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半導體封裝測試概論

半導體封裝測試概論. 講者 王量玄. 大綱. 半導體材料及相關應用領域 積體電路種類 積體電路製造 封裝技術發展 傳統封裝與晶圓級封裝 (wafer level CSP) 測試. 半導體材料及相關應用領域. 積體電路種類. 邏輯 (Logic) : CPU , 晶片組 (Chip_Set), 繪圖晶片 …… .. 記憶體 (Memory):ROM,SRAM,DRAM,Flash …. 積體電路製程. 封裝技術發展 ASE Assembly Milestone. 傳統封裝與晶圓級封裝 (wafer level CSP). 傳統封裝

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半導體封裝測試概論

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  1. 半導體封裝測試概論 • 講者 王量玄

  2. 大綱 • 半導體材料及相關應用領域 • 積體電路種類 • 積體電路製造 • 封裝技術發展 • 傳統封裝與晶圓級封裝(wafer level CSP) • 測試

  3. 半導體材料及相關應用領域

  4. 積體電路種類 • 邏輯(Logic) : CPU , 晶片組 (Chip_Set),繪圖晶片 …….. • 記憶體(Memory):ROM,SRAM,DRAM,Flash…

  5. 積體電路製程

  6. 封裝技術發展ASE Assembly Milestone

  7. 傳統封裝與晶圓級封裝(wafer level CSP) • 傳統封裝 晶粒切割 晶粒貼附 打線 灌膠 彎腳成型 SOJ

  8. 晶圓級封裝(wafer level CSP) Balls pad open & Solder bumping Wafer level final testing

  9. CONFIDENTIAL Process Flow Wafer incoming

  10. CONFIDENTIAL Process Flow BCB coating Sputter Ti/Cu

  11. CONFIDENTIAL Process Flow PR coating Cu / Ni / Au trace plating

  12. CONFIDENTIAL Process Flow PR stripping & Ti/Cu etching Solder mask coating

  13. CONFIDENTIAL Process Flow Back side marking Ball placement

  14. CONFIDENTIAL Process Flow Wafer level final testing Dicing saw Pick & place

  15. 測試測試 • Tester 測試機 Memory Tester , Logic Tester , Mix Tester . • Handler (自動分類機) & Prober(自動針測機)

  16. Memory Tester

  17. Handler

  18. Wafer Level Final Testing Load Board Probe Card Solder Ball Copper Post type Wafer Chuck X/Y/Z Step Motor

  19. 報告完畢 敬請指教 謝謝

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