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Prototype. Production Design. One of a kind or few of a kind Represents abstract of production design Typically Thru Hole Components Cost is not part of requirements allocation Assembly process is not of interest Assembly levels, PCBs do NOT match PD

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prototype
Prototype

Production Design

  • One of a kind or few of a kind
  • Represents abstract of production design
  • Typically Thru Hole Components
  • Cost is not part of requirements allocation
  • Assembly process is not of interest
  • Assembly levels, PCBs do NOT match PD
  • Used for verification of requirements
  • Major Deliverables: Model
    • Working Demonstration Model
    • Demonstrate Major Functions
    • Minimal Documentation
      • Plan, Parts List, PCB Layouts
      • Demonstration Photos/Videos
  • Mass Production Quantities
  • Typically Use Surface Mount Technology
  • Mat & Asm Cost is an allocated requirement
  • Mat Cost use est annual production volumes
  • Define Assembly process flow diagram(s)
  • Define Assembly levels
  • Mfg test process part of Asm costs
  • Major Deliverables: Paper Exercise
    • Costed Bill of Materials incl package info
    • PCB Asm-Test Process Flow Diagrams
    • Assembly Level Diagram
    • PCB Layouts (optional)

Both are Required

manufacturing processes
Manufacturing Processes
  • Printed Circuit Board Assembly (PCB): Must specify or account for all components mounted into, onto or attached in some way to a printed circuit board as well as test for same
    • Electrical Components: Passives, IC’s, Optical, ElecMech, ElecMag, Connectors, Switches, Sensors, Protection Devices, etc
    • Mechanical Components: Heat Sinks, Thermal Grease, Pullers, Stiffeners, Mounting Hardware, Sensors, Protection Devices, etc
  • High Level Assembly (HLA): Must specify or account for all elements or parts of an assembly level including testing
    • Electrical Elements: PCB’s, Cables, Harnesses, Fans, Power Supplies, Sensors, Protection Devices, User Displays, Switches, etc
    • Mechanical Elements: Enclosures, Feet, Standoffs, Card Guides, Gaskets, Sealants, Fasteners, Hardware, etc
printed circuit board assemblies
Printed Circuit Board Assemblies
  • Printed Circuit Boards (PCBs):
    • Convenient form of interconnecting electrical components using industry standard attachment processes
    • 3 Basic Types of PCB-Component Assembly Technology
      • Thru Hole (TH)
      • Surface Mount (SMT)
      • Micro-electronic Multi-Chip-Module (MCM)
    • 3 Basic Types of PCB substrate systems (fabs)
      • Rigid epoxy including FR4, BT and others
      • Ceramic, Alumina (Al203), AlNi or other exotics
      • Flexible Substrate (flex circuit)
    • Single, Double and Multi-Layered
slide4

PCB Manufacturing Guide Links

    • fullnet.com/u/tomg/gooteepc.htm
    • ee.washington.edu/circuit_archive/text/design.html
    • precisioncircuits.com.au/cid/hm_cid.html
    • amscourseware.com/guidelines.htm
    • filtranmicro.com/design.html
    • goldengategraphics.com/pcgloss.htm
    • elchempub.com/files/electroc2.htm
    • pcbprotech.com/Dh3/DH3right.htm
    • pcbprototyping.com/html/html_edu.htm
slide6

Basic Photo-Etch

PCB Mfg Process

Plated Through Hole

PCB Cross Section

via aspect ratio very important
VIA Aspect Ratio – Very Important

Bd Thickness

VIA Diameter

Aspect Ratio =

Aspect Ratios > 5 May Challenge Drilling, Plating & other PCB Mfg Processes

Cross Section Example of Failed VIA due to poor drilling, plating

slide8

Cu PCB Trace Width & Depth

IPC Current Capacity Limitations

slide9

Cu PCB Trace Conductor

IPC* Spacing vs Voltage Summary (*Simplified)

slide10

Signal Routing is Important!

