'Pin count' presentation slideshows

The Digital Logic Level

The Digital Logic Level. Chapter 3. PCI Bus (1). With multimedia games and full-motion video the ISA bus could not handle the amount of data transfer. A 1024x768 screen used for true color (3 bytes/pixel) moving image contains 2.25 MB of data.

739 views • 63 slides

CSE 232A Graduate Database Systems

524 views • 51 slides

CSE 190D Database System Implementation

442 views • 44 slides

Intrinsic Shortest Path Length: A New, Accurate A Priori Wirelength Estimator

Intrinsic Shortest Path Length: A New, Accurate A Priori Wirelength Estimator. Andrew B. Kahng Sherief Reda abk@ucsd.edu sreda@ucsd.edu VLSI CAD Laboratory University of CA, San Diego http://vlsicad.ucsd.edu/~sreda. Outline. Previous work and motivation

498 views • 30 slides

Storing Data: Disks and Files

380 views • 27 slides

500 views • 24 slides

377 views • 24 slides

D ESIGN AND I MPLEMENTAION OF A DDR SDRAM C ONTROLLER FOR S YSTEM ON C HIP

408 views • 21 slides

Sun Tracking Solar Array Team Peacock Lane

Sun Tracking Solar Array Team Peacock Lane. Team Members: Elise King, Caitlin Greeney , Beverly Raposa & Julius Raposa Advisor: Dr. Yamayee Secondary Advisor: Dr. Albright Industrial Advisor: Jeff Cook (BPA) Client: Dr. Dillon . Project Overview. Why solar? Why tracking?

206 views • 14 slides

Storing Data: Disk Organization and I/O

223 views • 14 slides

2/17/2010 Iowa State University EE492 - Senior Design II

May 2009 Senior Design Group #27 Test Chip For Electrothermal Reliability Research Design Team: Karl Peterson , Emmanuel Owusu, and Joshua Ellis Advisor: Dr. Randall Geiger | Client: VLSI Thermal Research Group. 2/17/2010 Iowa State University EE492 - Senior Design II. Project Plan.

242 views • 10 slides

2/17/2010 Iowa State University EE492 - Senior Design II

May 2009 Senior Design Group #27 Test Chip For Electrothermal Reliability Research Design Team: Karl Peterson , Emmanuel Owusu, and Joshua Ellis Advisor: Dr. Randall Geiger | Client: VLSI Thermal Research Group. 2/17/2010 Iowa State University EE492 - Senior Design II. Project Plan.

199 views • 10 slides

Assembly and Packaging Joe Adam TWIG Co-chair

Assembly and Packaging Joe Adam TWIG Co-chair. Xavier Baraton Mark Bird - Amkor Bill Bottoms - 3MTS Ken Brown - Intel Chi Shih Chang - K&S Bill Chen - ASE Peter Elenius - K&S Hisao Kasuga - NEC. Ed Fulcher - LSI Logic Ron Gedney - NEMI Seiji Hamano - Fujitsu Mahadevan Iyer - IME

199 views • 9 slides