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Solver Enhancements in MPI 6.0

Solver Enhancements in MPI 6.0. Table of Contents. Release Theme and Objectives 3D Flow Solver Enhancements 3D Solvers Speed Enhancements Midplane/Fusion Solver Accuracy Enhancements New Results Capability Interfaces to Structural CAE Conclusion.

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Solver Enhancements in MPI 6.0

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  1. Solver Enhancements in MPI 6.0

  2. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • 3D Solvers Speed Enhancements • Midplane/Fusion Solver Accuracy Enhancements • New Results Capability • Interfaces to Structural CAE • Conclusion

  3. Release Theme and Objectives (partial list) • Improve capacity • Improve accuracy • Compress Project Turnaround Times • Improve user productivity • Improve solver speed • Facilitate Product Integration • Interfaces to structural analysis software • DAS - MMS Link Beginning

  4. Release Theme and Objectives (partial list) • New Solver Features • Simulate part insert overmolding (Midplane/Fusion) • Remelt Zone in overmolding (3D) • Cause of Warpage (3D) • Internal mold temperatures • Stress result on deformed core/mold • Validation • Increased emphasis for Validation • Dedicated Validation Engineer to generate high quality data internally • Publishable Beginning

  5. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • Speed Accuracy Inertia Effects Overmolding • 3D Solvers Enhancements • Midplane/Fusion Solver Accuracy Enhancements • New Results Capability • Interfaces to Structural CAE • Conclusion

  6. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • Speed Accuracy Inertia Effects Overmolding • 3D Solvers Enhancements • Midplane/Fusion Solver Accuracy Enhancements • New Results Capability • Interfaces to Structural CAE • Conclusion

  7. Increase Solver Speed – 3D Coupled Flow Solver • Coupled Navier-Stokes 3D Flow solver • Developed as part of the “Hybrid” solver project • Benefits: • Predicted temperature, pressure and flow patterns are more accurate than current solver • Faster than current (segregated) 3D flow solver • Despite delivering greater accuracy • Used with 3D tetrahedral and 1D beam elements • Entirely new code base • Object Oriented • Easily extensible for new technologies and features • Eventual unification of flow codes Beginning

  8. Increase Solver Speed – 3D Coupled Flow Solver • Coupled Navier-Stokes 3D Flow solver • Supports all current features • Fiber, Gas-assist and core shift • Reactive, Microchip and Underfill Encapsulation • Inertia and Gravity effects • Part insert and 2-shot sequential overmolding • Supports both 1D Beam and 3D Tetrahedral elements • New features • Air traps result • Simulate gas penetration in 1D Beam elements • Jetting flow at gates Beginning

  9. Increase Solver Speed – 3D Coupled Flow Solver Beginning

  10. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • Speed Accuracy Inertia Effects Over-molding • 3D Solvers Enhancements • Midplane/Fusion Solver Accuracy Enhancements • New Results Capability • Interfaces to Structural CAE • Conclusion

  11. Improve Solver Accuracy - 3D Flow analysis • Our previous methods have used a segregated solution of the velocity & pressure solution • Slow to converge due to iterations for velocity / pressure coupling • New Coupled Navier-Stokes 3D Flow: • Fully coupled matrix of velocity & pressure • Gives a more accurate velocity solution • Improved convection for temperature solution • Able to show jettings flows • Faster analysis Beginning

  12. Improve Solver Accuracy - 3D Flow analysis • MPI 5.0 3D flow solver is mesh sensitive • Can result in asymmetric filling pattern on a symmetric part MPI 5.0 3D Flow MPI 4.1 Mesh => Uneven filling Model courtesy of BASF, USA & Borg-Warner Automotive Beginning

  13. Improve Solver Accuracy - 3D Flow analysis • MPI 5.1 3DMeshing enhancements and Temperature bug fixes improved quality of result MPI 5.1 3D Flow MPI 5.1 mesh => Even filling Model courtesy of BASF, USA & Borg-Warner Automotive Beginning

  14. Improve Solver Accuracy - 3D Flow analysis • New Coupled Navier-Stokes 3D Flow less sensitive to mesh variations New Coupled 3D Flow MPI 4.1 mesh => Even filling Beginning Model courtesy of BASF, USA & Borg-Warner Automotive

  15. Improve Solver Accuracy - 3D Flow analysis • Often observe imbalance in symmetric part • Due to shear heating - convection pattern Beginning