The PCB is part of the circuit

Good Signal Routing

Equal Lengths, Uniform

Good Power Bus Routing

Bypass Caps Closest to IC Power Pins

Poor Power Routing

Bypass Caps and 1 Conductor too Lengthy

Poor Signal Routing

Un-Equal Lengths, Non-uniform

slide11

PCB Ionic Cleanliness is Important

  • Acetate & Formate - These organic acids can be extracted from some solder masks.  High levels can be indicative of an incompletely cured solder mask.  Incomplete cure can allow exposure of the copper traces to the environment resulting in corrosion and board failure.
  • Bromide:  Brominated compounds are added to laminates as a flame retardant.  Some laminates are employing alternate, non-bromine, flame retardants.  These are usually called specified as containing non-halogen flame retardants.  The surface bromide concentration is a function of the laminate heat history.  Bromide has also been identified as a component in some marking ink formulations and some solder masks.
  • Chloride - Chloride ions are the single most damaging material that can be on the board.  High levels are usually due to insufficient washing prior to applying the solder mask.  Chloride can also be transferred to the board by handling.
  • Nitrate and Ammonium - Both of these can be introduced in various plating processes.
  • Sulfate - Sulfate is rarely a problem.  High levels are usually caused by poor housekeeping:  dirty equipment, unpainted walls or unsealed floors.  
  • Sodium & Potassium - Sodium can be induced by handling but is also a component of tap water and may be indicative of poor water treatment.  In this case, chloride, calcium and magnesium should also be present. 
  • Calcium and Magnesium - Calcium and magnesium come from rinse water and are indicative of poor water quality. 
  • Citrate - Citrate salts and acids are components of some gold plating solutions.  They also are in many environmentally friendly cleaners.

IPC-6012 mandates the total ionic cleanliness prior to solder mask be <10ug/in2 in NaCl equivelants (IPC-TM-650)

Most Low Signal Or High Bias, High Reliability Designs Require Much Lower Levels on Individual Ions

slide13

Thru-Hole Device Packages

  • Passives and Discretes
    • Axial Leaded (2 terminal, lying down)
      • Resistors, Capacitors, Inductors, Diodes
    • Radial Leaded (2 terminal, standing up)
      • Capacitors, Inductors, LEDs, MOVs, Power Resistors, …
    • T0 – Series (2-N terminals, Most Accommodate Std Heat Sink hardware)
      • T0-92 Small Signal Transistors, Regulators, References
      • T0-220 Moderate Power (~1W) Transistors, Regulators, Amplifiers
      • T0-3 Higher Power (~3W) Transistors, Regulators, Amplifiers
slide15

Thru-Hole Device Packages

  • Integrated Circuits, Resistors, Relays
    • DIP (Dual In-Line Package)
    • PDIP, CDIP
    • SIP (Single In-Line Package)
    • Rectangular
slide18

SMT – Surface Mount Technology Generations

20mm

DIP

Small Outline Package

Shrink SO Package

Thin Shrink SOP

Depopulated, Very Thin, Quad Flat Pack, No Leads

3 mm

slide28

Component

Procure

Setup

Substrate

(Fab)

Fabrication

Fab, Comp

Prep

Bake, Clean

Simplified Comparison of Thru Hole and SMT PCB Assembly Process

Mechanical

Hand

Operations

SMT

Thru Hole

Screen

Solder Paste

Auto

Component

Insertion

Vision System Inspection

Auto

Component

Placement

Wave Solder

Vision System Inspection

Reflow

Solder

(Oven)

Lead

Trim

Stresses and Test Processes

Vision/Xray System Inspection

slide29

Setup

Screen Print

SMT Placement

Reflow

Hand Assembly

Wave Solder

Final Assembly

Wash

In Circuit Test

Stress Screen

Functional Test

Pack / Ship

Typical SMT Complex Circuit Board Assembly Processes

ipc institute of printed circuits www ipc org association connecting electronics industries
IPC = Institute of Printed Circuits, WWW.IPC.ORGAssociation Connecting Electronics Industries
  • IPC-A-610 Acceptability of Electronic Assemblies
  • IPC-6011 Series of Board PCB Performance Standards
  • IPC/EIA J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
  • IPC-7095 Design and Assembly Process Implementation for BGAs
  • IPC-2221 Generic Std for Printed Board Design
  • IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Quality!

