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Front-end circuit with deep-submicron FD-SOI Hirokazu Ikeda [email protected] Institute of space and astronautical science Japan aerospace exploration agency. H.Ikeda, K.Hirose, H.Hayakawa, Y.Kasaba, T.Takashima, T.Takahashi, H.Tomita JAXA.

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Front-end circuit with deep-submicron FD-SOIHirokazu [email protected] of space and astronautical scienceJapan aerospace exploration agency

H.Ikeda, K.Hirose,

H.Hayakawa, Y.Kasaba,

T.Takashima, T.Takahashi,



Y.AraiA, Y.IkegamiA, H.UshirodaA, Y.UnnoA, O.TajimaA, T.TsuboyamaA, S.TeradaA, M.HazumiA, K.HaraB, H.IshinoC, T.KawasakiD, G.VernerE, E.MartinE, H.TajimaF

KEKA, U.TsukubaB, TITC, Niigata UD, U. HawaiiE, SLACF

6th FEE meeting @Perugia, Italy



Employing a 0.15-um fully depleted SOI process from OKI, we are developing front-end circuits for radiation detectors in collaboration with JAXA, KEK and related universities.

SOI devices are free from parasitic PNPN structure, and, hence, intrinsically immune to the single event latch-ups. Moreover SOI devices are located on a very thin silicon layer,the energy deposit by impinging particle is relatively small, and, then, the single event upsets and/or single-event transients are manageable with an appropriate design strategy. Utilizing these benefits, space agencies have been employing SOI devices for their spacecrafts.

The application area has been, however, virtually restricted in data processing and telecommunications.

When designing front-end circuits with the FD-SOI, we can take benefits such as small floating-body effect, superior sub-threshold characteristics and small temperature coefficient as well as common nature of SOI devices, i.e. small parasitic capacitance, low junction leakage, decrease in substrate coupling noise, and reduction of silicon area. In order to confirm these benefits and to identify possible issues concerning front-end circuits with FD-SOI, we have submitted a small design to OKI via the multi-chip project service of VDEC, the university of Tokyo. The design includes charge sensitive preamplifier circuits with exponential and linear decay configurations, and a trans-impedance amplifier with an active feedback configuration. There also included are comparators with a limiting amplifier scheme. The initial test results and future plan for development are presented in this talk.

6th FEE meeting @Perugia, Italy


Team organization


Possible application

for solar system exploration,

and deep-space observation

Possible application for

Super-B, SLHC, ILC and

material science

H.Ikeda, K.Hirose,

H.Hayakawa, Y.Kasaba,

T.Takashisma, T.Takahashi,



Y.AraiA, Y.IkegamiA, H.UshirodaA, Y.UnnoA, O.TajimaA, T.TsuboyamaA, S.TeradaA, M.HazumiA, K.HaraB, H.IshinoC, T.KawasakiD, G.VernerE, E.MartinE, H.TajimaF

KEKA, U.TsukubaB, TITC, Niigata UD, U. HawaiiE, SLACF

6th FEE meeting @Perugia, Italy


Contents for talk

  • Introduction
  • TEG fabrication
  • Circuit and operation
  • Towards radiation-hardness assurance
  • Conclusion

6th FEE meeting @Perugia, Italy


1. Introduction

Entering into late 1990\'s, the trend curve of a bulk CMOS

process tends to go behind the Moore\'s law, and, hence,

the manufactures are eager to find a way to recover

development speed.

There exists a general trend :

Post-scaling technology…..SOI/SOS, strained-Si,

3D-tr, Cu, High-k, Low-k…..

SOI CMOS is then revisited to

reveal its performance over an existing bulk CMOS;

the SOI CMOS eventually shows up as a successor

of the CMOS process inheriting well-matured fabrication

technologies for a bulk CMOS.

・Full dielectric isolation: Latchup free, Small area

・Low jucntion capacitance: High speed, Low power

・Low leakage, low Vth shift: High Temp. application

・High soft error immunity: Rad-hard application

6th FEE meeting @Perugia, Italy



Kink effect



6th FEE meeting @Perugia, Italy


0.15-um FD-SOI

Processed by Oki Elec. Ind. Co., Ltd

SOI: 50 nm, BOX: 200 nm,


Vdd: 1.0 V(core)/1.8 V(I/O),

Vth: 0.18(n)/-0.25(p) for LVT

Metal: 5-layers, Capacitor: MIM

Option: Thick metal for inductors

2. TEG fabrication

4,5,6 inch wafer,


6,8 inch wafer

Mass production

JAXA/MHI route

(0.2 um)

c/o K.Hirose

VDEC route(0.15 um)

VLSI design & education center,

The university of Tokyo

KEK route

(0.15 um W/ pixel implant)

c/o Y.Arai



6th FEE meeting @Perugia, Italy


In order to identify possible issues when applied

for analog FE circuits…….

2.4 mm

Charge amplifier

TOT amplifier-1

TOT amplifier-2

Trans-impedance amplifier

6th FEE meeting @Perugia, Italy


3. Circuit and operation

nMOS (LVT) input

Id=100-500 uA

W/L=5/0.5 M=360

Cox*W*L=12.5 pF

gm= 11.5 mS

6th FEE meeting @Perugia, Italy


Short decay

Long decay


The leakage current of the FB

circuit determines the slowest decay.

6th FEE meeting @Perugia, Italy


Good dynamic range

500 mV

200 mV

Noise slope is too large!



Shot noise dominant

Adjustment to balance

leakage current

6th FEE meeting @Perugia, Italy


4 fC

40 fC


6th FEE meeting @Perugia, Italy


Pulse width is sensitive to the leakage current

associated with the ESD pad!

The leakage current is adjusted by moving the VSS voltage for the ESD pad.


6th FEE meeting @Perugia, Italy


Small overshoot

4 fC

40 fC


Small overshoot as expected

6th FEE meeting @Perugia, Italy


Large dynamic range

6th FEE meeting @Perugia, Italy


-8 fC

8 fC


D/A interference is very severe.

6th FEE meeting @Perugia, Italy


4. Towards radiation-hardness assurance

Total dose:radiation hard? Not necessarily the case for gate edge

and/or BOX.

H-gate, Enclosed gate: ready to use

Double gate: No effect from BOX

Single event(SEU,SET): radiation hard? Not necessarily the case.

TCAD simulation

is in progress

6th FEE meeting @Perugia, Italy


As a first step…..



6th FEE meeting @Perugia, Italy


5. Conclusion

  • FD-SOI analog front-end circuits are examined under a joint effort
  • of JAXA , KEK and related institutes as a part of the SOI-pixel detector
  • development and/or future solar system/deep-space exploration.
  • The FD-SOI TEG circuits are proved to work even with very low
  • Vdd voltage thanks to stable low threshold transistors.
  • 3) Minor issues are identified, and fixed to be submitted to the second
  • MPW run.
  • Radiation hardness is still an issue to be examined carefully in terms
  • of total dose and single event.
  • 5) Road-map for the SOI technology is on the way of the post-scaling
  • technology, which conforms with application in a harsh environment
  • in space and high energy physics.

6th FEE meeting @Perugia, Italy