  16. Improve Solver Accuracy - 3D Flow analysis • Often observe imbalance in symmetric part • Due to shear heating - convection pattern Beginning

  17. Improve Solver Accuracy - 3D Flow analysis • Shear imbalance depends on injection rate • Slower injection rates results in opposite imbalance due to cooling effect Beginning

  18. Improve Solver Accuracy - 3D Flow analysis • Slow injection rate Beginning

  19. Improve Solver Accuracy - 3D Flow analysis • Polymer drooling flow • Air entrapment at bottom Beginning

  20. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • Speed Accuracy Inertia Effects Over-molding • 3D Solvers Enhancements • Midplane/Fusion Solver Accuracy Enhancements • New Results Capability • Interfaces to Structural CAE • Conclusion

  21. New Coupled 3D Flow - Inertia effects • Polymer jetting flow • Causes flow marks on surface • Polymer jet buckles, touches mold and cools Beginning

  22. New Coupled 3D Flow - Inertia effects • Comparison with experiment: Wax Jet study Beginning

  23. New Coupled 3D Flow - Inertia effects • Honey dripping Beginning

  24. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • Speed Accuracy Inertia Effects Over-molding • 3D Solvers Enhancements • Midplane/Fusion Solver Accuracy Enhancements • New Results Capability • Interfaces to Structural CAE • Conclusion

  25. Remelt Zone Result in 3D Overmolding Analyses • Result will be available for 2 shot sequential overmolding and polymer part insert overmolding processes • Result highlights areas of the first shot/part insert which have been reheated to more than its solidification temperature • Significance is to warn that smearing of the first material into the second material will occur Beginning

  26. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • 3D Solvers Speed Enhancements • 3D Warp Solver AMG Total • Midplane/Fusion Solver Accuracy Enhancements • New Results Capability • Interfaces to Structural CAE • Conclusion

  27. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • 3D Solvers Speed Enhancements • 3D Warp Solver AMG Total • Midplane/Fusion Solver Accuracy Enhancements • New Results Capability • Interfaces to Structural CAE • Conclusion

  28. Increase Solver Speed – 3D Warp Solver • Mesh aggregation for warpage (structural) analysis • Reduce memory usage (Increase capacity!) • Reduce computation time • More accurate than first order elements on 6 layer mesh • Results are equivalent to 6 layer results for shell parts • Retain 6 layer (minimum) refinement for Flow solver • Resolve temperature, shear rate and viscosity gradients • Resolve fiber orientation variation through thickness • Shrinkages are based on 6+ layer flow analysis result Beginning

  29. Increase Solver Speed – 3D Warp Solver Cable tie, unfilled material 720 min (12 hrs) 618 MBytes 201 min (3.3 hrs) 250 Mbytes Model courtesy of Hager, Germany Beginning

  30. Increase Solver Speed – 3D Warp Solver Fiber filled material 152 min 260 Mbytes 28 min 90 Mbytes Model courtesy of Rhodia Engineering Plastics Beginning

  31. Increase Solver Speed – 3D Warp Solver Fiber filled material X Alternative: 6 layer solution with first order tetra gives 60% error in displacement range Model courtesy of Rhodia Engineering Plastics Beginning

  32. Increase Solver Speed – 3D Warp Solver Mesh aggregation speed up Beginning

  33. Increase Solver Speed – 3D Warp Solver • Increased capacity for Warp3d analysis to approx. 3.5 million elements on a 64 bit OS with 4 Gbyte RAM. • Larger models possible with more RAM • Windows64 version of MPI 6.0 • Mesh aggregation provides an average: • Memory usage reduced to 40% • 5 times decrease in solution time Beginning

  34. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • 3D Solvers Speed Enhancements • 3D Warp Solver AMG Total • Midplane/Fusion Solver Accuracy Enhancements • New Results Capability • Interfaces to Structural CAE • Conclusion

  35. 3D Warp Speed Improvement - AMG • Algebraic Multi Grid (AMG) • Can be used on unstructured (tri/tetra) meshes • Condense the full matrix into a coarser matrix • Can solve the coarser matrix very quickly • Use the coarse solution as an initial guess for the fine solution • Overall solution time can be reduced for ill-conditioned matrices which are slow to converge • Moldflow has licensed an AMG matrix solver from Allied Engineering (Japan) Beginning

  36. 3D Warp Speed Improvement - AMG • Construction of the coarse grid • Only the solid dots (nodes) are carried into the coarse layer Beginning