ipc electronic assembly classifications
IPC Electronic Assembly Classifications
  • High Reliability Electronic Products:
    • Continued performance, performance on demand, and extended life is critical and equipment downtime cannot be tolerated. Equipment must function when required with a high level of reliability assurance.
    • End-use environment is harsh
    • Includes equipment for commercial, military products, and for such applications as life support or missile systems.
  • Dedicated Service Electronic Products:
    • Continued performance, extended life and uninterrupted service is desired but not critical.
    • Typically the end-use environment would not cause failures
    • Includes communications equipment, sophisticated business machines, instruments and military equipment
  • General Electronic Products:
    • Function of the completed assembly is the major requirement
    • Cosmetic imperfections are not important
    • Includes consumer, some computer, peripherals, general military HW

Aerospace, Military

10 Yr Stresses

# of Bds, # of solder joints

# of Mechanical Cycles

4# of Power Cycles

# of Therm Cycles, Excursion

PROCESS CONTROL – PROCESS QUALITY

Ref: IPC-A-610, IPC-JSTD-001, IPC-7095

Telecom & Certain Medical

ipc workmanship classes solder volume shape placement control

100 %

75 %

50 %

25 %

0 %

100 %

75 %

50 %

25 %

0 %

IPC Workmanship Classes: Solder Volume, Shape, Placement Control
  • High Reliability Electronic Products: Includes the equipment for commercial and military products where continued performance or performance on demand is critical. Equipment downtime cannot be tolerated, and functionality is required for such applications as life support or missile systems. Printed board assemblies in this class are suitable for applications where high levels of assurance are required and service is essential.
      • Requirement for Aero-Space, Certain Military, Certain Medical
  • Dedicated Service Electronic Products: Includes communications equipment, sophisticated business machines, instruments and military equipment where high performance and extended life is required, and for which uninterrupted service is desired but is not critical. Typically the end-use environment would NOT cause failures.
      • Requirement for High Eng Telecom, COTS Military, Medical
  • General Electronic Products: Includes consumer products, some computer and peripherals, as well as general military hardware suitable for applications where cosmetic imperfections are not important and the major requirement is function of the completed printed board assembly.

Min PTH Vertical Fill: Class 2 = 75% Class 3 = 100%

Ref: IPC-A-610, IPC-JSTD-001

bga void size and locations uniform void position distributions
BGA Void Size and Locations,Uniform Void Position Distributions

Sampling_Grid

Position

Model

Solder_Joint_Radius

Void_Distance

Void_Radius

S

Void_Solder Interface Distance

S = Shell

Potential for Early Life Failure (ELFO) if S < D/10 = (solder_joint_radius)/10

S =Shell = solder_joint_radius – (void_distance + void_radius)

slide35

CLASS 1

Solder Joint_Radius: 0.225 mm

Void_Radius: 0.135 mm

Void_Area: 36% of Joint Area

Failure criteria: D/10

P(D<10) = 81.11 %

CLASS 2

Solder Joint_Radius: 0.225 mm

Void_Radius: 0.1013 mm

Void_Area: 20% of Joint Area

Failure criteria: D/10

P(D<10) = 52.21 %

CLASS 3

Solder Joint_Radius: 0.225 mm

Void_Radius: 0.0675 mm

Void_Area: 9% of Joint Area

Failure criteria: D/10

P(D<10) = 27.00 %

slide36
Class vs Shell Size Relative Probabilities~ 2x more likely to exceed D/10 threshold with Class 2 vs Class 3

S = Shell

Depth

slide37

Physics of Failure: Accumulated Fatigue Damage (AFD) is related to the number of stress cycles N, and mechanical stress, S, using Miner’s rule

