'Dram chips' presentation slideshows

Buffers

Buffers. Buffers minimize memory delays caused by variation in throughput between the pipeline and memory Two types of buffer design criteria Maximum rate for units that have high request rates The buffer is sized to mask the service latency Generally read buffers that you want to keep full

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Lecture: DRAM Main Memory

Lecture: DRAM Main Memory. Topics: virtual memory wrap-up, DRAM intro and basics (Section 2.3). TLB and Cache. Virtually Indexed Caches. 24-bit virtual address, 4KB page size ? 12 bits offset and 12 bits virtual page number

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William Stallings Computer Organization and Architecture 6th Edition

William Stallings Computer Organization and Architecture 6th Edition. Chapter 5 Internal Memory (revised 9/24/02). Semiconductor Memory Types. Semiconductor Memory. RAM Misnamed as all semiconductor memory is random access Read/Write Volatile Temporary storage Static or dynamic.

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Lecture: DRAM Main Memory

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Direct Rambus DRAM (aka SyncLink DRAM)

Direct Rambus DRAM (aka SyncLink DRAM). Goal High Density, Low Cost, High Bandwith DRAM To achieve high bandwidth to memory interface can either: make interface to memory faster make interface to memory wider Wider => More Chips or More Pins => More Cost

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Lecture: Memory Basics and Innovations

Lecture: Memory Basics and Innovations. Topics: memory organization basics, schedulers, refresh,. Memory Architecture. Processor. Bank. Row Buffer. Memory Controller. Address/Cmd. DIMM. Data. DIMM: a PCB with DRAM chips on the back and front

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Lecture: DRAM Main Memory

Lecture: DRAM Main Memory. Topics: virtual memory wrap-up, DRAM intro and basics (Section 2.3). TLB and Cache. Is the cache indexed with virtual or physical address? To index with a physical address, we will have to first

262 views • 23 slides

Lecture 5: Refresh, Chipkill

Lecture 5: Refresh, Chipkill. Topics: refresh basics and innovations, error correction. Refresh Basics. A cell is expected to have a retention time of 64ms; every cell must be refreshed within a 64ms window The refresh task is broken into 8K refresh operations;

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Lecture: DRAM Main Memory

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Lecture 6: Chipkill, PCM

Lecture 6: Chipkill, PCM. Topics: error correction, PCM basics, PCM writes and errors. Chipkill. Chipkill correct systems can withstand failure of an entire DRAM chip For chipkill correctness the 72-bit word must be spread across 72 DRAM chips

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Main Memory

Main Memory. -Victor Frandsen. Overview. Types of Memory The CPU & Main Memory Types of RAM Properties of DRAM Types of DRAM & Enhanced DRAM Error Detection & Correction. Types of Memory. Registers Cache Main Memory Secondary Storage (Disks) Off-line Storage (Tape). Types of Memory.

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Lecture 15: DRAM Main Memory Systems

Lecture 15: DRAM Main Memory Systems. Today: DRAM basics and innovations (Section 2.3). Memory Architecture. Processor. Bank. Row Buffer. Memory Controller. Address/Cmd. DIMM. Data. DIMM: a PCB with DRAM chips on the back and front

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Lecture 15: DRAM Design

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