April 2008
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April 2008. Laird Technologies MMP. The Laird Group PLC Overview. Founded in mid 1800’s Headquartered in London, UK Quoted on the London Stock Exchange (symbol LARD) and a member of the FTSE 250 index Employer of 10,000+ people in North America, Europe and Asia

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April 2008

Laird Technologies MMP


The Laird Group PLC Overview

  • Founded in mid 1800’s

  • Headquartered in London, UK

  • Quoted on the London Stock Exchange (symbol LARD) and a member of the FTSE 250 index

  • Employer of 10,000+ people in North America, Europe and Asia

  • 2006 revenue of approximately $1200 million


Laird technologies

Founded in mid 1990’s

Headquartered in St. Louis, Missouri, USA

Annual revenue almost $1B dollars

Over 10,000 employees globally in engineering, manufacturing and sales

Industry Business Units:

Handset

Automotive

Datacom

I&I

Consumer

Laird Technologies


Worldwide Locations

50 sites around the world

10,000 employees

Not all sites are represented in this graphic. Some sites are close together


Family Tree

1996

1998

2000

2002

2004

2006

Magnes


The Laird Technologies Mission

“To be the leader in design and supply

of customized performance-critical

products for wireless and other

advanced electronics applications.”


Revenue distribution
Revenue Distribution

Revenue by Origin

Revenue by Destination



Strategy

  • Technology leadership in all products offered

  • Direct support for global and large OEM programs

  • Broad market coverage

  • Broad product line within business units

  • Local manufacturing and engineering

  • Low cost producer of high volume products

  • Add complementary product lines

global solutions: local support


Core Competencies

  • Bias for action – speed of response

  • Global footprint

  • Key customer access and relationships

  • Broad product line to same customers

  • Ability to bundle technology – “convergence products”

  • RF design

  • Identifying, buying, integrating niche segments of high margin, customized electronics components and systems


Serving a diverse range of leading global companies
Serving a Diverse Range of Leading Global Companies


Topics today

MMP (Mobile Metal Products)

Handset Products

Technologies

Manufacturing Sites

Program Support Structure

Topics Today


Mobile Metal Products

Board Level Shielding

Combo Products

Decorative / Visual Metals

MAP (Hinges)

MMP


Technical characteristics board level shielding
Technical CharacteristicsBoard Level Shielding

  • Surface Mount Shield Options

  • 2 Piece pre-assembled frame and cover (Tin Plate CRS not available as cover will reflow to frame)

  • 2 Piece system surface mount frame with manually installed cover

  • Multi-Compartmental Shields replace multiple single shields

  • 1 Piece Surface Mount Shields

    • Formed and Drawn technologies

  • 1 Piece Shield w/ Tear-Away Feature (EZ Peel / Pop-Top)

  • Surface Mount Clips with BLS and MIP shield (EcE and TPE types)


Materials used for bls

Tin Plated Cold Rolled Steel (CRS) – Cheapest option

Nickel Silver

Stainless Steel Tin Plated

Tin Plate Phos bronze

ALL materials used are RoHs compliant

Materials used for BLS


Cellular handsets

Board Interface contacts

Shielding of various functions

Cellular Handsets


Emi product portfolio

Surface Mount Contact (SMC) – Standard or Custom Designs

EMI Product Portfolio

FEA of Design

Standard Contacts Packaged in Tape and Reel for Automatic Placement on SMT Lines

Custom Contacts Packaged in Tape and Reel for Automatic Placement on SMT Lines

Custom Contacts


BLS Manufacturing Technology Objectives

-Deliver High Quality Parts at the Lowest Cost

  • Match system productivity to program size

  • Implement Technologies that maximize yields

  • In-line and In-Die secondary operations

  • Technologies to reduce material usages

  • Real-time Quality Assurance and Quality Control

  • Match tool life to program size (15m to 100m)


System Approach

  • Feeder

  • Press

  • Washer

  • Labeling

  • Inspection

  • Packaging

  • Other automated operations

  • Laser welding

  • Tapping

  • Pin insertion

  • Assembly


In-die and In-Line Assembly

In-die Assy.

  • 100-300 pieces/min.

  • High die Cost

  • Carbide technology

  • 8-12 week tool lead-time

  • >98% yield

  • >50m die life

In-line Assy.