Exponent Bcomes from the S-N diagram. It is typically ~3 for 63/37 SnPb Solders

Example: Solder Joint

Shear

Force

voids

Effective cross-sectional

Area: D/2

Effective cross-sectional

Area: D

F

Applied stress:

Applied stress:

Let  = 10, then

AFD with voids will “age” about

1000x faster than AFD with no voids

Voids in solder joints

ipc a 610 conditions
IPC-A-610 Conditions
  • IPC-A-610 Workmanship Conditions
    • Target Condition- This is the most desired condition and previously was referred to as preferred. It is not always essential to achieve this condition for reliability considerations.
    • Acceptable Condition- is a condition that, while not at a Target Condition, will result in a reliable product for the application. Corrective actions shall be directed to move toward the Target Condition.
    • Nonconforming Process Indicator- Is when a condition exists which does not affect the use of the product, but is not optimum. May result in repair, rework or scrap depending upon the customer’s requirements. Corrective action is necessary to bring the result back toward the Target.
    • Nonconforming Defect Condition- is when a condition exists that does not meet the reliability or performance in the application. Correction action is mandatory.

All the IPC-A-610 Measurements utilize

      • Temp (Deg F/C)
      • Mass (Oz/Kg)
      • Distance (mils/mm)

There are three key words used in the workmanship standards: Must, Shall and Should.

Must means mandatory for Class 1, 2, & 3

Shall means mandatory for Class 3 only.

Should means recommended only for Class 1,2 & 3.

Quality!

solder joints
Solder Joints
  • Solder Joints: A solder joint is formed when two metal surfaces are soldered together. The solder fills the void between the surfaces and is the area most important. It provides the majority of “strength of attachment.” A solder fillet is formed after the solder joint is filled, and, is the visible solder verifying the presence of the solder joint.
    • Blow Hole Defects: Blowholes are solder voids visible from the surface going into the solder joint alongside a through-hole lead. A blowhole is a nonconforming process indicator provided the solder connection meets the minimum circumference and depth requirements.
    • Dewetting Defects: Solder joints are visually inspected for wetting characteristics. Dewetting occurs because the flux has been burned off and moisture attacks the surfaces. A good indicator of dewetting is solder pooling and pulling back off leads or lands.
    • Oxidation Defects: When moisture in the air attacks a solder joint, it forms a protective rust-like layer. This is referred to as oxidation, which attacks metal surfaces. Oxidation dramatically reduces the transfer efficiency of thermal energy.
    • Dimensional Defects: For any of the above in addition to poor placement, screening, reflow and other processes, solder joint geometric defect limits are clearly specified in these Stds (see above)
discrete component geometries
Discrete Component Geometries

NOTES1. The maximum fillet may overhang the land or extend onto the top of the chip cap metallization; however the solder shall not extend further onto the component body.2. Properly wetted fillet evident.

j lead component geometries
J-Lead Component Geometries

NOTES1. The maximum solder fillet shall not touch package body. 2. Properly wetted fillet evident.

gull wing component geometries
Gull Wing Component Geometries

NOTES1. Solder fillet may extend through the top bend. Solder must not touch the package body or end seal, except for low profile SMD devices, e.g., SOICs, SOTs. Solder should not extend under the body of low profile surface mount components whose leads are made of Alloy 42 or similar metals.2. Must not violate minimum design conductor spacing.3. Properly wetted fillet evident.

thru hole component geometries
Thru-Hole Component Geometries

NOTES1. Wetted solder refers to solder applied by the solder process.2. The 25% unfilled volume includes both source and destination side depressions.

ic packaging progression

Surface Mount

CSP / WLP

(CSP = Chip Scale Package, WLP = Wafer Level Package)

IC Packaging Progression:

Through Hole

TSOP

  • 25 mil pitch
  • Limited by perimeter leads

CSP/WLP

  • Area array 0.8 mm to 0.5 mm
  • Limited by substrate wiring
  • 100 mil pitch
  • Limited by through hole spacing
fujitsu supercsp
Fujitsu SuperCSP

