1 / 28

ECE 477 Design Review Team 8(SLOW)  Spring 2006

ECE 477 Design Review Team 8(SLOW)  Spring 2006. Ayush,Varun,Randall, Bank. Outline. Project overview Project-specific success criteria Block diagram Component selection rationale Packaging design Schematic and theory of operation PCB layout Software design/development status

jadon
Download Presentation

ECE 477 Design Review Team 8(SLOW)  Spring 2006

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. ECE 477 Design Review Team 8(SLOW)  Spring 2006 Ayush,Varun,Randall, Bank

  2. Outline • Project overview • Project-specific success criteria • Block diagram • Component selection rationale • Packaging design • Schematic and theory of operation • PCB layout • Software design/development status • Project completion timeline • Questions / discussion

  3. Project Overview • Designing an LED panel by cascading 10 5x7 LED dot matrices. • A built in embedded server on the microcontroller to edit/display text messages on the LED panel via a website. • Scrolling feature to display long text messages. • Allows users to display the outdoor temperature using a temperature sensor. • Display current time using a highly accurate internal clock.

  4. Project-Specific Success Criteria • Ability to display ASCII character strings on an LED matrix. • Ability to save messages and configuration data in non-volatile memory. • Ability to measure and display the outdoor temperature. • Ability to display the current time (based on highly accurate internal clock). • Ability to configure display and edit messages via an embedded server.

  5. SLOW Block Diagram

  6. Component Selection Rationale Microcontroller : Must have a timer module for the clock, a ATD port for the temperature sensor, built in ethernet controller, PWM module. Choices : Freescale MC9S12NE64CPV • 80 pin package, 38 I/O pins and 10 input only • 64K of FLASH memory • ATD ports • Timer Module • A IEEE 802.3 compliant ethernet controller Rabbit RCM 3750 • 33 I/O pins • Built in Ethernet Controller • 512K of FLASH memory We decided with the MC9S12NE64CPV as it has a low cost, easily attainable and has a enough number of input output pins. Also, the MC9S12NE64CPV has good documentation as compared to the Rabbit microcontroller.

  7. Component Selection Rationale LED Driver Toshiba TB62708 with a 16 bit shift register and latching ability • Low cost • Programmable Output current from 5mA to 90mA • Current sourcing device We required a 12 bit shift register for our design but we could only find current sinking ones. ULN2003A Darlington Array • 16 Bit package • Sinks upto 500mA of current( our sink current came upto 105mA) • Recommended by our TA Brian as used by him for one of his LED projects RJ45 Jack • Recommended by the microcontroller data sheet

  8. Packaging Design Considerations : • LED’s panel is big enough and can be seen from a distance of up to 30 feet. • Aluminum Case • Weight estimation : around 3.4 lbs and mountable on a wall. • Dimension is 17” x 4” x 3”

  9. Packaging Design – 3D view

  10. Packaging Design – Front

  11. Packaging Design - Bottom

  12. Schematic/Theory of Operation

  13. Schematic/Theory of Operation

  14. Schematic/Theory of Operation

  15. Schematic/Theory of Operation

  16. Schematic/Theory of Operation

  17. Schematic/Theory of Operation • Total Parts : 88 17 Capacitors 2 Diodes 25 Resistors 3 Switches 1 crystal 10 LED drivers 10 Darlington transistors 2 Inductors 10 LED displays 1 Microcontroller 2 Power Regulators 1 RJ-45 1 BDM 1 Header 1 Temperature Sensor 1 12V Power Adapter

  18. PCB Layout – Whole Layout

  19. PCB Layout – Top Layer

  20. PCB Layout – Bottom Layer

  21. PCB Layout - Microcontroller

  22. PCB Layout - Microcontroller

  23. PCB Layout – Power

  24. PCB Layout – Shift Register and transistors

  25. PCB Layout – RJ45

  26. Software Design/Development Status • All programming and decoding will be done on the Microcontroller • Even without the PCB, MC9S12NE64 Development board can be used to write code  and test our components. • LED matrices are driven by column therefore making it possible to control text scrolling.

  27. Project Completion Timeline • Week 8 (This week) – Finalize PCB / Design Review • Week 9 – Start Software Development / Final PCB Modification • Week 10 – Testing hardware / Continue Software Development • Week 11 – Continue Software Development / Testing PCB Functionality • Week 12 – Finalize Software / Debugging • Week 13 – Packaging / Testing / Debugging • Week 14 – Final Tweaking • Week 15 – Documentation / Prepare for Final Presentation • Week 16 – Final Presentation

  28. Questions / Discussion

More Related