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Introduction to CMOS VLSI Design Package, Power, and I/O

Introduction to CMOS VLSI Design Package, Power, and I/O. Outline. Packaging Power Distribution I/O Synchronization. Packages. Package functions Electrical connection of signals and power from chip to board Little delay or distortion Mechanical connection of chip to board

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801 views • 25 slides

Packaging

Packaging. Packaging Requirements. Desired package properties Electrical: Low parasitics Mechanical: Reliable and robust Thermal: Efficient heat removal Economical: Cheap. Wire bonding Only periphery of chip available for IO connections Mechanical bonding of one pin at a time (sequential)

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448 views • 25 slides

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Power layers - PowerPoint PPT Presentation

Introduction to CMOS VLSI Design Package, Power, and I/O

Packaging