  • 100-180 pieces/min.

  • Low die cost

  • Modular

  • 4 week tool lead-time

  • >96% yield

  • >15m die life



Combo products
Combo Products

  • Combo (MCS) Drawn Frames with Molding [TPE or Conductive Silicone]

  • LT has the internal ability to produce complex metal stampings and insert molded parts.

  • Molding can be TPE or EcE

Simulation of Draw Forming

Drawn Part

Molded Part



Chicago, IL. (Business Development)

Stockholm, Sweden (Business Development)

Liberec, Czech Republic (Manufacturing)

Tianjin, China (Manufacturing BLS and Combo)

Reynosa, Mexico

Shanghai, China (Business Development, Manufacturing)

Chennai, India (BLS Manufacturing)

San Jose, CA (Business Development)

Shenzhen, China (Business Development, Manufacturing Decorative Metals)



What is a decorative metal

Exterior metals to a customer application.

Typically has a class 1 finish.

May be plated, colored, etch, etc.

Provides ASTHETIC appeal to end customer product

Can also be an enclosure for the application

What is a decorative metal?


Areas of technology development

Metal Bases

SS stamping/drawing

Al stamping/drawing

Electroforming

Ti stamping/drawing

Die casting

Extrusions

Decorative Finishing Technologies

Laser decoration

Electro-polish

Anodizing

Diamond cutting

Plasma Vapor Deposition of metals and finishes

Electro-deposition

Chrome, Gold, other platings

Painting

Ni/Cr free coatings

Areas of Technology Development

ALL Possible either internal or through supply


Visual Metals

Key

LT- Current

LT - Vendor

LT- Planned 2008

Simple Decoration

Sand Blast

Core Decoration Tech.

Laser decoration

PVD

PVD

MAM

Core Tech.

Stainless Steel

Aluminum

Titanium

Mg Die-cast

Polishing

Painting

Painting

Painting

Anodizing

Anodizing

Gold

plating

Laser welding

Photo

Etch

Mesh forming

Electro-polish

Diamond cutting

Silver

plating

Electro deposition

Chrome

plating

Hairline

brush

Teflon coating


Visual metal hinge market roadmap
Visual Metal & Hinge Market Roadmap

1H08

2H08

1H09

2H10

Computing

Platforms

Handset

Network

Infrastructure

Digital

Imaging




Process: surface cutting. SUS304 BA, stamping, electro polishing, selective Hairline.


Process: surface cutting. SUS304 BA, stamping, polishing, Hairline, PVD, Laser marking.


Process: surface cutting. SUS304 BA, stamping, electro polishing, selective Hairline.


Process: surface cutting. SUS304 BA, stamping, 3 coatings, soft touch.


Decorative metals1

Laser Coloring on Stainless Steel surface cutting.

Decorative Metals


Decorative metals2

Complex Forming surface cutting.

Electro Polishing

Decorative Metals


Additional colors

Additional “colors” surface cutting.

Process: Sus304 BA, stamping, polishing, PVD (Black, Silver, golden)


Decorative metals3

LCD Flip Retainer surface cutting.

Part is:

Stamped from stainless steel

Electro polished

Selectively colored electro coated (selectivity allows for surface conductivity of grounding finger).

Decorative Metals

back side





Speaker mesh
Speaker mesh + PVD

Wire mesh plus Chrome plating


Speaker Details + PVD

Photo Etching, secondary forming, electro polishing


Speaker mesh1
Speaker mesh + PVD

Wire mesh plus Chrome plating


Sim tray
SIM Tray + PVD

Stamping + ED coating + laser etching


Camera bezel

Camera Bezel + PVD

Process: SUS316L,stamping, Photo Etching, stamping, electro polishing, Etch.


Display bezel

Display Bezel + PVD

Process: Sus304 BA, stamping, polishing, PVD (Black), Laser.



Mechanical Actuated Products + PVD

Hinges provides handheld devices the ability to fold, rotate or slide to allow access to screens or keypads. These capabilities are key aspects to allow these devices to become smaller now and in the future

MAP comes from 2007 Acquisition of M2Sys, a Korean company.

MAP


Locations
Locations + PVD


R d hinges
R&D Hinges + PVD


R&D + PVD


Questions
Questions + PVD


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