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RJR Polymers, Inc. The Complete Process Solution. RJR Polymers, Inc. Specializes in the manufacture of Injection Molded Plastic Packages, Pre-applied Adhesives, Equipment and Processes that provide additional service to our customers in the Electronics Industry.

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Rjr polymers inc

RJR Polymers, Inc.

The Complete Process Solution


Rjr polymers inc1
RJR Polymers, Inc.

  • Specializes in the manufacture of Injection Molded Plastic Packages, Pre-applied Adhesives, Equipment and Processes that provide additional service to our customers in the Electronics Industry.

  • Provide engineered solutions to our customers demanding product and process applications

  • Allow our customers to focus on their core competencies.

  • Can manage your product from design through to high volume offshore manufacturing through our licensed partners


Market mix
Market Mix

  • RF/ Wireless

  • Imaging

  • Medical

  • Military

  • WAN/ LAN/ Broadband

  • Telecom

  • Automotive

  • MEM’s, MOEM’s, sensors, etc.


Technology driven
Technology Driven

Pre-applied Adhesives

Prototype Design

And Assembly

Injection Molded Plastic Packages


Products core competencies
Products/ Core Competencies

  • Plastic Air Cavity Packages

    • Thermally Enhanced SOIC, Power RF, High Freq RF (UHF, SHF), LDMOS, etc.

    • Plastic backed SOIC, MEM’s, MOEMS, Sensors

    • Vision, CCD,

    • Other

  • Epoxy coated Lids – Metal, Composites, Ceramic, Plastic and Glass

  • Flip Chip - Thermal Interface Adhesives

  • Heat Sink - Thermal Interface Adhesives

  • Windows - Vision Packages


Materials
Materials

  • Full staff of polymer chemists have formulated a complete line of B-staged adhesives.

  • Our view of the entire process has allowed us to design functional materials you require today and the future.

    The common goals of all our materials are:

    • Ionic purity

    • Near ‘Zero” outgassing

    • Fuse or cure in minutes (pushingthe boundaries of today’s competitive materials)

    • No Mess (it’s pre-applied)!!


Rjr s pre applied materials
RJR’s pre-applied Materials

Air Cavity

Package Lids

Plastic

Composites

Glass

Ceramic

Metal

Glass Windows

For CCD, CMOS

and other

Vision Devices

Flip Chip Devices

Thermout™

Pulls heat away from the

device through the lid

Adhesive Options

* Thermo-Set

* Thermo-Plastic

* Electrically Conductive

* Thermally Conductive


Rjr s optical products
RJR’S Optical Products

  • Glass

    • Standard Products

      • Borosilicate glass

        • Schott D263, Corning 1737F, Corning D211

        • Supplied in standard thicknesses of 0.54mm and 0.71mm

      • Material supplied cut on tape on rings (plastic or metal)

      • Typical epoxy dispense pattern:

        • 0.76/1.40mm wide

        • 0.05/0.2mm height

        • 0.25mm typical pullback from edge

    • Standard Coatings available

    • Can be supplied beveled

    • Wafer Cleaning

    • Glass capacity to millions of units per month


Microwave application low chloride quick bond
Microwave ApplicationLow Chloride Quick Bond

1. RJR Supplied lids pre-applied Quick Bond

2. Place Packages and lids into the ITS or AITS

3. Start the cycle

4. Time from Start to cured ~ 4 minutes

5. Material is then fully cured!


Flip Chip ApplicationThermout™

  • Resilient material built to maintain thermal contact between a die and a lid or cover

  • B-stage material that is pre-applied

  • Can be applied to ceramic or metals

  • Exhibits elastomer type behavior at elevated temperatures to maintain thermal performance

  • Retains elongation and resiliency at low temperatures


Flip Chip ApplicationThermout™

  • Typical Properties of Thermouttm

    • Thermal conductivity 1 – 3.5 W/mK

    • Shear Modulus 360,000 psi

    • Tensile Elongation 3%

    • Water absorption 0.2%

    • Shear strength 2,000 psi


Flip Chip ApplicationThermout™

  • Will withstand Mil-Std thermal cycling requirements

  • For PBGA Applications – Materials available that will pass MSL Level III

  • For CBGA (HTCC or LTCC) Applications – Materials available that will pass MSL Level I

  • 168 hr. Autoclave

  • Can be manufactured with a variety of thermally enhanced fillers – Aln, BN, Ag


Sealing Equipment

  • Our staff of Expert Engineers have designed Semiautomatic AND Fully Automatic solutions for your Packaging sealing needs

  • OUR Focus:

    • Increase throughput

    • Functioning today and with future applications

    • Increase yields

    • Eliminate “Blowouts”

    • Accurate lid placement

    • Decrease required floor space (REAL ESTATE)


Equipment its isothermal packaging system
Equipment - ITS (Isothermal Packaging System)

  • Semiautomatic

  • Custom Design & Built Plates

  • Controls:

    • Time

    • Pressure

    • Temperature

  • UPH: 600 - 700*

  • 99% + Yield

** Run Rates are Dependant on

Package Size and Configuration


Air cavity package technologies
Air Cavity Package Technologies

Plastic Backed

For Low Energy Cavity Package

Applications like

Sensors, etc.

