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Description of the instrument Philosophy approach Subsystems development plan

EUSO-BALLOON DESIGN REVIEW, 18.12.2012, CNES TOULOUSE. Development Plan. Guillaume Prévôt APC, Paris. Description of the instrument Philosophy approach Subsystems development plan. Description of the instrument. Optical Bench (OB) Instrument Booth (IB).

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Description of the instrument Philosophy approach Subsystems development plan

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  1. EUSO-BALLOON DESIGN REVIEW, 18.12.2012, CNES TOULOUSE Development Plan • Guillaume Prévôt APC, Paris • Description of the instrument • Philosophy approach • Subsystemsdevelopment plan

  2. Description of the instrument Optical Bench (OB) Instrument Booth (IB) The EUSO Balloon instrument consisting of a three lenses system, a Focal plane with its electronics, referred as the PDM, and the flight electronics: The EusoBalloonpayload The EusoBalloon ‘carambola’ Development Plan

  3. Description of the instrument • The architecture of the EUSO-BALLOON payload is characterized by a Scientific Instrument that is also the balloon gondola. • All components and subsystems will be integrated into the optical bench (OB) and instrument booth (IB) in CNES Clean room. • In order to allow for recovery at sea, the "instrument-booth" will be entirely watertight by using the lens-3-assembly as a watertight porthole. • Most of the components are commercial, off-the-shelf. Some components are military grade. No ITAR components are used. Development Plan

  4. Philosophy approach of our development plan • TheEUSO-BALLOON instrument is a PFM (Proto Flight Model). Some subsystems having a critical design may require the development of EM (Engineering Model). • For the standard part, the FM (Flight Model) will be directly produced. • EUSO-Balloon instrument is identical or similar to the JEM-EUSO instrument: the international partners within the JEM-EUSO collaboration contribute to the instrument according to their corresponding tasks and responsibilities in JEM-EUSO, under the management and responsibility of the French team, which acts in coordination with the JEM-EUSO management. • TheEUSO-BALLOON development plan has not changed. • We just did the modification / additions that CNES asked for during the PRR: • - 3.2 Description of the instrument • - 5.4 Telescope system chapter • - 5.5 Infrared Camera chapter • - 5.5.7 Addition of a new software chapter • - 5.8 Addition of a summarized thermal tests table Development Plan

  5. EC_Unit Development Plan • The EC_Unit Development Plan: • EC-Dynode board • EC-Anode board • EC_HV & HV Cockroft Walton • EC-ASIC board • MAPMTs procurement Development Plan

  6. EC_Unit Development Plan • The EC_Unitprototypes: • Mechanical prototype : potted by MATRA • Electrical prototype (non potted) : the analog signals from 1 channel/MAPMT were checked (with oscilloscope) and found satisfactory. • Potting of the electrical prototype in progress. Will be re-tested latedecember 2012. Development Plan

  7. PDM Board Development Plan • The PDM Board Development Plan: • EC-Dynode board • EC-Anode board • EC_HV & HV Cockroft Walton • EC-ASIC board • MAPMTs procurement Development Plan

  8. CPU Board Development Plan • The CPU Development Plan: • A prototype of the CPU has been realized in the INFN Naples laboratory. • The CPU, inserted in a prototype of the DP box has been tested in Vacuum chamber together with a prototype of the CLK board and a of the GPS receiver. • A perfect replica of the prototype realized will be manufactured as FM. Development Plan

  9. Clock board development Plan • The Clock board Development Plan: • A prototype of the CLK board has been already developed by INFN Napoli JEM EUSO group. • Pre-integration with CPU and CCB • A perfect replica of the prototype realized will be manufactured as FM. Development Plan

  10. CCB Development Plan • The CCB Development Plan: • A prototype of the CCB board has been already developed by IAAT • Pre-integration with CPU: SpaceWire communication with CPU is working stable • Communication tests with PDM Board are in progress. • A perfect replica of the prototype realized will be manufactured as FM. Development Plan

  11. HK Development Plan • The HK boards Development Plan: • Prototypes have been already developed by UNAM. • Thermal tests have been done • It was tested in stand alone and communication tests with the others subsystems were done in Naples early November • A perfect replica of the prototype realized will be manufactured as FM. • Software relatedto DP interfaces will be advancedduringtheintegration. Development Plan

  12. Lenses Development Plan • The lenses Development Plan (from mid December 2012 to August 2013): Development Plan

  13. The Software Development Plan • The Software Development Plan: • - design and development of the configuration parameters storage and deployment into the various blocks, up to the end of December 2012; • - extensive tests, debug and optimization of the low level backbone, up to the second week of January 2013; • - development of the handling of the message from the balloon control, from the second week of January 2013 up to the end of March 2013; • - development of the user interface with the run control, from the second week of January 2013 up to the end of March 2013; • - extensive tests, debug, bottleneck fixes from March 2013 up to delivery to CNES; Development Plan

  14. IRCam Development Plan • The IRCam Development Plan: • A Flight Model will be directly built. • The thermal/vacuum side of this model will be tested at InstitutoNacional de TecnicaAeroespacial (INTA) facilities. • Testing will begin as soon as the instrumentation is received (CPU, IR detector…), and then it will be tested 2013 the complete system on April 2013. • Electrical assembly tests will be done at Orbital-Aerospace (prime contractor) facilities on March 2013. • The flight hardware will withstand the environmental requirements and its operation is assured by thermal active and passive devices. The thermal/vacuum tests and validation will be carried out at INTA facilities on April 2013. Development Plan

  15. Thermal tests • From Mid December to mid January, thermal tests (temperatures, low pressure) will be done for DP subsystems. • ASICs and FPGAs of PDM will be tested at differents temperatures. • WORK IN PROGRESS Development Plan

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