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April 2008. Laird Technologies MMP. The Laird Group PLC Overview. Founded in mid 1800’s Headquartered in London, UK Quoted on the London Stock Exchange (symbol LARD) and a member of the FTSE 250 index Employer of 10,000+ people in North America, Europe and Asia

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slide1

April 2008

Laird Technologies MMP

slide2

The Laird Group PLC Overview

  • Founded in mid 1800’s
  • Headquartered in London, UK
  • Quoted on the London Stock Exchange (symbol LARD) and a member of the FTSE 250 index
  • Employer of 10,000+ people in North America, Europe and Asia
  • 2006 revenue of approximately $1200 million
laird technologies
Founded in mid 1990’s

Headquartered in St. Louis, Missouri, USA

Annual revenue almost $1B dollars

Over 10,000 employees globally in engineering, manufacturing and sales

Industry Business Units:

Handset

Automotive

Datacom

I&I

Consumer

Laird Technologies
slide4

Worldwide Locations

50 sites around the world

10,000 employees

Not all sites are represented in this graphic. Some sites are close together

slide5

Family Tree

1996

1998

2000

2002

2004

2006

Magnes

slide6

The Laird Technologies Mission

“To be the leader in design and supply

of customized performance-critical

products for wireless and other

advanced electronics applications.”

revenue distribution
Revenue Distribution

Revenue by Origin

Revenue by Destination

slide9

Strategy

  • Technology leadership in all products offered
  • Direct support for global and large OEM programs
  • Broad market coverage
  • Broad product line within business units
  • Local manufacturing and engineering
  • Low cost producer of high volume products
  • Add complementary product lines

global solutions: local support

slide10

Core Competencies

  • Bias for action – speed of response
  • Global footprint
  • Key customer access and relationships
  • Broad product line to same customers
  • Ability to bundle technology – “convergence products”
  • RF design
  • Identifying, buying, integrating niche segments of high margin, customized electronics components and systems
topics today
MMP (Mobile Metal Products)

Handset Products

Technologies

Manufacturing Sites

Program Support Structure

Topics Today
slide13
Mobile Metal Products

Board Level Shielding

Combo Products

Decorative / Visual Metals

MAP (Hinges)

MMP
technical characteristics board level shielding
Technical CharacteristicsBoard Level Shielding
  • Surface Mount Shield Options
  • 2 Piece pre-assembled frame and cover (Tin Plate CRS not available as cover will reflow to frame)
  • 2 Piece system surface mount frame with manually installed cover
  • Multi-Compartmental Shields replace multiple single shields
  • 1 Piece Surface Mount Shields
    • Formed and Drawn technologies
  • 1 Piece Shield w/ Tear-Away Feature (EZ Peel / Pop-Top)
  • Surface Mount Clips with BLS and MIP shield (EcE and TPE types)
materials used for bls
Tin Plated Cold Rolled Steel (CRS) – Cheapest option

Nickel Silver

Stainless Steel Tin Plated

Tin Plate Phos bronze

ALL materials used are RoHs compliant

Materials used for BLS
cellular handsets
Board Interface contacts

Shielding of various functions

Cellular Handsets
emi product portfolio
Surface Mount Contact (SMC) – Standard or Custom DesignsEMI Product Portfolio

FEA of Design

Standard Contacts Packaged in Tape and Reel for Automatic Placement on SMT Lines

Custom Contacts Packaged in Tape and Reel for Automatic Placement on SMT Lines

Custom Contacts

slide18

BLS Manufacturing Technology Objectives

-Deliver High Quality Parts at the Lowest Cost

  • Match system productivity to program size
  • Implement Technologies that maximize yields
  • In-line and In-Die secondary operations
  • Technologies to reduce material usages
  • Real-time Quality Assurance and Quality Control
  • Match tool life to program size (15m to 100m)
slide19

System Approach

  • Feeder
  • Press
  • Washer
  • Labeling
  • Inspection
  • Packaging
  • Other automated operations
  • Laser welding
  • Tapping
  • Pin insertion
  • Assembly
slide20

In-die and In-Line Assembly

In-die Assy.

