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Photoconductor Detector Arrays IBDR

Photoconductor Detector Arrays IBDR Hilmar Richter • ANTEC-GmbH • Germany Günter Bollmann, Peter Dinges, Otto Frenzl, Heidrun Köppen, Heribert Krüger, Claudia Popp. Overview. Modul / Array Interfaces Optical Interface Electrical Interface Design Implications on A rrays Detector Stack

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Photoconductor Detector Arrays IBDR

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  1. Photoconductor Detector Arrays IBDR Hilmar Richter • ANTEC-GmbH • GermanyGünter Bollmann, Peter Dinges, Otto Frenzl, Heidrun Köppen, Heribert Krüger, Claudia Popp Photoconductor Detector Arrays

  2. Overview • Modul / Array Interfaces • Optical Interface • Electrical Interface • Design Implications on Arrays • Detector Stack • Thermal Budget • Cryo Cycling and Vibrational Load • Achieved Performance • Cut-off Wavelengths • Bias dependency • PA / QA Activities: Flow Plan • Procurement • Summary Photoconductor Detector Arrays

  3. Optical Interface of the “Red” Array Radial arrangement of 25 high stress modules in groups of 5 modules. The center of the radial arragement is 240 mm in front of the fore optics in the plane of the pupil. Photoconductor Detector Arrays

  4. Electrical Interface Interface design • FEE and harness substrate are supported by kapton tubes in order to reduce thermal load to the module • All wires from interface parts to the module are stainless steel, wires between interface parts are gold wires • The nano connector of the pigtail harness is glued to the harness substrate • Thermal loads of the interface parts flow through the cooling strap to the 4 K level Photoconductor Detector Arrays

  5. 2 Ball segment Detector contact Ge:Ga crystal 1 Detector contact Insulator Gold wire 25 µm Detector Stack in the Cavity and Final Bias Design Detector Stack Final design • Bias concept has been changed to prevent grounding of detectors by short circuit • Contact diameter decreased at the ball segment side to prevent grounding of the signal line (2) • Contact diameter increased at the ground side (this contact is grounded directly to the module (1)  Slits reduced from 30 - 70 µm to 10 - 40 µm and therefore less cross talk Photoconductor Detector Arrays

  6. 25 Low Stress Modules 25 High Stress Modules 2.5 K 1.7 K 4 K 4 K 16 Detector Wires (Steel) 4 Long FEE + 2 Long Harness Posts (Kapton) 2 Short Harness Posts (Kapton) 11 µW 202 µW 134 µW 7 µW 162 µW 108 µW P = 375 µW P = 249 µW P = 624 µW 4 Thermal Budget Photoconductor Detector Arrays

  7. Slit Cryo Cycling and Vibration Load Free bearing support post • Slit of 0.2 mm between kapton tube and support part (no gluing) at the free bearing support posts compensates shrinkage of different materials (module, FEE / harness substrate, kapton tube, etc.) during cool-down. After cool-down: slit = 0 - 0.05 mm. • Static tests at LN2 temperatures prove: Kapton tubes withstand deflections of 0.15 mm (0.12 mm) perpendicular (parallel) to the substrate plane. The applied forces correspond to accelerations of 110 g. • Above support post design passed cryo cycling and vibration tests with qualification load levels. Photoconductor Detector Arrays

  8. 30 mV Specification Cut-off Wavelength Specification high stress module: lCW > 200 µm @ 40 mV Photoconductor Detector Arrays

  9. Specification Cut-off Wavelength Specification low stress module: 125 < lCW <130 µm @ 100 mV Photoconductor Detector Arrays

  10. Detector stack assembly and RSR measurement. KIP: Check of detector stack Cleaning and incoming inspection of all parts Preparation of FEE / harness substrate support posts Gluing of the pigtail harness to the harness substrate and implementation of connector saver and short circuit connector KIP Final cleaning of the module and check with UV light Integration of FEE / harness substrate, wiring and fixing of FO PA / QA Activities: Flow Plan KIP Final check of the completed module before shipping Photoconductor Detector Arrays

  11. Procurement / Assembling • Status of parts procurement for the integration of QM modules - Delivery of the Gore cables 19.03.2002 - Tecnologica announced connector savers and short circuit connectors for 10.05.2002 - Delivery of FEE and harness substrates 19.04.2002 - PO for the pigtail harness from Cannon placed 22.02.2002 (delivery time 12 weeks) • Routinely going on assembly of FM modules at Antec Time critical: Procurement of pigtail harness Photoconductor Detector Arrays

  12. Summary • Interfaces to MPE housing, KT board and IMEC FEE and harness substrate defined • Module design finished (specifications fulfilled) • Procurement of integration parts initiated and delivery dates fixed Photoconductor Detector Arrays

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