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DØ Silicon Upgrade Issues

DØ Silicon Upgrade Issues. Frank Filthaut University of Nijmegen / NIKHEF NIKHEF, 4 August 2000. Run II (a+b+…) Prospects. Accelerator:.

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DØ Silicon Upgrade Issues

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  1. DØ Silicon Upgrade Issues Frank Filthaut University of Nijmegen / NIKHEF NIKHEF, 4 August 2000

  2. Run II (a+b+…) Prospects Accelerator: • Initial RunII luminosity estimates pessimistic: should be able to attain luminosities as high as 5·1032 cm-2 s-1 (main limitations: antiproton intensity, proton beam brightness) • This should allow for an integrated luminosity of 15 fb-1, provided the accelerator runs another 4 years in Run IIb • Note: time of switch to 132 ns operation / crossing angle unclear – but a strong push @FNAL NIKHEF

  3. Run II (a+b+…) Prospects Physics: • Outcome of the RunII Higgs/SUSY Workshop: 15 fb-1/experiment should lead to a large increase in SM Higgs exclusion/evidence limit (180 GeV istd of 115 GeV already reached by LEP2) The 180 GeV limit is interesting from the point of view of stability of the SM Higgs solution… NIKHEF

  4. DØ Upgrade Issues Run II b accelerator operation presents several problems to the DØ detector: • Silicon layers 1, 2 will not survive the anticipated 15 fb-1 integrated luminosity • Various scenario’s worked out for silicon temperature during “stand-by” (Tevatron off), maintenance periods • Reverse annealing modeled as either 1st-order of 2nd-order process (1st order favoured by data) • 50% uncertainty in particle fluence In all scenario’s, end up with depletion voltages > 100V (ie. exceeding diode/capacitor breakdown voltages for many detectors) SVX IIe should survive up to 6 Mrad, ie. perhaps OK for layer 1 NIKHEF

  5. DØ Upgrade Issues • SIFT chip used to pickup CFT fibre signals for L1 Central Track Trigger does not work in 132 ns mode • Actually, it can work but only in a mode which induces too much noise on the SVX front-end (not an option) Strictly speaking a problem even before “Run IIb”, but given probability that 132 ns operation will not happen in “Run IIa”, not felt as a big problem • Occupancy in two innermost CFT layers  10%  will become useless for pattern recognition, and hence for L1 NIKHEF

  6. DØ Upgrade Issues • CFT L1,L2 occupancy: way out might be to use stereo fibre layers in trigger (6 layers, forget about inner two) • Implies substantial combinatorics  large number of extra connections to be made • Additional rejection is lost with increasing luminosity Conclusion: 8*axial is better than 6*(axial+stereo) NIKHEF

  7. Silicon Upgrade Proposals NB: L0  1.5 cm, L5/6  20 cm • Minimal: • L0: SS, sp =25 m, rp = 25 or 50 m, ladders 6 or 12 cm long • L1/2: SS glued back to back (20), 6 barrels as in R2a • Pixel: • L0/1: ATLAS-style pixels, 50*400 m. Length? • L2: SS glued back to back (20) • IRIS: • L1: SS axial, sp =25 m, rp = 50 m, 200 m thick (or DS 900?) • L2: SS glued back to back (20) (same parameters) • L5/6 (“ISL” à la CDF): SS, rp=150 m axial, 390 m (900) glued back to back. 18 modules/layer, each 4*40 cm long • “Integrate” with idea for inclusion of stereo fibres in L1CTT • Full: • L0-2: SS axial (pitch?) • L3-5: SS glued back to back (20), ladders 10 or 15 cm long • Simulation studies (GEANT) starting: • Intermediate strips? • Strip length • Material distribution NIKHEF

  8. Silicon Upgrade Issues • Present design (featuring 5 detector types, 9 HDI types, lot of manual steps) very time-consuming • more automisation would greatly facilitate project • Foresee 9-month shutdown period  March 2003 • Enough time to dis-assemble present detector in case of partial replacement (how to keep silicon cooled)? • In all but the minimal upgrade scenario’s, need new readout chip • Less than 2000 SVX IIe on the shelf, 1.2 m technology being abandoned • Also SVX III chip currently in use by CDF (0.8 m) will be obsolete (also much more expensive) • CDF interested in joint effort towards SVX IV development (start by down-scaling from SVX III) • strong push from Lab • nevertheless schedule risk • significantly more control lines than SVX IIe  investigate built-in decoder? • Need new DAQ • APV25 (CMS): seems to work, but analogue  need separate ADC; also DAQ change • Even now, pattern recognition is less redundant than desirable – can one do better? • “Dislike” of disks –implications for forward tracking? • Anticipate shorter interaction region due to crossing angle (loss in luminosity)? NIKHEF

  9. Dutch Thoughts… • None of the current scenario’s seems to have a satisfactory solution for the CFT innermost layers’ occupancy problem • The most straightforward solution to this is to replace these innermost layers with silicon • One should be able to trigger on the information coming from this silicon • Rely on SIFT replacement – we’re as good as dead anyway if this problem isn’t solved • Replacement with 3 layers (instead of 2) would lead to more redundant system • Cooling needs attention • SVX + SIFT chips • Silicon itself needs cooling, if inner layers are to survive full Run IIb (“quick” replacement??) • Oxygenated silicon • Instead of having various independent projects, try to make integrated design (going from L0/1 to L5/6) • Uniform design should gain a lot of development/ production time • Not much thought given yet to detector types (SS, DS, SS glued back to back) (NIKHEF DØ group, Marcel Demarteau, Ron Lipton, Harry Weerts, Marvin Johnson) NIKHEF

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