  • 100-300 pieces/min.
  • High die Cost
  • Carbide technology
  • 8-12 week tool lead-time
  • >98% yield
  • >50m die life

In-line Assy.

  • 100-180 pieces/min.
  • Low die cost
  • Modular
  • 4 week tool lead-time
  • >96% yield
  • >15m die life
combo products
Combo Products
  • Combo (MCS) Drawn Frames with Molding [TPE or Conductive Silicone]
  • LT has the internal ability to produce complex metal stampings and insert molded parts.
  • Molding can be TPE or EcE

Simulation of Draw Forming

Drawn Part

Molded Part

slide24

Chicago, IL. (Business Development)

Stockholm, Sweden (Business Development)

Liberec, Czech Republic (Manufacturing)

Tianjin, China (Manufacturing BLS and Combo)

Reynosa, Mexico

Shanghai, China (Business Development, Manufacturing)

Chennai, India (BLS Manufacturing)

San Jose, CA (Business Development)

Shenzhen, China (Business Development, Manufacturing Decorative Metals)

what is a decorative metal
Exterior metals to a customer application.

Typically has a class 1 finish.

May be plated, colored, etch, etc.

Provides ASTHETIC appeal to end customer product

Can also be an enclosure for the application

What is a decorative metal?
areas of technology development
Metal Bases

SS stamping/drawing

Al stamping/drawing

Electroforming

Ti stamping/drawing

Die casting

Extrusions

Decorative Finishing Technologies

Laser decoration

Electro-polish

Anodizing

Diamond cutting

Plasma Vapor Deposition of metals and finishes

Electro-deposition

Chrome, Gold, other platings

Painting

Ni/Cr free coatings

Areas of Technology Development

ALL Possible either internal or through supply

slide28

Visual Metals

Key

LT- Current

LT - Vendor

LT- Planned 2008

Simple Decoration

Sand Blast

Core Decoration Tech.

Laser decoration

PVD

PVD

MAM

Core Tech.

Stainless Steel

Aluminum

Titanium

Mg Die-cast

Polishing

Painting

Painting

Painting

Anodizing

Anodizing

Gold

plating

Laser welding

Photo

Etch

Mesh forming

Electro-polish

Diamond cutting

Silver

plating

Electro deposition

Chrome

plating

Hairline

brush

Teflon coating

visual metal hinge market roadmap
Visual Metal & Hinge Market Roadmap

1H08

2H08

1H09

2H10

Computing

Platforms

Handset

Network

Infrastructure

Digital

Imaging

additional colors

Additional “colors”

Process: Sus304 BA, stamping, polishing, PVD (Black, Silver, golden)

decorative metals3
LCD Flip Retainer

Part is:

Stamped from stainless steel

Electro polished

Selectively colored electro coated (selectivity allows for surface conductivity of grounding finger).

Decorative Metals

back side

speaker mesh
Speaker mesh

Wire mesh plus Chrome plating

slide44

Speaker Details

Photo Etching, secondary forming, electro polishing

speaker mesh1
Speaker mesh

Wire mesh plus Chrome plating

sim tray
SIM Tray

Stamping + ED coating + laser etching

camera bezel

Camera Bezel

Process: SUS316L,stamping, Photo Etching, stamping, electro polishing, Etch.

display bezel

Display Bezel

Process: Sus304 BA, stamping, polishing, PVD (Black), Laser.

slide50
Mechanical Actuated Products

Hinges provides handheld devices the ability to fold, rotate or slide to allow access to screens or keypads. These capabilities are key aspects to allow these devices to become smaller now and in the future

MAP comes from 2007 Acquisition of M2Sys, a Korean company.

MAP
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