Redistribution

Trace (Cu)

SiN

Al Pad

  • Solder balls on copper posts
  • Redistribution wiring to posts
  • Encapsulant is molded onto wafer

Polyimide Layer

Die

Encapsulant

Barrier Metal

Solder Ball

Metal Post (Cu)

slide47

Wafer Level Packaging Will Become Std

Density

VOLUME

  • Chip Scale
  • CSP
  • Wafer Level
  • Stacked Die
  • SiP
  • Surface Mount
  • QFP
  • TSOP
  • SOJ
  • BGA
  • Thru Hole
  • DIP
  • Pin Grid

1960

1980

2000

YEAR

slide48

10000

Flip-Chip Underfill+

µProcessor

0.25 mm grid

HDI

PWB

1000

0.5 mm grid

ASICs

DRAM

Pins (#)

100

SRAM

Flash

Passives

Analog ICs

10

Power ICs

Discretes

1

1

10

100

1000

Die Area (mm2)

waste electrical and electronic equipment weee restrictions on hazardous substances rohs

Waste Electrical and Electronic Equipment (WEEE)Restrictions on Hazardous Substances (RoHS)

European Community Directives 2002/95/EC & 2002/96/EC

Will impact global electronics industry (incl USA)

slide51

“This symbol indicates that the waste of electrical and electronic

equipment must not be disposed as unsorted municipal waste and must be

collected separately. Please contact t

he manufacturer or other authorized

disposal company to decommission your equipment.”

WEEE

Directive 2002/96/EC “on Waste Electrical and Electronic Equipment“

  • Producers must take back waste electronic equipment from collection points
  • Financing:
    • Producers/Importers are responsible for financing and treatment of waste equipment from private households (which includes most small businesses)
      • Product sales can show a visible fee for up to 10 years
    • Producers and users others than private households may conclude agreements stipulating other financing methods
  • Products have to be marked with the brand of the producer, recycling symbol & date
  • Producers must provide specific disassembly information for treatment facilities
  • Targets are set in the directive for reuse, recovery and recycling (ex. Medical)
  • Producers/Importers have to be registered with local systems
  • Member states have to report on the targets; so record keeping required

Labeling Must Include the WEEE Symbol and Guidance Info

Date of manufacture: month / year

Typical Guidance Statement for Industrial Equipment

slide52

WEEE Regulated Materials and Devices

  • 1) Polychlorinated biphenyls (PCB) containing capacitors in accordance with Council Directive 96/59/EC of 16 September 1996 on the disposal of polychlorinated biphenyls and polychlorinated terphenyls (PCB/PCT) (1).
  • 2) Mercury containing components, such as switches or backlighting lamps,
  • 3) Batteries Including,
    • Lithium batteries
    • Alkali-Manganese batteries
    • Dry cell batteries
    • Nickel-cadmium rechargeable batteries
    • Lead rechargeable batteries
    • Silver round cell batteries
  • 4) Printed circuit boards of mobile phones generally, and of other devices if the surface of the printed circuit board is greater than 10 square centimeters.
  • 5) Toner cartridges, liquid and pasty, as well as color toner.
  • 6) Plastic containingbrominated flame retardants.
  • 7) Asbestos waste and components which contain asbestos.
slide53

WEEE Regulated Materials and Devices

  • 8) Cathode ray tubes
  • 9) Refrigerant including chlorofluorocarbons, hydrochlorofluorocarbons, hydrofluorocarbons & hydrocarbons
  • 10) Gas discharge lamps such as halogen, neon, xenon, etc
  • 11) Liquid crystaldisplays (together with their casing where appropriate) of a surface greater than 100 square centimeters and all those back-lighted with gas discharge lamps
  • 12)External electric cables
  • 13)Components containingrefractory ceramic fibers as described in Commission Directive 97/69/EC of 5 December 1997 adapting to technical progress Council Directive 67/548/EEC relating to the classification, packaging and labeling of dangerous substances (2).
  • 14) Components containingradioactive substances (except components below exemption thresholds set in Art. 3 of and Annex I to Directive 96/29/Euratom of 13 May 1996 laying down basic safety standards for the protection of the health of workers and the general public against the dangers arising from ionizing radiation (3)) .
  • 15) Electrolytic capacitors containing substances of concern (height > 25 mm, diameter > 25 mm or proportionately similar volume) .
weee implementation difficulties
Member States can expand the equipment list