CCD / CMOS

(Thermo-Plastic)

For Vision and Optical

Sensor applications.

Thermally Enhanced

Metal Backed

Eutectic & Non-eutectic applications with

high thermal transfer


Eutectic die attach in a plastic air cavity package
Eutectic Die Attachin a Plastic Air Cavity Package !

This technology represents a breakthrough in polymer based air cavity electronic packaging. This new low cost injection molded packaging process allows the user to combine the thermal advantages gained by using a eutectic die attach material between die and backplane, with a moisture resistant plastic sidewall specifically designed to manage the higher power and frequency output values previously found only in ceramic packaging systems/ technology.

  • Features:

  • Eutectic Die attach

  • Moisture resistant

  • Low CTE

  • CTE matched package

  • Low Dielectric

  • Low Parasitics

  • High Power

  • High Frequency

  • Low Cost !

  • Package Applications:

  • RF/ Microwave

  • WLAN/ LAN

  • Short Range Wireless

  • MEMS/ MOEMS

  • LDMOS

  • CCD/ CMOS


Rjr s injection molded packages
RJR’s Injection Molded Packages

  • Package Buildup

    • Essentially 3 layers

      • Thermal Base (Cu, WCu, CuMoCu, AlSiC, etc)

      • Sidewall with leads

      • Lids with epoxy (pre-applied)

    • RJR formulated epoxy as interstitial layers

    • Plastic alloy formulated to match the CTE of Copper or Copper alloys (WCu, CuMo, etc.)

    • Leads are coated with moisture resistant polymer, then injection molded

    • The 3 layers are fused together using RJR ITS equipment


Rjr s injection molded packages1
RJR’s Injection Molded Packages

  • Thermal Package Performance

    • Moisture Resistant

    • Eutectic Die attachable

    • Thermal Dissipation >10 watts

    • Handle Frequency > 2.5 GHz Have parts in service at 5.8 GHz

    • Pass JEDEC Level I Moisture Pre-Conditioning

    • Pass Mil-Std 883 Section 1010 Condition C temp cycle

    • Anticipated improvement in electrical performance compared to ceramic


Rjr air cavity package technologies
RJR Air Cavity Package Technologies

Benefits of RJR Packages vs Competition

  • Equal or superior performance compared to ceramic packages.

  • Fast turnaround time (two weeks) for prototype assembly.

  • Lower tooling costs.

  • Substantially less expensive !!

  • All Packages Available in Leadframe Format

    Benefits ofThermally Enhanced Plastic Packages:

    • Improved heat dissipation = lower die operating Temp. = longer life!

    • Less Expensive !!!


1 package base

Thermally-Enhanced Package

Build process procedure (eutectic die attach)

Process Steps

RJR Polymers

2) Leadframe with moisture barrier applied

3) Injection mold sidewall over leadframe

4) Nickel and Gold plate leadframe

1) Package Base

5) Epoxy coat molded sidewall

Customer location –or- RJR Location

6) Perform Die attach to base leadframe

7) Using RJR’s ITS system – attach assembled base

leadframe to coated injection molded sidewall

8) Wire Bond device to package

9) Using RJR’s ITS system – seal package

lid to molded sidewall

10) Trim, Form and singulate


Thermally enhanced package exploded view

Package lid with pre-applied adhesive

Lid Material: Plastic, Ceramic, Metal, Glass, etc.

Injection molded sidewall

Shown with moisture resistant seal encapsulating the leads and pre-applied adhesive on bottom surface

Wire Bonds

Thermally-Enhanced Package

Exploded View

Device

Solder Preform or Epoxy, etc.

Package Base

Base Material: Cu, Cu/Mo, Cu/Mo/Cu, WCu, etc.

Completed Package


Rjr s optical packaging
RJR’S Optical Packaging

  • Packaging

    • 28, 32, 40, 48 and 52 lead count packages standard tooled

    • Packages are capable of JEDEC level 1 for moisture pre-conditioning

    • From design to prototypes in 6 weeks.

    • Customers experience Low Cost/ Low barriers to entry for product mechanical testing/ sampling

    • RJR’s offers product solutions for drop in replacements as well as new/ custom packaging.

    • RJR solution includes the use of RJR assembly technology


Rjr polymers rf power products
RJR Polymers RF Power Products

  • LDMOS, MMIC, FET, pHEMT, Wide Bandgap

  • Power levels to +150 watt

  • Frequency Management to +5.8 GHz

  • Eutectic Die attachable (like all RJR Packages)

  • Enabling Technology

    • Internally matched elements transform impedence to manageable levels

    • Flat sealing surface – reduces gross leak failure

    • Leadframe processing/ assembly

  • Low cost – approx. 60% of ceramic equivalents


Rjr air cavity package costs deliverables
RJR Air Cavity Package Costs/ Deliverables

Benefits of R-Pak vs Competition

  • Rapid turnaround time (~6 weeks) for prototype/ custom packages

  • Fast turnaround time (two weeks) for prototype assembly.

  • Substantially lower tooling costs.