  37. 3D Warp Speed Improvement - AMG • Algebraic Multi Grid (AMG) Matrix solver in 3D Warp • The matrix solution is currently the major part of the total 3D Warp solution time. • ill-conditioned matrix • Total solution time reduced by 7.5 times • Primary target is 3D Warp solver • Extended to Midplane/Fusion Warp in the future • May also extend use to 3D Flow solver in the future • Supported on all Windows and 64bit platforms • Memory usage doubled • No additional assumption, loss of accuracy Beginning

  38. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • 3D Solvers Speed Enhancements • 3D Warp SolverAMG Total • Midplane/Fusion Solver Accuracy Enhancements • New Results Capability • Interfaces to Structural CAE • Conclusion

  39. 3D Warp Speed Improvement - Total • Warp 3D combine: • AMG matrix solution • Mesh Aggregation • Compared to MPI 5.1 • 37 times speed up • 80% memory reduction Beginning

  40. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • 3D Solvers Speed Enhancements • Midplane/Fusion Solver Accuracy Enhancements • Thin-wall molding Runner Pressure Drop Fiber SolverWarp Solver • New Results Capability • Interfaces to Structural CAE • Conclusion

  41. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • 3D Solvers Speed Enhancements • Midplane/Fusion Solver Accuracy Enhancements • Thin-wall molding Runner Pressure Drop Fiber SolverWarp solver • New Results Capability • Interfaces to Structural CAE • Conclusion

  42. Improve Solver Accuracy – Thin-wall Molding • Improve flow simulation accuracy with thin-wall molding • Correct selection of Mold-melt heat transfer coefficient is significant in thin-wall molding • Literature shows that heat transfer coefficient is higher during filling • Use independent values for heat transfer during filling, packing and once cavity pressure is zero • New default values lower than previous default • Filling: 5000 W/m^2-C • Packing: 2500 W/m^2-C • Detached: 1250 W/m^2-C Beginning

  43. Improve Solver Accuracy – Thin-wall Molding • Improve flow simulation accuracy with thin-wall molding • Notes: • For very thin parts, predicted time to cool will be longer, injection pressure will be lower • Less false short shot predictions • For typical parts (>1 mm), time to cool and injection pressure will not change significantly • Detached HTC value (cavity pressure is zero) can be set asymmetrically for the cavity side and core side. • Can specify a HTC profile (cavity/core) Beginning

  44. Improve Solver Accuracy – Thin-wall Molding • Apparent Heat Transfer Coefficient measure during molding cycle • Delaunay, Le Bot et al. Poly.Eng.Sci 40 (1682-1691) • TCR is inverse of HTC Beginning

  45. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • 3D Solvers Speed Enhancements • Midplane/Fusion Solver Accuracy Enhancements • Thin-wall molding Runner Pressure Drop Fiber SolverWarp Solver • New Results Capability • Interfaces to Structural CAE • Conclusion

  46. Improve Solver Accuracy – Runner Pressure Drop • Improve runner pressure drop prediction for Midplane/Fusion models • Improve shear heating calculation with more integration points • Results in less shear heating temperature rise • Higher injection pressure prediction for models with significant shear heating • Lower cavity pressures during packing • Use entrance pressure model (C1/C2) for tapered beams • Previous only used for abrupt contractions • Higher injection pressure for models with tapered contractions in beam elements Beginning

  47. Improve Solver Accuracy – Runner Pressure Drop MPI 5.1 MPI 6.0 36MPa 42MPa =>Measured Inj Pressure: 49MPa Beginning Measured data courtesy of Delphi Research Labs

  48. Table of Contents • Release Theme and Objectives • 3D Flow Solver Enhancements • 3D Solvers Speed Enhancements • Midplane/Fusion Solver Accuracy Enhancements • Thin-wall moldingRunner Pressure Drop Fiber SolverWarp Solver • New Results Capability • Interfaces to Structural CAE • Conclusion

  49. Improve Solver Accuracy – Fiber Solver • Modification of Auto-Ci and Auto-Dz values for Midplane and Fusion Fiber Orientation analysis • New values based on testing over a range of validation testing with research partners and customers (some confidential) • Change is progressively more significant for part thickness above 2-3 mm • No significant change for thinner parts Beginning

  50. Improve Solver Accuracy – Fiber Solver • Measured fiber orientation data provided by BASF USA and Germany • 2mm, 3mm & 4mm plaques Images courtesy of BASF Beginning

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