Producers will be accountable for records of annual mass of each restricted substance shipped into each EC country

But conflicts among accounting firms on how to reserve for WEEE obligations, some countries may charge up-front

Firms may have to pay into a deposit system;

and reserve for a contingent liability

Some European wide associations being formed to manage WEEE

But member states have strong incentive to keep all waste in their system to maximize fee income

Definition of “producer” is problematic

What happens if distributors ship equipment from one member state to another? Who is responsible as the “producer”?

WEEE Implementation Difficulties
slide55

Recycling Passport

Master Recycling Passport

03/2003

Edition:

1

Page

1

of 4

1

Editor / Department

Model Type xxx

WEEE requires special identification of waste for recycling or special handling

Example: Agfa Copier

(Operator Manual)

(

Type Number

File:

++49 89 6207-3681 / FAX: ++49 89 6207-7140

2003.03.04_rp neu.doc

mailto:[email protected]

1. General view of the device

8

6

5

4

11

2

7

3

12

9

10

1

13

slide56

Restriction of Hazardous Substances

RoHS

SJ

P.R.C. Electronic Industry Standards

SJ╳╳╳—200╳

Marks of Preventing and Controlling Pollution by Electronic Information Products and Marking Requirements

Promulgated on 200╳-╳╳-╳╳ Effective as of 200 ╳-╳╳-╳╳

Promulgated by PRC Ministry of Information Industry

China RoHS

Key Elements

Product Labeling

Substance Limit Table

IPC 1752 Material Declaration

Packaging Labeling

slide57

1. Labeling

Logo 1: Labeling for RoHS compliant product

China RoHS Compliance: Comply to EU 1000PPM for all substances except Cadmium at 100PPM (Homogenous Substance Limits)

No Exemptions Allowed

Logo 2: Labeling for RoHS non-compliant product

Number indicates Environmental Protection Use Period – Period in years that worst case substance remains user safe (Operating lifetime of the product unless maintenance items have non-compliance)

slide58

For products whose Hazardous Substance concentration exceeds limits, in addition to Symbol 2, the names and contents of hazardous substances shall be specified in instruction brochure

  • Example of the table is shown below:

Hazardous Substance exceeds MCV limit

(i.e. contained)

Hazardous Substance is below MCV limit

(i.e. not contained)

The Table shall be in Chinese. The height of Chinese characters, numbers and alphabetical [symbols] used in the marking should not be smaller than 1.8 mm.

2. Over-Under Table

slide59

Producers or importers shall follow the material codes prescribed in GB 18455-2001 (Packaging Recycling Marks) to indicate what material is used in the packaging. The packaging material codes shall be marked on the packages of the products.

  • Table of Packaging Material Codes

3. Marking of Packaging Materials

slide60

EU RoHS

Directive 2002/95/EC “on the Restriction of certain Hazardous Substances in Electrical and Electronic Equipment“ (ROHS)

Requirements:

Covered Equipment put on the market after July 1, 2006 is not allowed to contain (1000PPM mass or less in homogenious materials, 100PPM or less for Cd):

  • Lead
  • Mercury
  • Cadmium
  • Hexavalent Chromium (used mostly for corrosion protection)
  • Polybrominated Biphenyls (PBB) or
  • Polybrominated Diphenyl ethers (PBDE) (flame retardants)

