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Intro, BCC, HSIO,Cables

Intro, BCC, HSIO,Cables. Carl Haber 9-24-2010. Intro. Topics for later discussion Sessions for Nov AUW A working meeting in Jan? Where? DC-DC stavelet ! Status of BCC and V3 order Status of HSIO orders Re-cap of mechanical mtg @ LBL Measurements on bus cables. BCC.

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Intro, BCC, HSIO,Cables

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  1. Intro, BCC, HSIO,Cables Carl Haber 9-24-2010

  2. Intro • Topics for later discussion • Sessions for Nov AUW • A working meeting in Jan? Where? • DC-DC stavelet ! • Status of BCC and V3 order • Status of HSIO orders • Re-cap of mechanical mtg @ LBL • Measurements on bus cables

  3. BCC • Main issue with BCC has been asymmetry of 80 MHz DCLK output (s-s-s-l) • Various studies have indicated that this is due to unequal capacitive loading of digital delay generation circuit. • A number of surgery’s have been done but have not conclusively confirmed this. Tests are pending on the most recent surgery so perhaps will have a confirmation soon. • Plan is for a V3 submission on Oct 4, 320 chips • Meanwhile V2 has been used on a full stavelet so some adjustment of operating parameters is possible • Plan also for transmission line tests using full size THERMO cables

  4. HSIO • ~20 new boards have been assembled, shipments are beginning now • New interface board, 1st article has been tested and works, rest to be loaded and tested starting now • 15 additional EOS cards have been made, parts are on order, these are for stave building and module testing • Standalone s/w tools for testing and temperature, full system – Matt’s talk

  5. Cables • Our bus cable vendor has improved in-house capabilities • New batch of stavelet cables fabricated with better results on gold surface quality • New batch of Thermo&Mirrored full length cables fabricated • In use for co-curing tests • Detailed metrology performed

  6. 98 mm

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