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FEE + ROC cooling

FEE + ROC cooling. S. Popescu CERN, U. Frankenfeld, H.R. Schmidt GSI. Lauda System. PUMP. Lauda System. IROC in Thermal Box + 4 FEC (3.1). Inside: Sensors on pad plane. T8. T8. T9. T10. T13. T7. T5. T6. T11. T12. IROC. ~10cm. ~10cm. T14. T15. FEC.

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FEE + ROC cooling

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  1. FEE + ROC cooling S. Popescu CERN, U. Frankenfeld, H.R. Schmidt GSI

  2. Lauda System PUMP Lauda System IROC in Thermal Box + 4 FEC (3.1) Inside: Sensors on pad plane T8 T8 T9 T10 T13 T7 T5 T6 T11 T12 IROC ~10cm ~10cm T14 T15 FEC Separate cool. circuits for chamber + FEC Sensors on FEC cool. plates TPC meeting

  3. Thermal Box T=21 ˚C Cooling In IN Cooling Out FEC PS Chamber cool. T=21˚C Temp sensors TPC meeting

  4. IROC Chamber Cooling circuit T9 T10 T11 T12 4 FEC (3.1) ~10.5 W/card (3.2: ~6.9 W/card) Input Cooling circuit Output Cooling circuit TPC meeting

  5. ELMB PT1000 two wire sensors connected Can Bus port TPC meeting

  6. Cooling plate Inner screws T14 TPC meeting

  7. Single card w/o inner screws LV OFFLV ON ΔT~5.5 ˚C ΔT cooling plates TPC meeting

  8. Card w/o inner screws in set-up LV ONLV OFF ΔT~4 ˚C ΔT cooling plates TPC meeting

  9. Single card with all screws All screws in ΔT cooling plates ΔT ~1 ˚C TPC meeting

  10. Chamber cooling Cc offCooling circuit on ~ 50 minutes chamber Pad TPC meeting

  11. All circuits 21˚C Chamber 21 -> 19.5 ˚C Chamber cooling pads ΔT ~1.5 ˚C chamber chamber cooling TPC meeting

  12. All circuits 21˚C Gradients on the pad plane Chamber cooling pad under FEC pad ΔT ~0.08 ˚C TPC meeting

  13. Heat transfer to pad plane Pad under FEC LV OFFLV ON ΔT ~0.18˚C Δt ~ 30 min TPC meeting

  14. Chamber 21˚C FEE cooling 19˚C Thermal box 21˚C Heat transfer with cable LV ON | LV OFF pad Heat transfer: ~0.19˚C pad under FEC TPC meeting

  15. Chamber 21˚C FEE cooling 19˚C Thermal box 21˚C Heat transfer without cable LV ON | LV OFF pad Heat transfer: ~0.15˚C pad under FEC TPC meeting

  16. Compensation 19-24 ˚C LV OFF LV ON LV OFF FEC cool:T=19 ˚CT=24 ˚C T=19 ˚C T=24 ˚C TPC meeting

  17. Temperature cooling FEE 19->24 ˚C pad under FEC ΔT ~ 0.14˚C pad TPC meeting

  18. Compensate: Switching ON pad under FEC ΔT ~ 0.05˚C pad TPC meeting

  19. Compensate: Switching OFF FEC cool. temperature (scaled) pad under FEC pad TPC meeting

  20. Compensate: Switching OFF pad under FEC ΔT ~ 0.06˚C pad TPC meeting

  21. Compensation (16-21˚C) LV OFF LV ON LV OFF FEC cool: T=21˚C T=16˚C T=21 ˚C TPC meeting

  22. Compensation (16-21˚C) LV ON LV OFF pad under FEC ΔT ~ 0.05˚C pad TPC meeting

  23. Summary + Conclusion • Setup with 4 FEC (Ver. 3.1) 10.5 W per Card • Heat transfer between both sides of cooling plates thru screws: Single sided cooling? • Chamber circuit for stabilization not compensation • Time constant Δt ~ 50 min • Heat transfer FEC -> pads • Time constant Δt ~ 30 min • ~0.19 ˚C with cable • ~0.14 ˚C without cable • Compensation with Cooling temperature per sector • Test setup: Compensation on pads with ΔT ~ 0.05 ˚C TPC meeting

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