Limited, but critical exemptions (medical devices for example)

slide61

2012? – Med Devices

2006 – Products/Industries

  • DI Products (X-Ray, MR, CT, etc.)
  • Patient Monitoring
  • EKG, Lab Eq, Dialysis
  • Large household appliances
  • Small household appliance
  • IT and telecommunications equipment
  • Consumer equipment
  • Lighting equipment
  • Electrical and electronic tools
  • Toys, leisure and sports equipment
  • Automatic dispensers

Category 8 and 9 Exclusions May End 2012

pb free replacement solder properties

AlloyComposition

LiquidusTemp. (ºC)

Reflow Temp. (ºC)

MeltingRange#(ºC)

Sn-37Pb (63% Tin, 37% Lead)

176-183

Sn-3.5Ag

221

240 – 250

Sn-0.7Cu

227

245 – 255

Sn-3.0Ag-0.5Cu*

220**

238 – 248

Sn-3.2Ag-0.5Cu

218

238 – 248

217-218

Sn-3.5Ag-0.75Cu*

218

238 – 248

Sn-3.8Ag-0.7Cu

220**

238 – 248

217-210

Sn-4.0Ag-0.5Cu

217-219

Sn-4.0Ag-1.0Cu*

220**

238 – 248

217-220

Sn-4.7Ag-1.7Cu*

244**

237 – 247

Sn-5Sb

232-240

Sn-0.2Ag-2Cu-0.8Sb*

285**

246 - 256

226-228%

Sn-2.5Ag-0.8Cu-0.5Sb*

225

233 – 243

Sn-2Ag-7.5Bi*

216**

220 – 230

Sn-3Ag-3Bi*

218**

233 – 243

Sn-3Ag-5Bi*

216**

230 – 240

Sn-3.4Ag-4.8Bi*

215**

225 – 235

200-216

Sn-3.5Ag-3Bi*

217**

230 – 240

Sn-3.2Ag-1.1Cu-3Bi*

240**

230 – 240

Sn-3.5Ag-3In-0.5Bi*

215**

230 – 240

Sn-3Bi-8Zn

189-199

Pb Free Replacement Solder Properties

200-220

**V. Solberg, "No-Lead Solder for CSP: The Impact of Higher Temperature SMT Assembly Processing," Proc. NEPCON West 2000 Conf. (Feb. 28 - Mar. 2, 2000) Anaheim, CA (Source: Indium Corp.)#N.-C. Lee, "Lead-Free Chip-Scale Soldering of Packages," Chip Scale Review, March-April 2000*Many of the above are Patented compositions; may require licensing or royalty agreements before use.

new pb free materials new failure modes
New Pb Free Materials  New Failure Modes
  • Metal Migration
  • Voltage-Humidity Stresses
  • Migration, Tin Whiskers
  • PCB VIA Cracking
  • Thermal Cycling Stress
  • PCB Insulation Material
  • High Density Interconnect Failures
  • Voiding in Solder Joints, Underfills
  • Crack Propagations
  • Compromising Reliability
covered equipment
Covered Equipment

Categories of electrical and electronic equipment covered by

RoHS, Annex IA

Large household appliances

Small household appliances

IT and telecommunications equipment

Consumer equipment

Lighting equipment

Electrical and electronic tools (with the exception of large-scale stationary industrial tools)

Toys, leisure and sports equipment

Medical devices (with the exception of all implanted and infected products)

Monitoring and control instruments

Automatic dispensers

Not currently in scope of EU Directive

slide67

RoHS Definition of “Equipment“ falling into scope

Equipment, which:

  • Is dependent on electric current or electromagnetic fields in order to work properly (electric current or electromagnetic fields as primary energy), and equipment for the generation, transfer and measurement of such currents and fields, and
  • Is covered by the categories set out in annex I A, and
  • is listed in annex I B (examples for the categories), and
  • Is designed for use with a voltage rating not exceeding 1000 Volt for alternating current and 1500 Volt for direct current, and
  • Is not a product which is intended for specifically military purposes, and
  • Is not part of another type of equipment that does not fall under the scope of the directive
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