  • Substantially less expensive packages !! Typically half the cost of ceramic.

  • Low barriers to entry

    • Low Cost tooling

    • Low cost packages

  • Budget friendly


Rjr s injection molded package program rewards
RJR’s Injection Molded PackageProgram Rewards

  • Equal or superior performance compared to ceramic packages.

  • Moisture Resistant

  • Eutectic, epoxy, RTV, etc. Die attachable

  • Thermal Dissipation >10 watts

  • Handle Frequency >= 5.8 GHz

  • Can Pass JEDEC Level I Pre-Conditioning

  • Pass Mil-Std 883 Section 1010 Condition C temp cycle


Rjr plastic alloy htp 1000
RJR Plastic Alloy – HTP-1000

  • R-Pak Plastic Body Compound

  • This custom thermoplastic compound is used in RJR R-Pak plastic body package technology. The following properties are typical for the bulk material molded into standard test configurations defined by the applicable test method. These property values are intended for general engineering purposes and are not intended for establishing product specifications.

    • Physical:

      • Density: 1.67 gm/cc ASTM D792

      • Water Absorption 0.02% ASTM D570

    • Mechanical @ 23C:

      • Tensile Strength 21,000 PSI ASTM D638

      • Tensile Modulus 2.5 X 106 PSI ASTM D638

      • Elongation @ Break 1.2% ASTM D638

      • Flexural Strength 31,000 PSI ASTM D790

      • Flexural Modulus 2.4 X 106 PSI ASTM D790

      • IZOD Impact Strength Notched 1.6 ftlb/in ASTM D256

    • Thermal:

      • Melting Point 280C (536F) ASTM D3418

      • DTUL @ 1.8 Mpa (264 PSI) 270C (518F) ASTM D648

    • Electrical:

      • Volume Resistivity 1012 ohm-cm ASTM D257

      • Surface Resistivity 1017 ohm IEC 93

      • Dielectric Strength 766 V/mil ASTM D149

      • Dielectric Constant 3.8 @ 1 kHz ASTM D150

        3.7 @ 100 kHz

        3.7 @ 10 MHz

      • Dissipation Factor 0.007 @ 100 kHz ASTM D150

        0.003 @ 10 MHz ASTM D150

      • Arc Resistance 165 Sec. ASTM D495

      • Comparative Tracking Index 175 volts ASTM D3638

    • Chemical Resistance:

      • Not affected by: Water, Acetone, MEK, Methyl celusolve, Hexanes, (Sulfuric Acid, Nitric Acid, and HCl) as used in electroplating baths.


Rjr polymers quality system
RJR Polymers Quality System

  • Roadmap to ISO Certification - Scheduled for Q3 2003

  • Supplier to Global OEM’s

    • Motorola

    • Ericsson/ Infineon Microelectronics

    • Agere Systems

    • Philips Semiconductors

    • Etc.

  • ASQC Plan (Incoming and Outgoing)

  • Provide QA on all components of product manufacture

    • Raw materials for epoxy, plastics

    • Lids

    • Packaging products

  • Lot to Lot traceability back to Raw Material Components


Rjr summary
RJR Summary

  • RJR has the technology background

  • Integrated manufacturer

  • Provide Solutions

  • Manage the manufacturing cycle in-house

    • Design

    • Product Development

    • Materials

    • Injection Molding

    • Coating products with epoxies

    • Light/ Prototype assembly

    • Offshore Partners

  • Equipment manufacturer – ITS, AITS

  • Innovative thinking

  • The Total Electronic Package Solution


Rjr polymers inc contact information

South Korea

Ken Park

Far East Representative

201-104 Byuk-San BLDG

Jookjeon-ri, Su-ji-Up Yong-in Si

Kyunggi-Do, Korea

Mobile: 011-82-11-839-7929

Fax 031-683-8182

E-mail:[email protected]

RJR Polymers Inc.Contact Information

Western USA

David Pasfield

Western Regional Sales Manager/

Sales Engineer

Ph (707) 782-9257

Fax (707) 782-9268

Mobile: (707) 484-9669

e-mail: [email protected]

Europe

Renaud de Langlade

European Representative

Managing Director

NovaPack Technologies

Parc d’Activities de Pissaloup

4 rue Edouard Branly

78190 Trappes

France

Ph 33 1 64 48 76 67

Fax 33 1 30 68 10 86

Mobile: 33 6 20 42 91 63

E-mail: [email protected]

Eastern USA

Scott Mellen

Eastern Regional Sales Manager/

Sales Engineer

Ph (315) 676-4134

Fax (315) 676-5319

Mobile: (315)415-9401

E-mail: [email protected]

Midwestern USA

Dave DeWire

Director Sales and Marketing

Ph (303) 543-2223

Fax (303) 543-7123

Mobile: (303) 921-2222

E-mail: [email protected]

Taiwan/Pacific Rim Region

Michael Leong

Pacific Rim Regional Sales Manager/

Sales Engineer

8-15-06, Jalan Gangsa

Greenlane Heights

Penang 11600

Malaysia

Ph 011-604-655-2468

Fax 011-604-658-2468

Mobile: 011-6012-486-5468

E-mail:[email protected]


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