As anticipated in April to GRI Pixel estimated cost is about 17.3 MCHF. Preliminary cost sharing among Agencies already discussed within the Pixel project and with CMS in preparation of Oct. RRB. Situation so far is quite reasonable. 17.1 out 17.3 MCHFmay be available. Still some contributions to be ‘consolidated’ with some Funding Agencies. DRAFT G.M. Bilei

12. Summary of funding G.M. Bilei

13. Requests by Institutes G.M. Bilei

14. Back up Details

15. Preliminarysharingfor Pixel ModuleConstruction Pisa Sensors test Pisa Perugia (Padova) SelexBump bond Bare Module test SiN-rails glue module characteri-zation Perugia/Pisa ROC Test after dicing Half Layer Assembly and testing Glue HDI to bare module Bond ROCs to HD Module testing Burn-in Padova X-ray calibration Bari TBM (HDI) testing Glue/bond TBM to HDI Test before glue HDI to sensor Catania

16. Padova e Bari dettaglirichieste per setting up

17. Perugia e Catania dettaglirichieste per setting up Catania Inventario: Differential probes per set up test del HDI 5000

18. Pisa dettaglirichieste setting up 34.000